DE60124938D1 - Steueurung von laserbearbeitung - Google Patents
Steueurung von laserbearbeitungInfo
- Publication number
- DE60124938D1 DE60124938D1 DE60124938T DE60124938T DE60124938D1 DE 60124938 D1 DE60124938 D1 DE 60124938D1 DE 60124938 T DE60124938 T DE 60124938T DE 60124938 T DE60124938 T DE 60124938T DE 60124938 D1 DE60124938 D1 DE 60124938D1
- Authority
- DE
- Germany
- Prior art keywords
- laser processing
- controlling laser
- increasing
- trough
- machined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Laser Surgery Devices (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE20000865 | 2000-10-26 | ||
IE20000865 | 2000-10-26 | ||
IE20001015 | 2000-12-15 | ||
IE20001022 | 2000-12-15 | ||
IE20001015 | 2000-12-15 | ||
IE20001022 | 2000-12-15 | ||
PCT/IE2001/000136 WO2002034455A1 (en) | 2000-10-26 | 2001-10-26 | Control of laser machining |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60124938D1 true DE60124938D1 (de) | 2007-01-11 |
DE60124938T2 DE60124938T2 (de) | 2007-09-20 |
Family
ID=27270594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60124938T Expired - Lifetime DE60124938T2 (de) | 2000-10-26 | 2001-10-26 | Steueurung von laserbearbeitung |
Country Status (11)
Country | Link |
---|---|
US (1) | US6586707B2 (de) |
EP (1) | EP1328372B1 (de) |
JP (1) | JP2004512690A (de) |
KR (1) | KR100829876B1 (de) |
CN (1) | CN100400215C (de) |
AT (1) | ATE346715T1 (de) |
AU (1) | AU2002210859A1 (de) |
DE (1) | DE60124938T2 (de) |
HK (1) | HK1053999A1 (de) |
IE (1) | IES20010949A2 (de) |
WO (1) | WO2002034455A1 (de) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE323569T1 (de) * | 2001-03-22 | 2006-05-15 | Xsil Technology Ltd | Ein laserbearbeitungssystem und -verfahren |
US6664498B2 (en) * | 2001-12-04 | 2003-12-16 | General Atomics | Method and apparatus for increasing the material removal rate in laser machining |
US7357486B2 (en) | 2001-12-20 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Method of laser machining a fluid slot |
US20030155328A1 (en) * | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
KR101037142B1 (ko) | 2002-04-19 | 2011-05-26 | 일렉트로 사이언티픽 인더스트리즈, 아이엔씨 | 펄스 레이저를 이용한 기판의 프로그램 제어 다이싱 |
JP2003332215A (ja) * | 2002-05-14 | 2003-11-21 | Toshiba Corp | 加工方法、半導体装置の製造方法、及び加工装置 |
CN1276306C (zh) | 2002-05-14 | 2006-09-20 | 株式会社东芝 | 加工方法及半导体器件的制造方法 |
US6960813B2 (en) * | 2002-06-10 | 2005-11-01 | New Wave Research | Method and apparatus for cutting devices from substrates |
US6806544B2 (en) * | 2002-11-05 | 2004-10-19 | New Wave Research | Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
US6580054B1 (en) * | 2002-06-10 | 2003-06-17 | New Wave Research | Scribing sapphire substrates with a solid state UV laser |
US20050023260A1 (en) * | 2003-01-10 | 2005-02-03 | Shinya Takyu | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method |
US6756562B1 (en) * | 2003-01-10 | 2004-06-29 | Kabushiki Kaisha Toshiba | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method |
