DE60126254D1 - Vorrichtung zur wafervorbereitung - Google Patents
Vorrichtung zur wafervorbereitungInfo
- Publication number
- DE60126254D1 DE60126254D1 DE60126254T DE60126254T DE60126254D1 DE 60126254 D1 DE60126254 D1 DE 60126254D1 DE 60126254 T DE60126254 T DE 60126254T DE 60126254 T DE60126254 T DE 60126254T DE 60126254 D1 DE60126254 D1 DE 60126254D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- disposed
- drive
- wafer preparation
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US540097 | 2000-03-31 | ||
US09/540,097 US6328640B1 (en) | 2000-03-31 | 2000-03-31 | Wafer preparation apparatus including rotatable wafer preparation assemblies |
US09/540,975 US6368192B1 (en) | 2000-03-31 | 2000-03-31 | Wafer preparation apparatus including variable height wafer drive assembly |
US540160 | 2000-03-31 | ||
US09/540,160 US6427566B1 (en) | 2000-03-31 | 2000-03-31 | Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same |
US540975 | 2000-03-31 | ||
PCT/US2001/010439 WO2001075942A1 (en) | 2000-03-31 | 2001-03-29 | Wafer preparation apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60126254D1 true DE60126254D1 (de) | 2007-03-15 |
DE60126254T2 DE60126254T2 (de) | 2007-10-25 |
Family
ID=27415315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60126254T Expired - Fee Related DE60126254T2 (de) | 2000-03-31 | 2001-03-29 | Vorrichtung zur wafervorbereitung |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1269522B1 (de) |
JP (1) | JP4846165B2 (de) |
KR (1) | KR100770186B1 (de) |
CN (1) | CN1225769C (de) |
AT (1) | ATE352865T1 (de) |
AU (1) | AU2001251178A1 (de) |
DE (1) | DE60126254T2 (de) |
TW (1) | TW492119B (de) |
WO (1) | WO2001075942A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100796553B1 (ko) * | 2006-06-29 | 2008-01-21 | 두산메카텍 주식회사 | 웨이퍼 표면연마장비의 세정 브러쉬 승하강장치 |
US7962990B2 (en) * | 2008-10-01 | 2011-06-21 | Applied Materials, Inc. | Brush box cleaner module with force control |
US8458843B2 (en) * | 2009-10-22 | 2013-06-11 | Applied Materials, Inc. | Apparatus and methods for brush and pad conditioning |
TWI393204B (zh) * | 2009-11-27 | 2013-04-11 | Au Optronics Corp | 製程機台 |
US9230846B2 (en) * | 2010-06-07 | 2016-01-05 | Veeco Instruments, Inc. | Multi-wafer rotating disc reactor with inertial planetary drive |
CN102074455B (zh) * | 2010-09-03 | 2012-11-14 | 清华大学 | 用于晶圆的刷洗装置 |
CN103008301B (zh) * | 2013-01-11 | 2016-01-20 | 常州市科沛达超声工程设备有限公司 | 晶圆片双面刷洗机 |
US10229842B2 (en) * | 2013-07-26 | 2019-03-12 | Applied Materials, Inc. | Double sided buff module for post CMP cleaning |
CN107931179B (zh) * | 2017-11-15 | 2020-10-02 | 宜都同创光电科技有限公司 | 一种光学玻璃镜片洗前半自动擦油机 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4208760A (en) * | 1977-12-19 | 1980-06-24 | Huestis Machine Corp. | Apparatus and method for cleaning wafers |
US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
JP3044277B2 (ja) * | 1994-12-21 | 2000-05-22 | 信越半導体株式会社 | ウェーハの洗浄及び洗浄乾燥装置 |
JP3278590B2 (ja) * | 1996-08-23 | 2002-04-30 | 株式会社東芝 | 超音波洗浄装置及び超音波洗浄方法 |
