DE60127267D1 - Verfahren und gerät zur fehlerentdeckung für ein bearbeitungswerkzeug und steuerung dafür mit einer forgeschrittenen prozesssteuerungsstruktur (apc) - Google Patents

Verfahren und gerät zur fehlerentdeckung für ein bearbeitungswerkzeug und steuerung dafür mit einer forgeschrittenen prozesssteuerungsstruktur (apc)

Info

Publication number
DE60127267D1
DE60127267D1 DE60127267T DE60127267T DE60127267D1 DE 60127267 D1 DE60127267 D1 DE 60127267D1 DE 60127267 T DE60127267 T DE 60127267T DE 60127267 T DE60127267 T DE 60127267T DE 60127267 D1 DE60127267 D1 DE 60127267D1
Authority
DE
Germany
Prior art keywords
troubleshooting
apc
controlling
process control
control structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127267T
Other languages
English (en)
Other versions
DE60127267T2 (de
Inventor
Elfido Coss Jr
Qingsu Wang
Terrence J Riley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24521470&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60127267(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE60127267D1 publication Critical patent/DE60127267D1/de
Application granted granted Critical
Publication of DE60127267T2 publication Critical patent/DE60127267T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32209—Stop production line
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32221—Correlation between defect and measured parameters to find origin of defect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
  • Measuring Fluid Pressure (AREA)
  • Testing And Monitoring For Control Systems (AREA)
DE60127267T 2000-07-31 2001-07-03 Verfahren und gerät zur fehlerentdeckung für ein bearbeitungswerkzeug und steuerung dafür mit einer forgeschrittenen prozesssteuerungsstruktur (apc) Expired - Lifetime DE60127267T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US629073 2000-07-31
US09/629,073 US6725402B1 (en) 2000-07-31 2000-07-31 Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework
PCT/US2001/021159 WO2002010873A2 (en) 2000-07-31 2001-07-03 Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (apc) framework

Publications (2)

Publication Number Publication Date
DE60127267D1 true DE60127267D1 (de) 2007-04-26
DE60127267T2 DE60127267T2 (de) 2007-12-20

Family

ID=24521470

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60127267T Expired - Lifetime DE60127267T2 (de) 2000-07-31 2001-07-03 Verfahren und gerät zur fehlerentdeckung für ein bearbeitungswerkzeug und steuerung dafür mit einer forgeschrittenen prozesssteuerungsstruktur (apc)

Country Status (9)

Country Link
US (1) US6725402B1 (de)
EP (1) EP1305681B1 (de)
JP (1) JP4977303B2 (de)
KR (1) KR100819190B1 (de)
CN (1) CN100520651C (de)
AU (1) AU2001271800A1 (de)
DE (1) DE60127267T2 (de)
TW (1) TW589691B (de)
WO (1) WO2002010873A2 (de)

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US7082345B2 (en) * 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) * 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6950716B2 (en) * 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US20030037090A1 (en) * 2001-08-14 2003-02-20 Koh Horne L. Tool services layer for providing tool service functions in conjunction with tool functions
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US8180587B2 (en) 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
TWI328164B (en) * 2002-05-29 2010-08-01 Tokyo Electron Ltd Method and apparatus for monitoring tool performance
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
EP1546828A1 (de) * 2002-08-01 2005-06-29 Applied Materials, Inc. Verfahren, system und medium zur handhabung nicht repräsentativer metrologiedaten mit einem erweiterten prozesssteuersystem
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
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WO2004046835A2 (en) 2002-11-15 2004-06-03 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US8359494B2 (en) 2002-12-18 2013-01-22 Globalfoundries Inc. Parallel fault detection
US7205228B2 (en) * 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
WO2005013016A2 (en) * 2003-08-05 2005-02-10 Arie Melul Method and system for real time diagnosis of machine operation
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7363195B2 (en) * 2004-07-07 2008-04-22 Sensarray Corporation Methods of configuring a sensor network
US7680556B2 (en) * 2004-11-15 2010-03-16 Tech Semiconductor Singapore Pte. Ltd. Method for data collection during manufacturing processes
US7277824B1 (en) * 2005-07-13 2007-10-02 Advanced Micro Devices, Inc. Method and apparatus for classifying faults based on wafer state data and sensor tool trace data
US8397173B2 (en) * 2006-01-31 2013-03-12 Advantest (Singapore) Pte Ltd Methods and apparatus using a service to launch and/or monitor data formatting processes
WO2008038710A1 (fr) * 2006-09-28 2008-04-03 Mitsubishi Electric Corporation Détecteur de défauts, procédé et programme de détection de défauts
US7606681B2 (en) * 2006-11-03 2009-10-20 Air Products And Chemicals, Inc. System and method for process monitoring
JP4975605B2 (ja) * 2007-12-26 2012-07-11 東京エレクトロン株式会社 処理システム、処理システムの制御方法およびソフトウェアのバージョンアップ方法
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US9720393B2 (en) * 2012-08-31 2017-08-01 P.C. Automax Inc. Automation system and method of manufacturing product using automated equipment
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Also Published As

Publication number Publication date
KR100819190B1 (ko) 2008-04-04
EP1305681A2 (de) 2003-05-02
JP4977303B2 (ja) 2012-07-18
CN100520651C (zh) 2009-07-29
JP2004505366A (ja) 2004-02-19
KR20030019635A (ko) 2003-03-06
WO2002010873A3 (en) 2002-08-29
WO2002010873A2 (en) 2002-02-07
US6725402B1 (en) 2004-04-20
AU2001271800A1 (en) 2002-02-13
EP1305681B1 (de) 2007-03-14
TW589691B (en) 2004-06-01
DE60127267T2 (de) 2007-12-20
CN1447933A (zh) 2003-10-08

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