GB2399311B (en) * | 2003-03-04 | 2005-06-15 | Xsil Technology Ltd | Laser machining using an active assist gas |
US6969822B2 (en) * | 2003-05-13 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Laser micromachining systems |
US7754999B2 (en) | 2003-05-13 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Laser micromachining and methods of same |
GB2404280B (en) | 2003-07-03 | 2006-09-27 | Xsil Technology Ltd | Die bonding |
US7271012B2 (en) * | 2003-07-15 | 2007-09-18 | Control Systemation, Inc. | Failure analysis methods and systems |
US7772090B2 (en) * | 2003-09-30 | 2010-08-10 | Intel Corporation | Methods for laser scribing wafers |
US7893386B2 (en) * | 2003-11-14 | 2011-02-22 | Hewlett-Packard Development Company, L.P. | Laser micromachining and methods of same |
US7098077B2 (en) * | 2004-01-20 | 2006-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor chip singulation method |
JP4868708B2 (ja) * | 2004-03-05 | 2012-02-01 | 日東電工株式会社 | レーザーダイシング・ダイボンド用粘着シート及びこれを用いた半導体装置の製造方法 |
JP4607537B2 (ja) * | 2004-10-15 | 2011-01-05 | 株式会社レーザーシステム | レーザ加工方法 |
GB2420443B (en) * | 2004-11-01 | 2009-09-16 | Xsil Technology Ltd | Increasing die strength by etching during or after dicing |
TWI290500B (en) * | 2004-12-14 | 2007-12-01 | Arima Optoelectronics Corp | Laser dicing apparatus for a silicon wafer and dicing method thereof |
DE102005039833A1 (de) * | 2005-08-22 | 2007-03-01 | Rowiak Gmbh | Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen |
JP5008849B2 (ja) * | 2005-09-08 | 2012-08-22 | ソニーモバイルディスプレイ株式会社 | レーザ加工方法及び透明樹脂層を有する表示装置の製造方法 |
US7863542B2 (en) * | 2005-12-22 | 2011-01-04 | Sony Corporation | Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method |
US20080067160A1 (en) * | 2006-09-14 | 2008-03-20 | Jouni Suutarinen | Systems and methods for laser cutting of materials |
GB2444037A (en) * | 2006-11-27 | 2008-05-28 | Xsil Technology Ltd | Laser Machining |
SG152090A1 (en) * | 2007-10-23 | 2009-05-29 | Hypertronics Pte Ltd | Scan head calibration system and method |
DE102007059987B4 (de) * | 2007-12-11 | 2015-03-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zum keyhole-freien Laserschmelzschneiden mittels vor- und nachlaufender Laserstrahlen |
GB2458475B (en) * | 2008-03-18 | 2011-10-26 | Xsil Technology Ltd | Processing of multilayer semiconductor wafers |
CN102245339B (zh) | 2008-10-10 | 2015-08-26 | Ipg微系统有限公司 | 具有多重细激光束传输系统的激光加工系统和方法 |
US8444850B2 (en) * | 2009-08-17 | 2013-05-21 | Exxonmobil Research And Engineering Company | Operating method for hydrodenitrogenation |
US8330075B2 (en) * | 2009-08-22 | 2012-12-11 | Chung-Shan Institute Of Science And Technology, Armaments Bureau, Ministry Of National Defense | Control method of optical cutting |
TW201143947A (en) * | 2009-12-07 | 2011-12-16 | J P Sercel Associates Inc | Laser machining and scribing systems and methods |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
KR101301318B1 (ko) * | 2010-01-14 | 2013-08-29 | (주)엘지하우시스 | 테두리 가공 장치 및 이를 이용한 단열 복층 유리패널 제조방법 |
TW201134596A (en) * | 2010-04-15 | 2011-10-16 | Epileds Technologies Inc | Laser processing method |
