DE60113333D1 - Metall-Legierungs-Zusammensetzungen und damit verbundene Plattierungsmethode - Google Patents
Metall-Legierungs-Zusammensetzungen und damit verbundene PlattierungsmethodeInfo
- Publication number
- DE60113333D1 DE60113333D1 DE60113333T DE60113333T DE60113333D1 DE 60113333 D1 DE60113333 D1 DE 60113333D1 DE 60113333 T DE60113333 T DE 60113333T DE 60113333 T DE60113333 T DE 60113333T DE 60113333 D1 DE60113333 D1 DE 60113333D1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- plating method
- alloy compositions
- associated plating
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21566400P | 2000-07-01 | 2000-07-01 | |
US215664P | 2000-07-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60113333D1 true DE60113333D1 (de) | 2005-10-20 |
DE60113333T2 DE60113333T2 (de) | 2006-07-06 |
Family
ID=22803874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2001613333 Expired - Fee Related DE60113333T2 (de) | 2000-07-01 | 2001-06-29 | Metalllegierungszusammensetzungen und damit verbundene Plattierungsmethoden |
Country Status (6)
Country | Link |
---|---|
US (2) | US6706418B2 (de) |
EP (1) | EP1167582B1 (de) |
JP (1) | JP2002121692A (de) |
KR (1) | KR20020003104A (de) |
DE (1) | DE60113333T2 (de) |
TW (1) | TWI225524B (de) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6821323B1 (en) * | 1999-11-12 | 2004-11-23 | Enthone Inc. | Process for the non-galvanic tin plating of copper or copper alloys |
US6797146B2 (en) * | 2000-11-02 | 2004-09-28 | Shipley Company, L.L.C. | Seed layer repair |
US6730209B2 (en) * | 2002-02-22 | 2004-05-04 | Lucent Technologies Inc. | Solder electroplating bath including brighteners having reduced volatility |
EP1422320A1 (de) * | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Kupfer-Elektroplattierungsbad |
JP4441726B2 (ja) | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
JP4758614B2 (ja) * | 2003-04-07 | 2011-08-31 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気めっき組成物および方法 |
DE102004003784B4 (de) * | 2004-01-23 | 2011-01-13 | Ormecon Gmbh | Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung |
EP1730215B1 (de) * | 2004-03-18 | 2017-08-16 | Enthone GmbH | Zusammensetzung, die ein leitfähiges polymer in kolloidaler form und kohlenstoff enthält |
DE102004030388A1 (de) * | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
DE102004030930A1 (de) * | 2004-06-25 | 2006-02-23 | Ormecon Gmbh | Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung |
US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
US20060096867A1 (en) * | 2004-11-10 | 2006-05-11 | George Bokisa | Tin alloy electroplating system |
TW200632147A (de) * | 2004-11-12 | 2006-09-16 | ||
DE102005006281B4 (de) | 2005-02-10 | 2014-07-17 | Infineon Technologies Ag | Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben |
DE102005010162B4 (de) * | 2005-03-02 | 2007-06-14 | Ormecon Gmbh | Leitfähige Polymere aus Teilchen mit anisotroper Morphologie |
DE102005016819B4 (de) * | 2005-04-12 | 2009-10-01 | Dr.-Ing. Max Schlötter GmbH & Co KG | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
US7713859B2 (en) * | 2005-08-15 | 2010-05-11 | Enthone Inc. | Tin-silver solder bumping in electronics manufacture |
DE102005039608A1 (de) * | 2005-08-19 | 2007-03-01 | Ormecon Gmbh | Zusammensetzung mit intrinsisch leitfähigem Polymer |
US7615255B2 (en) * | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
WO2007049456A1 (ja) * | 2005-10-28 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
KR101338824B1 (ko) | 2005-12-01 | 2013-12-06 | 스미토모 고무 고교 가부시키가이샤 | 금속 코드, 고무 코드 복합체 및 이들을 이용한 공기 타이어 |
US20090025846A1 (en) | 2005-12-13 | 2009-01-29 | Sumitomo Rubber Industries, Ltd. | Metal Cord, Rubber-Cord Complex and Pneumatic Tire Using the Same |
US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
EP2062467B1 (de) * | 2006-09-13 | 2012-02-15 | Enthone, Inc. | Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür |
JP5337352B2 (ja) | 2007-04-24 | 2013-11-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 錫または錫合金電気めっき液 |
TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
US7905994B2 (en) * | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US20090188553A1 (en) * | 2008-01-25 | 2009-07-30 | Emat Technology, Llc | Methods of fabricating solar-cell structures and resulting solar-cell structures |
