FR2812968B1 - Capteur micro-usine avec protection isolante des connexions - Google Patents

Capteur micro-usine avec protection isolante des connexions

Info

Publication number
FR2812968B1
FR2812968B1 FR0010581A FR0010581A FR2812968B1 FR 2812968 B1 FR2812968 B1 FR 2812968B1 FR 0010581 A FR0010581 A FR 0010581A FR 0010581 A FR0010581 A FR 0010581A FR 2812968 B1 FR2812968 B1 FR 2812968B1
Authority
FR
France
Prior art keywords
pads
sensor
pin ends
micro
conductive elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0010581A
Other languages
English (en)
Other versions
FR2812968A1 (fr
Inventor
Bertrand Leverrier
Marchionni Marie Dominiq Bruni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR0010581A priority Critical patent/FR2812968B1/fr
Priority to EP01963069A priority patent/EP1307910A1/fr
Priority to PCT/FR2001/002567 priority patent/WO2002015256A1/fr
Priority to US10/089,974 priority patent/US6825512B2/en
Publication of FR2812968A1 publication Critical patent/FR2812968A1/fr
Application granted granted Critical
Publication of FR2812968B1 publication Critical patent/FR2812968B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
FR0010581A 2000-08-11 2000-08-11 Capteur micro-usine avec protection isolante des connexions Expired - Fee Related FR2812968B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0010581A FR2812968B1 (fr) 2000-08-11 2000-08-11 Capteur micro-usine avec protection isolante des connexions
EP01963069A EP1307910A1 (fr) 2000-08-11 2001-08-07 Capteur micro-usine avec protection isolante des connexions
PCT/FR2001/002567 WO2002015256A1 (fr) 2000-08-11 2001-08-07 Capteur micro-usine avec protection isolante des connexions
US10/089,974 US6825512B2 (en) 2000-08-11 2001-08-07 Micromachined sensor with insulating protection of connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0010581A FR2812968B1 (fr) 2000-08-11 2000-08-11 Capteur micro-usine avec protection isolante des connexions

Publications (2)

Publication Number Publication Date
FR2812968A1 FR2812968A1 (fr) 2002-02-15
FR2812968B1 true FR2812968B1 (fr) 2003-08-01

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FR0010581A Expired - Fee Related FR2812968B1 (fr) 2000-08-11 2000-08-11 Capteur micro-usine avec protection isolante des connexions

Country Status (4)

Country Link
US (1) US6825512B2 (fr)
EP (1) EP1307910A1 (fr)
FR (1) FR2812968B1 (fr)
WO (1) WO2002015256A1 (fr)

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JPWO2004059722A1 (ja) * 2002-12-24 2006-05-11 株式会社デンソー 半導体式センサおよび半導体装置のめっき方法
FR2862761B1 (fr) * 2003-11-25 2006-02-03 Thales Sa Accelerometre differentiel micro-usine multiaxes
US9467322B2 (en) * 2005-12-27 2016-10-11 Rovi Solutions Corporation Methods and apparatus for integrating media across a wide area network
WO2011134830A1 (fr) 2010-04-28 2011-11-03 Marcus Menden Dispositif d'éclairage comprenant un corps de base en matériau transparent
US8557703B2 (en) * 2010-08-12 2013-10-15 Stmicroelectronics, Inc. Method for pre-migration of metal ions in a semiconductor package
KR101706825B1 (ko) * 2014-11-13 2017-02-27 앰코 테크놀로지 코리아 주식회사 반도체 패키지
DE102015209267A1 (de) * 2015-05-21 2016-11-24 Robert Bosch Gmbh Bauteil mit einem MECS-Bauelement auf einem Montageträger

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US3632480A (en) * 1970-06-08 1972-01-04 Dow Chemical Co Vapor degreasing apparatus with falling film heat exchange surface
JPS5339791A (en) * 1976-09-22 1978-04-11 Nissan Motor Oxygen sensor
JPS59161852A (ja) * 1983-03-04 1984-09-12 Nec Corp 半導体装置
US5110034A (en) * 1990-08-30 1992-05-05 Quantum Magnetics, Inc. Superconducting bonds for thin film devices
US5290423A (en) * 1992-04-27 1994-03-01 Hughes Aircraft Company Electrochemical interconnection
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
US5549794A (en) * 1994-05-24 1996-08-27 H-O-H Research Inc. Continuous linear-toroidal extraction-distillation apparatus
FR2722358B1 (fr) 1994-07-08 1996-08-14 Thomson Csf Transducteur acoustique multifrequences a larges bandes
JPH0864938A (ja) * 1994-08-25 1996-03-08 Sharp Corp チップ型電子部品の接続方法
CH689395A5 (de) * 1995-03-16 1999-03-31 Alusuisse Lonza Services Ag Verfahren zur kontinuierlichen anodischen Oxidation von Baendern oder Draehten aus Aluminium.
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JPH095187A (ja) * 1995-06-21 1997-01-10 Fuji Electric Co Ltd 半導体圧力センサ
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US5907278A (en) * 1996-12-17 1999-05-25 Kavlico Corporation Capacitive sensor assembly with soot build-up inhibiting coating
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Also Published As

Publication number Publication date
US20020153257A1 (en) 2002-10-24
FR2812968A1 (fr) 2002-02-15
US6825512B2 (en) 2004-11-30
WO2002015256A1 (fr) 2002-02-21
EP1307910A1 (fr) 2003-05-07

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