KR20220046706A (ko) * | 2010-10-22 | 2022-04-14 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
US20120132629A1 (en) * | 2010-11-30 | 2012-05-31 | Electro Scientific Industries, Inc. | Method and apparatus for reducing taper of laser scribes |
WO2012155266A1 (en) * | 2011-05-13 | 2012-11-22 | Corporation De L'ecole Polytechnique De Montreal | Reconfigurable modular microfluidic system and method |
WO2013029038A2 (en) | 2011-08-25 | 2013-02-28 | Preco, Inc. | Method and apparatus for making a clean cut with a laser |
US8361828B1 (en) * | 2011-08-31 | 2013-01-29 | Alta Devices, Inc. | Aligned frontside backside laser dicing of semiconductor films |
US8399281B1 (en) * | 2011-08-31 | 2013-03-19 | Alta Devices, Inc. | Two beam backside laser dicing of semiconductor films |
WO2013135703A1 (fr) * | 2012-03-12 | 2013-09-19 | Rolex S.A. | Procédé de gravage d'un élément d'horlogerie et élément d'horlogerie obtenu par un tel procédé |
US20140175067A1 (en) * | 2012-12-20 | 2014-06-26 | Electro Scientific Industries, Inc. | Methods of forming images by laser micromachining |
CN103240526B (zh) * | 2013-05-10 | 2015-06-10 | 中国电子科技集团公司第五十四研究所 | 基于纳米级粒子流的激光打孔方法 |
DE102013212577A1 (de) * | 2013-06-28 | 2014-12-31 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls |
JP6032182B2 (ja) * | 2013-11-18 | 2016-11-24 | トヨタ自動車株式会社 | レーザー加工方法及びレーザー加工装置 |
JP6339661B2 (ja) * | 2014-03-11 | 2018-06-13 | 帝人株式会社 | マーキングされた複合材料およびその製造方法 |
US10401568B2 (en) * | 2014-08-20 | 2019-09-03 | Commscope Technologies Llc | Methods for processing a multi-fiber ferrule using a laser |
US10357848B2 (en) | 2015-01-19 | 2019-07-23 | General Electric Company | Laser machining systems and methods |
US10428415B2 (en) * | 2015-08-10 | 2019-10-01 | Ap Systems Inc. | Method of manufacturing shadow mask using hybrid processing and shadow mask manufactured thereby |
JP6867372B2 (ja) * | 2015-08-26 | 2021-04-28 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザスキャン順序及びガス流れに対する方向 |
JP2017140667A (ja) * | 2016-02-09 | 2017-08-17 | ローランドディー.ジー.株式会社 | マイクロ流路デバイスの作製方法およびマイクロ流路デバイス |
JP6681572B2 (ja) * | 2016-02-26 | 2020-04-15 | 株式会社東京精密 | 搬送ユニット及びプローバ |
JP6705014B2 (ja) * | 2016-06-08 | 2020-06-03 | ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド | サファイアを切断するための方法及び装置 |
JP6769146B2 (ja) * | 2016-07-13 | 2020-10-14 | オムロン株式会社 | レーザ加工方法およびレーザ加工装置 |
JP6955932B2 (ja) * | 2017-08-25 | 2021-10-27 | 株式会社ディスコ | レーザービームプロファイラユニット及びレーザー加工装置 |
CN108031981A (zh) * | 2017-12-18 | 2018-05-15 | 中国科学院西安光学精密机械研究所 | 一种用于曲面结构成形的激光刻蚀方法及装置 |
JP6628939B1 (ja) * | 2018-12-03 | 2020-01-15 | 三菱電機株式会社 | レーザ加工方法およびレーザ加工装置 |
CN109702332B (zh) * | 2019-02-11 | 2022-04-26 | 大族激光科技产业集团股份有限公司 | 偏光片的激光加工方法和激光加工系统 |
JP7296835B2 (ja) | 2019-09-19 | 2023-06-23 | 株式会社ディスコ | ウェーハの処理方法、及び、チップ測定装置 |
JP7368205B2 (ja) * | 2019-12-04 | 2023-10-24 | 浜松ホトニクス株式会社 | レーザ加工装置 |
KR20210132772A (ko) | 2020-04-27 | 2021-11-05 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