US5924154A (en) * | 1996-08-29 | 1999-07-20 | Ontrak Systems, Inc. | Brush assembly apparatus |
US5933902A (en) * | 1997-11-18 | 1999-08-10 | Frey; Bernhard M. | Wafer cleaning system |
JPH11288911A (ja) * | 1997-12-01 | 1999-10-19 | Mitsubishi Materials Corp | 半導体ウェーハ洗浄装置及び半導体ウェーハの製造方法 |
US6070284A (en) * | 1998-02-04 | 2000-06-06 | Silikinetic Technology, Inc. | Wafer cleaning method and system |
JP4007677B2 (ja) * | 1998-04-22 | 2007-11-14 | 信越半導体株式会社 | ブラシ洗浄装置及びワーク洗浄システム |
-
2001
- 2001-03-29 EP EP01924530A patent/EP1269522B1/de not_active Expired - Lifetime
- 2001-03-29 WO PCT/US2001/010439 patent/WO2001075942A1/en active IP Right Grant
- 2001-03-29 AU AU2001251178A patent/AU2001251178A1/en not_active Abandoned
- 2001-03-29 AT AT01924530T patent/ATE352865T1/de not_active IP Right Cessation
- 2001-03-29 KR KR1020027012937A patent/KR100770186B1/ko not_active IP Right Cessation
- 2001-03-29 JP JP2001573525A patent/JP4846165B2/ja not_active Expired - Fee Related
- 2001-03-29 CN CNB018076718A patent/CN1225769C/zh not_active Expired - Fee Related
- 2001-03-29 DE DE60126254T patent/DE60126254T2/de not_active Expired - Fee Related
- 2001-03-30 TW TW090107822A patent/TW492119B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001075942A1 (en) | 2001-10-11 |
JP4846165B2 (ja) | 2011-12-28 |
DE60126254T2 (de) | 2007-10-25 |
CN1225769C (zh) | 2005-11-02 |
ATE352865T1 (de) | 2007-02-15 |
KR20020087438A (ko) | 2002-11-22 |
CN1422438A (zh) | 2003-06-04 |
TW492119B (en) | 2002-06-21 |
AU2001251178A1 (en) | 2001-10-15 |
KR100770186B1 (ko) | 2007-10-25 |
JP2003529929A (ja) | 2003-10-07 |
EP1269522A1 (de) | 2003-01-02 |
EP1269522B1 (de) | 2007-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0845213A3 (de) | Vorrichtung zur Herstellung von Blättern aus Material mit gleichmässiger Dicke und zum Schneiden einzelner Teile daraus | |
EP0900637A3 (de) | Rotationsschneidemaschine | |
ATE352865T1 (de) | Vorrichtung zur wafervorbereitung | |
DE69902208D1 (de) | Wickelmaschine zum Formen von Rollen grossen Durchmessers bahnenförmigen Materials | |
EP1206101A3 (de) | Schalteinrichtung | |
WO2002028580A1 (fr) | Outil de coupe pour fut en tole | |
CN209747463U (zh) | 送膜装置 | |
MY138820A (en) | Method and related apparatus for cutting a product from a sheet material | |
JPS56164549A (en) | Mounting method by positioning | |
CN210233210U (zh) | 一种用于模型设计的高效切割装置 | |
JPS5333493A (en) | Apparatus for processing outer peripheral edge at end part of work | |
CN210651001U (zh) | 一种分切排刀装置 | |
FR2342140A1 (fr) | Calandre a argile ou equivalent | |
JPH03216175A (ja) | 鱗茎用スリッター | |
JP4503757B2 (ja) | ラビングローラの布巻装置 | |
JPH09295822A (ja) | ガラス切断装置 | |
CN218996680U (zh) | 一种晶圆平边器 | |
ES478920A1 (es) | Aparato para revelar plachas de imprimir | |
CN220252391U (zh) | 一种压板装置 | |
CN117772964B (zh) | 一种lcd显示屏制备过程中的屏蔽线切割装置 | |
JPH06155372A (ja) | シート材切断装置 | |
CN218280524U (zh) | 一种方便固定的游戏机座 | |
JPS5928997Y2 (ja) | 圧接ロ−ルの軸受け機構 | |
JP3258449B2 (ja) | 帯状部材の切断方法及び装置 | |
JP3549848B2 (ja) | 古タイヤの切断装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |