KR890010739A - 컨택(contact)을 이용한 전자부품의 설치방법 - Google Patents
컨택(contact)을 이용한 전자부품의 설치방법 Download PDFInfo
- Publication number
- KR890010739A KR890010739A KR1019880016579A KR880016579A KR890010739A KR 890010739 A KR890010739 A KR 890010739A KR 1019880016579 A KR1019880016579 A KR 1019880016579A KR 880016579 A KR880016579 A KR 880016579A KR 890010739 A KR890010739 A KR 890010739A
- Authority
- KR
- South Korea
- Prior art keywords
- metal layer
- electronic component
- support
- electrical connection
- cutting operation
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims 4
- 238000003801 milling Methods 0.000 claims 2
- 239000002775 capsule Substances 0.000 claims 1
- 238000003486 chemical etching Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- Credit Cards Or The Like (AREA)
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 부품의 출력단자가 균일한 금속층에 본딩되어 전기적으로 연결된 전자부품의 사시도.
제3도는 제2도의 조립부품이 본딩된 단일카드의 사시도로써, 본 발명의 방법에 따라 수행된 최종작업도를 나타낸다.
Claims (5)
- 전자부품을 하우징하기 위해 캐비티를 가지는 지지부상에 전자부품과 그의 전기적 케넥션을 설치하는 방법에 있어서, 상기 방법은 웨이퍼와 같은 작업된 지지부상에 금속층을 데포지션하는 단계, 상기 금속층에 전자부품을 고정시키는 단계, 금속층상의 어떤 한정된 위치에 전자부품의 출력단자를 전기적으로 연결하는 단계, 전자부품과 그 전기적 커넥션이 캐비티내에 하우징되고 상기 지지부에 고정되는 방법으로 지지부상의 전자부품과 금속층에 의해 형성된 세트를 설치하는 단계, 및 각 컨택영역이 부품의 출력단자에 대응되도록 서로 전기적으로 절연되는 영역내에서 금속층을 절단하는 단계로 구성되는 것을 특징으로하는 전자부품과 그 전기적 커넥션의 설치방법.
- 제1항에 있어서, 전기적 커넥션 작업후에 전자부품과 그 전기적 커넥션을 적당한 레진으로 된 캡슐에 넣는 작업으로 구성되는 것을 특징으로하는 방법.
- 제1항 또는 제2항에 있어서, 금속층 절단 작업은 마스크를 이용한 화학적 에칭공정에 의해 수행되는 것을 특징으로하는 방법.
- 제1항 또는 제2항에 있어서, 금속층 절단 작업은 역학적인 마이크로 밀링에 의해 수행되는 것을 특징으로하는 방법.
- 제1항 또는 제2항에 있어서, 금속층 절단 작업은 레이저 장치를 이용한 마이크로 밀링에 의해 수행되는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8717387A FR2624652B1 (fr) | 1987-12-14 | 1987-12-14 | Procede de mise en place sur un support, d'un composant electronique, muni de ses contacts |
FR8717387 | 1987-12-14 |
Publications (1)
Publication Number | Publication Date |
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KR890010739A true KR890010739A (ko) | 1989-08-10 |
Family
ID=9357824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016579A KR890010739A (ko) | 1987-12-14 | 1988-12-13 | 컨택(contact)을 이용한 전자부품의 설치방법 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0321326B1 (ko) |
JP (1) | JPH021400A (ko) |
KR (1) | KR890010739A (ko) |
DE (1) | DE3881360T2 (ko) |
FR (1) | FR2624652B1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5466967A (en) * | 1988-10-10 | 1995-11-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
US5270570A (en) * | 1988-10-10 | 1993-12-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
DE3834361A1 (de) * | 1988-10-10 | 1990-04-12 | Lsi Logic Products Gmbh | Anschlussrahmen fuer eine vielzahl von anschluessen |
DE4224103A1 (de) * | 1992-07-22 | 1994-01-27 | Manfred Dr Ing Michalk | Miniaturgehäuse mit elektronischen Bauelementen |
JPH06312593A (ja) | 1993-04-28 | 1994-11-08 | Toshiba Corp | 外部記憶装置、外部記憶装置ユニットおよび外部記憶装置の製造方法 |
JPH0737049A (ja) * | 1993-07-23 | 1995-02-07 | Toshiba Corp | 外部記憶装置 |
DE4326816A1 (de) * | 1993-08-10 | 1995-02-16 | Giesecke & Devrient Gmbh | Elektronisches Modul für Karten und Herstellung eines solchen Moduls |
JP3383398B2 (ja) * | 1994-03-22 | 2003-03-04 | 株式会社東芝 | 半導体パッケージ |
JPH0964240A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
US6022763A (en) * | 1996-05-10 | 2000-02-08 | Kabushiki Kaisha Toshiba | Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
JPH10302030A (ja) * | 1997-02-28 | 1998-11-13 | Toshiba Corp | 接続装置、および情報処理装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
FR2579798B1 (fr) * | 1985-04-02 | 1990-09-28 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede |
GB2178894B (en) * | 1985-08-06 | 1988-07-27 | Gen Electric Co Plc | Preparation of fragile devices |
-
1987
- 1987-12-14 FR FR8717387A patent/FR2624652B1/fr not_active Expired - Lifetime
-
1988
- 1988-12-09 EP EP88403139A patent/EP0321326B1/fr not_active Expired - Lifetime
- 1988-12-09 DE DE8888403139T patent/DE3881360T2/de not_active Expired - Fee Related
- 1988-12-13 KR KR1019880016579A patent/KR890010739A/ko not_active Application Discontinuation
- 1988-12-14 JP JP63316075A patent/JPH021400A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3881360D1 (de) | 1993-07-01 |
EP0321326A1 (fr) | 1989-06-21 |
FR2624652B1 (fr) | 1990-08-31 |
JPH021400A (ja) | 1990-01-05 |
DE3881360T2 (de) | 1993-09-02 |
EP0321326B1 (fr) | 1993-05-26 |
FR2624652A1 (fr) | 1989-06-16 |
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