JP2022011407A (ja) * | 2020-06-30 | 2022-01-17 | セイコーエプソン株式会社 | 時計用部品の加飾方法、時計用部品、時計用ムーブメント及び時計 |
CN111843237A (zh) * | 2020-07-24 | 2020-10-30 | 广州三义激光科技有限公司 | 一种人工钻石激光切割工艺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7609815A (nl) | 1976-09-03 | 1978-03-07 | Philips Nv | Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze. |
US4705016A (en) * | 1985-05-17 | 1987-11-10 | Disco Abrasive Systems, Ltd. | Precision device for reducing errors attributed to temperature change reduced |
US4914270A (en) | 1988-11-08 | 1990-04-03 | University Of Southern California | Method and apparatus for shaping articles using a laser beam |
US5061342A (en) * | 1990-05-18 | 1991-10-29 | Bausch & Lomb Incorporated | Target domain profiling of target optical surfaces using excimer laser photoablation |
US5214261A (en) * | 1990-09-10 | 1993-05-25 | Rockwell International Corporation | Method and apparatus for dicing semiconductor substrates using an excimer laser beam |
KR970008386A (ko) * | 1995-07-07 | 1997-02-24 | 하라 세이지 | 기판의 할단(割斷)방법 및 그 할단장치 |
US6057525A (en) * | 1995-09-05 | 2000-05-02 | United States Enrichment Corporation | Method and apparatus for precision laser micromachining |
JPH10301052A (ja) * | 1997-05-02 | 1998-11-13 | Sumitomo Heavy Ind Ltd | レーザ加工装置の加工位置ずれ補正方式 |
US6423928B1 (en) * | 2000-10-12 | 2002-07-23 | Ase Americas, Inc. | Gas assisted laser cutting of thin and fragile materials |
-
2001
- 2001-10-26 AT AT01978768T patent/ATE346715T1/de active
- 2001-10-26 EP EP01978768A patent/EP1328372B1/de not_active Expired - Lifetime
- 2001-10-26 CN CNB018179576A patent/CN100400215C/zh not_active Expired - Fee Related
- 2001-10-26 IE IE20010949A patent/IES20010949A2/en not_active IP Right Cessation
- 2001-10-26 WO PCT/IE2001/000136 patent/WO2002034455A1/en active IP Right Grant
- 2001-10-26 DE DE60124938T patent/DE60124938T2/de not_active Expired - Lifetime
- 2001-10-26 US US09/984,086 patent/US6586707B2/en not_active Expired - Lifetime
- 2001-10-26 JP JP2002537486A patent/JP2004512690A/ja active Pending
- 2001-10-26 AU AU2002210859A patent/AU2002210859A1/en not_active Abandoned
- 2001-10-26 KR KR1020037005802A patent/KR100829876B1/ko not_active IP Right Cessation
-
2003
- 2003-08-16 HK HK03105872A patent/HK1053999A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1328372B1 (de) | 2006-11-29 |
EP1328372A1 (de) | 2003-07-23 |
KR100829876B1 (ko) | 2008-05-16 |
IE20010950A1 (en) | 2002-07-10 |
CN1473088A (zh) | 2004-02-04 |
DE60124938T2 (de) | 2007-09-20 |
US6586707B2 (en) | 2003-07-01 |
IES20010949A2 (en) | 2002-07-10 |
JP2004512690A (ja) | 2004-04-22 |
KR20040005850A (ko) | 2004-01-16 |
AU2002210859A1 (en) | 2002-05-06 |
CN100400215C (zh) | 2008-07-09 |
WO2002034455A1 (en) | 2002-05-02 |
HK1053999A1 (en) | 2003-11-14 |
ATE346715T1 (de) | 2006-12-15 |
US20020088780A1 (en) | 2002-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ELECTRO SCIENTIFIC INDUSTRIES, INC., PORTLAND,, US |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: HEYER, V., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 806 |