EP2103717B1 (de) * | 2008-02-29 | 2010-04-21 | ATOTECH Deutschland GmbH | Pyrophosphat-basiertes Bad zur Abscheidung von Zinn-Legierungsschichten |
US8388824B2 (en) | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
US10221496B2 (en) | 2008-11-26 | 2019-03-05 | Macdermid Enthone Inc. | Copper filling of through silicon vias |
EP2221396A1 (de) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Bleifreie Elektroplattierungszusammensetzungen aus Blechlegierung und Verfahren |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
EP2588644B1 (de) * | 2010-06-30 | 2014-06-18 | Schauenburg Ruhrkunststoff GmbH | Tribologisch belastbare edelmetall/metallschichten |
EP2588645B1 (de) | 2010-06-30 | 2018-05-30 | RDM Family Investments LLC | Verfahren zur abscheidung einer nickel-metall-schicht |
US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
SG11201406133WA (en) * | 2012-03-28 | 2014-10-30 | Novellus Systems Inc | Methods and apparatuses for cleaning electroplating substrate holders |
TWI609100B (zh) | 2012-03-30 | 2017-12-21 | 諾發系統有限公司 | 使用反向電流除鍍以清洗電鍍基板夾持具 |
US9243339B2 (en) | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
US10072347B2 (en) | 2012-07-31 | 2018-09-11 | The Boeing Company | Systems and methods for tin antimony plating |
US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
US20140319681A1 (en) * | 2013-04-24 | 2014-10-30 | Samsung Electronics Co., Ltd. | Semiconductor package including solder ball |
US10053793B2 (en) | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
CN105648483B (zh) * | 2016-04-11 | 2018-09-18 | 济南德锡科技有限公司 | 一种高速镀锡溶液及其制备方法 |
DE102017125954A1 (de) * | 2017-11-07 | 2019-05-09 | RIAG Oberflächentechnik AG | Außen stromloses Verfahren zur Erzeugung einer Nickellegierung und entsprechender Elektrolyt |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2109887A (en) * | 1935-09-28 | 1938-03-01 | Hanson Van Winkle Munning Co | Bright zinc plating |
NL6505921A (de) * | 1965-05-11 | 1966-11-14 | ||
GB1304844A (de) * | 1969-04-24 | 1973-01-31 | ||
US3769179A (en) * | 1972-01-19 | 1973-10-30 | Kewanee Oil Co | Copper plating process for printed circuits |
DE2510870A1 (de) * | 1974-03-14 | 1975-09-25 | Toho Beslon Co | Glanzzusatz fuer aus pb-sn-legierungen bestehende galvanische ueberzuege |
JPS51123731A (en) * | 1975-04-22 | 1976-10-28 | Nippon Kagaku Sangyo Kk | Bright tin plating bath |
US4075065A (en) * | 1975-07-07 | 1978-02-21 | Handy & Harman | Gold plating bath and process |
SU768859A1 (ru) * | 1978-04-14 | 1980-10-07 | Институт Химии И Химической Технологии Ан Литовской Сср | Электролит лужени |
US4242182A (en) | 1978-07-21 | 1980-12-30 | Francine Popescu | Bright tin electroplating bath |
JPS60245797A (ja) * | 1984-05-18 | 1985-12-05 | Nippon Steel Corp | 非水溶媒系電気メツキ液およびその製造法 |
US4830903A (en) * | 1986-08-29 | 1989-05-16 | E. I. Du Pont De Nemours And Company | Catalytic deposition of metals in solid matrices |
JP2572792B2 (ja) * | 1987-12-11 | 1997-01-16 | エヌ・イーケムキャット株式会社 | 酸化防止剤 |
US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
RU2113555C1 (ru) * | 1996-03-26 | 1998-06-20 | Российский химико-технологический университет им.Д.И.Менделеева | Кислый электролит для электроосаждения белстящих покрытий сплавом олово-свинец |
US6267863B1 (en) * | 1999-02-05 | 2001-07-31 | Lucent Technologies Inc. | Electroplating solution for electroplating lead and lead/tin alloys |
-
2001
- 2001-06-29 DE DE2001613333 patent/DE60113333T2/de not_active Expired - Fee Related
- 2001-06-29 EP EP01305682A patent/EP1167582B1/de not_active Expired - Lifetime
- 2001-06-29 US US09/895,470 patent/US6706418B2/en not_active Expired - Fee Related
- 2001-07-02 JP JP2001201342A patent/JP2002121692A/ja active Pending
- 2001-07-02 KR KR1020010039301A patent/KR20020003104A/ko not_active Application Discontinuation
- 2001-07-02 TW TW90116121A patent/TWI225524B/zh not_active IP Right Cessation
-
2003
- 2003-07-16 US US10/620,957 patent/US6773568B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6706418B2 (en) | 2004-03-16 |
TWI225524B (en) | 2004-12-21 |
EP1167582B1 (de) | 2005-09-14 |
JP2002121692A (ja) | 2002-04-26 |
EP1167582A1 (de) | 2002-01-02 |
DE60113333T2 (de) | 2006-07-06 |
US20040086697A1 (en) | 2004-05-06 |
US6773568B2 (en) | 2004-08-10 |
US20020153260A1 (en) | 2002-10-24 |
KR20020003104A (ko) | 2002-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |