DE60121910D1 - Drucksensor mit Halbleiter-Sensorchip - Google Patents

Drucksensor mit Halbleiter-Sensorchip

Info

Publication number
DE60121910D1
DE60121910D1 DE60121910T DE60121910T DE60121910D1 DE 60121910 D1 DE60121910 D1 DE 60121910D1 DE 60121910 T DE60121910 T DE 60121910T DE 60121910 T DE60121910 T DE 60121910T DE 60121910 D1 DE60121910 D1 DE 60121910D1
Authority
DE
Germany
Prior art keywords
sensor
semiconductor
pressure sensor
chip
sensor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60121910T
Other languages
English (en)
Other versions
DE60121910T8 (de
DE60121910T2 (de
Inventor
Masahito Imai
Takeshi Shinoda
Hiroaki Tanaka
Yasutoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE60121910D1 publication Critical patent/DE60121910D1/de
Application granted granted Critical
Publication of DE60121910T2 publication Critical patent/DE60121910T2/de
Publication of DE60121910T8 publication Critical patent/DE60121910T8/de
Active legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE60121910T 2000-12-25 2001-11-15 Drucksensor mit Halbleiter-Sensorchip Active DE60121910T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000392792A JP4356238B2 (ja) 2000-12-25 2000-12-25 圧力センサ
JP2000392792 2000-12-25

Publications (3)

Publication Number Publication Date
DE60121910D1 true DE60121910D1 (de) 2006-09-14
DE60121910T2 DE60121910T2 (de) 2007-07-26
DE60121910T8 DE60121910T8 (de) 2008-01-31

Family

ID=18858726

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60121910T Active DE60121910T8 (de) 2000-12-25 2001-11-15 Drucksensor mit Halbleiter-Sensorchip

Country Status (4)

Country Link
US (1) US6578426B2 (de)
EP (1) EP1219941B1 (de)
JP (1) JP4356238B2 (de)
DE (1) DE60121910T8 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2812969B1 (fr) * 2000-08-11 2003-08-01 Thomson Csf Capteur micro-usine avec soudure electrolytique et procede de fabrication
JP4774678B2 (ja) * 2003-08-29 2011-09-14 富士電機株式会社 圧力センサ装置
US7009268B2 (en) * 2004-04-21 2006-03-07 Hewlett-Packard Development Company, L.P. Wheatstone bridge scheme for sensor
JP4839648B2 (ja) * 2005-03-23 2011-12-21 富士電機株式会社 圧力センサ装置
US7270010B2 (en) * 2004-08-27 2007-09-18 Ashcroft-Nagano, Inc. System and method for pressure measurement
JP4421511B2 (ja) * 2005-05-30 2010-02-24 三菱電機株式会社 半導体圧力センサ
JP4466509B2 (ja) 2005-08-25 2010-05-26 株式会社デンソー コモンレール式燃料噴射システムの制御装置
JP2007071821A (ja) * 2005-09-09 2007-03-22 Yamaha Corp 半導体装置
JP2008039760A (ja) * 2006-07-14 2008-02-21 Denso Corp 圧力センサ
US7600433B2 (en) * 2007-02-23 2009-10-13 Silicon Micro Sensors Gmbh Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor
JP4719727B2 (ja) 2007-09-05 2011-07-06 長野計器株式会社 圧力センサの製造方法および圧力センサ
JP2011124344A (ja) * 2009-12-09 2011-06-23 Murata Mfg Co Ltd 素子構造および素子製造方法
JP5877248B2 (ja) * 2012-10-17 2016-03-02 株式会社鷺宮製作所 圧力センサおよび、それを備えるセンサユニット
US20140150560A1 (en) * 2012-11-30 2014-06-05 Robert Bosch Gmbh MEMS Pressure Sensor Assembly with Electromagnetic Shield
DE102013015218A1 (de) * 2013-09-13 2015-03-19 Hella Kgaa Hueck & Co. Gassensor und Kraftfahrzeug mit einem Gassensor
KR101627224B1 (ko) 2014-10-28 2016-06-03 세종공업 주식회사 다기능 포지션 홀더 및 이를 갖춘 커넥터
JP7226385B2 (ja) * 2019-04-26 2023-02-21 長野計器株式会社 圧力センサ
EP3961175A4 (de) * 2019-04-26 2022-06-22 Nagano Keiki Co., Ltd. Drucksensor
EP3832279B1 (de) * 2019-12-06 2023-11-29 Melexis Technologies NV Halbleiterbelastungssensor
USD974193S1 (en) 2020-07-27 2023-01-03 Masimo Corporation Wearable temperature measurement device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354992A (en) 1976-10-28 1978-05-18 Hitachi Ltd Semiconductor strain detector
US4771639A (en) * 1987-09-02 1988-09-20 Yokogawa Electric Corporation Semiconductor pressure sensor
JPH1078363A (ja) 1996-09-03 1998-03-24 Kayaba Ind Co Ltd 薄膜型センサ
JP3697862B2 (ja) 1997-11-06 2005-09-21 株式会社デンソー 圧力検出装置
JPH11351990A (ja) * 1998-04-09 1999-12-24 Fujikoki Corp 圧力センサ
JP2000241273A (ja) 1999-02-23 2000-09-08 Denso Corp 圧力検出装置

Also Published As

Publication number Publication date
US20020078755A1 (en) 2002-06-27
DE60121910T8 (de) 2008-01-31
EP1219941A3 (de) 2003-01-02
JP4356238B2 (ja) 2009-11-04
JP2002195902A (ja) 2002-07-10
EP1219941A2 (de) 2002-07-03
EP1219941B1 (de) 2006-08-02
DE60121910T2 (de) 2007-07-26
US6578426B2 (en) 2003-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition