FR2812969B1 - Capteur micro-usine avec soudure electrolytique et procede de fabrication - Google Patents
Capteur micro-usine avec soudure electrolytique et procede de fabricationInfo
- Publication number
- FR2812969B1 FR2812969B1 FR0010582A FR0010582A FR2812969B1 FR 2812969 B1 FR2812969 B1 FR 2812969B1 FR 0010582 A FR0010582 A FR 0010582A FR 0010582 A FR0010582 A FR 0010582A FR 2812969 B1 FR2812969 B1 FR 2812969B1
- Authority
- FR
- France
- Prior art keywords
- pins
- sensor
- connection pads
- connection
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0010582A FR2812969B1 (fr) | 2000-08-11 | 2000-08-11 | Capteur micro-usine avec soudure electrolytique et procede de fabrication |
PCT/FR2001/002568 WO2002015257A1 (fr) | 2000-08-11 | 2001-08-07 | Capteur micro-usine avec soudure electrolytique et procede de fabrication |
EP01963070A EP1307911A1 (fr) | 2000-08-11 | 2001-08-07 | Capteur micro-usine avec soudure electrolytique et procede de fabrication |
US10/110,065 US6647759B2 (en) | 2000-08-11 | 2001-08-07 | Sensor micro-machined with electrolytic welding and method for making same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0010582A FR2812969B1 (fr) | 2000-08-11 | 2000-08-11 | Capteur micro-usine avec soudure electrolytique et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2812969A1 FR2812969A1 (fr) | 2002-02-15 |
FR2812969B1 true FR2812969B1 (fr) | 2003-08-01 |
Family
ID=8853501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0010582A Expired - Fee Related FR2812969B1 (fr) | 2000-08-11 | 2000-08-11 | Capteur micro-usine avec soudure electrolytique et procede de fabrication |
Country Status (4)
Country | Link |
---|---|
US (1) | US6647759B2 (fr) |
EP (1) | EP1307911A1 (fr) |
FR (1) | FR2812969B1 (fr) |
WO (1) | WO2002015257A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7254986B2 (en) * | 2002-12-13 | 2007-08-14 | General Electric Company | Sensor device for detection of dissolved hydrocarbon gases in oil filled high-voltage electrical equipment |
CN100527372C (zh) * | 2002-12-24 | 2009-08-12 | 株式会社电装 | 半导体传感器及其生成方法 |
JP2004361308A (ja) * | 2003-06-06 | 2004-12-24 | Fuji Electric Device Technology Co Ltd | 物理量検出装置および物理量検出手段格納ケース |
FR2859528B1 (fr) * | 2003-09-09 | 2006-01-06 | Thales Sa | Gyrometre micro-usine a double diapason et a detection dans le plan de la plaque usinee |
FR2860865B1 (fr) * | 2003-10-10 | 2006-01-20 | Thales Sa | Gyrometre micromecanique infertiel a diapason |
FR2862761B1 (fr) * | 2003-11-25 | 2006-02-03 | Thales Sa | Accelerometre differentiel micro-usine multiaxes |
KR101706825B1 (ko) * | 2014-11-13 | 2017-02-27 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 |
CN107919338A (zh) * | 2017-12-20 | 2018-04-17 | 苏州市悠文电子有限公司 | Pcb板led晶片插件组件 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4442716A (en) * | 1982-04-30 | 1984-04-17 | The United States Of America As Represented By The Administrator Of The National Areonautics And Space Administration | Electronic scanning pressure measuring system and transducer package |
US4746893A (en) * | 1985-01-31 | 1988-05-24 | Motorola, Inc. | Pressure transducer with sealed conductors |
US5049421A (en) * | 1989-01-30 | 1991-09-17 | Dresser Industries, Inc. | Transducer glass bonding technique |
US5029478A (en) * | 1990-07-19 | 1991-07-09 | Honeywell Inc. | Fluid isolated self-compensating absolute pressure sensor transducer |
US5290423A (en) * | 1992-04-27 | 1994-03-01 | Hughes Aircraft Company | Electrochemical interconnection |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
FR2722358B1 (fr) | 1994-07-08 | 1996-08-14 | Thomson Csf | Transducteur acoustique multifrequences a larges bandes |
JPH0864938A (ja) * | 1994-08-25 | 1996-03-08 | Sharp Corp | チップ型電子部品の接続方法 |
CH689395A5 (de) * | 1995-03-16 | 1999-03-31 | Alusuisse Lonza Services Ag | Verfahren zur kontinuierlichen anodischen Oxidation von Baendern oder Draehten aus Aluminium. |
US5998864A (en) * | 1995-05-26 | 1999-12-07 | Formfactor, Inc. | Stacking semiconductor devices, particularly memory chips |
JPH095187A (ja) * | 1995-06-21 | 1997-01-10 | Fuji Electric Co Ltd | 半導体圧力センサ |
US5594819A (en) * | 1995-07-26 | 1997-01-14 | Electric Power Research Institute | Field-mountable fiber optic sensors for long term strain monitoring in hostile environments |
JPH10153508A (ja) * | 1996-11-26 | 1998-06-09 | Fuji Electric Co Ltd | 半導体圧力センサ |
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
US5907278A (en) * | 1996-12-17 | 1999-05-25 | Kavlico Corporation | Capacitive sensor assembly with soot build-up inhibiting coating |
JPH1164137A (ja) * | 1997-08-25 | 1999-03-05 | Hitachi Ltd | 半導体圧力センサ |
JP4356238B2 (ja) * | 2000-12-25 | 2009-11-04 | 株式会社デンソー | 圧力センサ |
WO2003008921A1 (fr) * | 2001-07-17 | 2003-01-30 | Measurement Specialties, Inc. | Technique d'isolation pour structure de détection de pression |
-
2000
- 2000-08-11 FR FR0010582A patent/FR2812969B1/fr not_active Expired - Fee Related
-
2001
- 2001-08-07 EP EP01963070A patent/EP1307911A1/fr not_active Withdrawn
- 2001-08-07 WO PCT/FR2001/002568 patent/WO2002015257A1/fr active Application Filing
- 2001-08-07 US US10/110,065 patent/US6647759B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6647759B2 (en) | 2003-11-18 |
EP1307911A1 (fr) | 2003-05-07 |
US20020152798A1 (en) | 2002-10-24 |
WO2002015257A1 (fr) | 2002-02-21 |
FR2812969A1 (fr) | 2002-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |
Effective date: 20100430 |