DE60227218D1 - Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung - Google Patents

Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

Info

Publication number
DE60227218D1
DE60227218D1 DE60227218T DE60227218T DE60227218D1 DE 60227218 D1 DE60227218 D1 DE 60227218D1 DE 60227218 T DE60227218 T DE 60227218T DE 60227218 T DE60227218 T DE 60227218T DE 60227218 D1 DE60227218 D1 DE 60227218D1
Authority
DE
Germany
Prior art keywords
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60227218T
Other languages
English (en)
Inventor
Mark Kroon
Der Werf Jan Evert Van
Haico Victor Kok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60227218D1 publication Critical patent/DE60227218D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
DE60227218T 2001-06-13 2002-06-11 Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung Expired - Fee Related DE60227218D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01202274 2001-06-13

Publications (1)

Publication Number Publication Date
DE60227218D1 true DE60227218D1 (de) 2008-08-07

Family

ID=8180472

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60227218T Expired - Fee Related DE60227218D1 (de) 2001-06-13 2002-06-11 Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

Country Status (4)

Country Link
US (2) US6747282B2 (de)
JP (1) JP2003068637A (de)
KR (2) KR100597044B1 (de)
DE (1) DE60227218D1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6828542B2 (en) 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US6759297B1 (en) 2003-02-28 2004-07-06 Union Semiconductor Technology Corporatin Low temperature deposition of dielectric materials in magnetoresistive random access memory devices
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
EP1762898A3 (de) * 2003-05-09 2007-03-28 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
WO2005036627A1 (en) * 2003-10-03 2005-04-21 Applied Materials, Inc. Absorber layer for dynamic surface annealing processing
US7109087B2 (en) * 2003-10-03 2006-09-19 Applied Materials, Inc. Absorber layer for DSA processing
US7113255B2 (en) * 2003-12-19 2006-09-26 Asml Holding N.V. Grating patch arrangement, lithographic apparatus, method of testing, device manufacturing method, and device manufactured thereby
US7960209B2 (en) * 2004-01-29 2011-06-14 Diodes, Inc. Semiconductor device assembly process
WO2007001274A2 (en) * 2004-06-21 2007-01-04 3M Innovative Properties Company Patterning and aligning semiconducting nanoparticles
TWI242255B (en) * 2004-07-21 2005-10-21 Touch Micro System Tech Wafer carrier
US7333175B2 (en) * 2004-09-13 2008-02-19 Asml Netherlands, B.V. Method and system for aligning a first and second marker
JP2006278960A (ja) * 2005-03-30 2006-10-12 Canon Inc 露光装置
US7755742B2 (en) * 2005-10-11 2010-07-13 Asml Netherlands B.V. Lithographic apparatus with mounted sensor
US20070115452A1 (en) * 2005-11-23 2007-05-24 Asml Netherlands B.V. Method of measuring the magnification of a projection system, device manufacturing method and computer program product
KR100769124B1 (ko) * 2005-12-28 2007-10-22 동부일렉트로닉스 주식회사 씨모스 이미지 센서 및 그 제조방법
US8975599B2 (en) * 2007-05-03 2015-03-10 Asml Netherlands B.V. Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus
CN102246605B (zh) * 2008-12-16 2013-08-07 株式会社村田制作所 电路模块
NL2004242A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
NL2004322A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Cooling device, cooling arrangement and lithographic apparatus comprising a cooling arrangement.
WO2013139553A2 (en) * 2012-03-20 2013-09-26 Asml Netherlands B.V. Lithographic apparatus, sensor and method
US9618855B2 (en) * 2013-02-11 2017-04-11 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography system and method for mask inspection
WO2015173363A1 (de) * 2014-05-14 2015-11-19 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit feldnahem manipulator
KR20200122665A (ko) 2019-04-18 2020-10-28 삼성전자주식회사 진공 챔버용 계측 장치, 및 그 계측 장치를 포함한 계측 시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585342A (en) 1984-06-29 1986-04-29 International Business Machines Corporation System for real-time monitoring the characteristics, variations and alignment errors of lithography structures
JP3181050B2 (ja) 1990-04-20 2001-07-03 株式会社日立製作所 投影露光方法およびその装置
US5265143A (en) 1993-01-05 1993-11-23 At&T Bell Laboratories X-ray optical element including a multilayer coating
US5767523A (en) 1997-04-09 1998-06-16 Svg Lithography Systems, Inc. Multiple detector alignment system for photolithography
JP3810039B2 (ja) * 1998-05-06 2006-08-16 キヤノン株式会社 ステージ装置
US6360012B1 (en) 1999-06-25 2002-03-19 Svg Lithography Systems, Inc. In situ projection optic metrology method and apparatus

Also Published As

Publication number Publication date
KR20060024455A (ko) 2006-03-16
US6747282B2 (en) 2004-06-08
KR20020094898A (ko) 2002-12-18
US20040211922A1 (en) 2004-10-28
KR100597044B1 (ko) 2006-07-04
US6888151B2 (en) 2005-05-03
JP2003068637A (ja) 2003-03-07
US20030001107A1 (en) 2003-01-02
KR100592570B1 (ko) 2006-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee