DE60107168D1 - Wärmleitende flüssige Silikonkautschukmischung für Fixierwalzen und mit einem Fluorkohlenwasserstoffharz beschichtete Fixierwalze - Google Patents

Wärmleitende flüssige Silikonkautschukmischung für Fixierwalzen und mit einem Fluorkohlenwasserstoffharz beschichtete Fixierwalze

Info

Publication number
DE60107168D1
DE60107168D1 DE60107168T DE60107168T DE60107168D1 DE 60107168 D1 DE60107168 D1 DE 60107168D1 DE 60107168 T DE60107168 T DE 60107168T DE 60107168 T DE60107168 T DE 60107168T DE 60107168 D1 DE60107168 D1 DE 60107168D1
Authority
DE
Germany
Prior art keywords
silicone rubber
liquid silicone
heat
fixing
rubber mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107168T
Other languages
English (en)
Other versions
DE60107168T2 (de
Inventor
Yuichi Tsuji
Hiroaki Yoshida
Yutaka Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE60107168D1 publication Critical patent/DE60107168D1/de
Application granted granted Critical
Publication of DE60107168T2 publication Critical patent/DE60107168T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/2053—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
    • G03G15/2057—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating relating to the chemical composition of the heat element and layers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Fixing For Electrophotography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Silicon Polymers (AREA)
DE60107168T 2000-08-30 2001-08-24 Wärmleitende flüssige Silikonkautschukmischung für Fixierwalzen und mit einem Fluorkohlenwasserstoffharz beschichtete Fixierwalze Expired - Lifetime DE60107168T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000261431A JP4435952B2 (ja) 2000-08-30 2000-08-30 定着ロール用熱伝導性液状シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JP2000261431 2000-08-30

Publications (2)

Publication Number Publication Date
DE60107168D1 true DE60107168D1 (de) 2004-12-23
DE60107168T2 DE60107168T2 (de) 2005-11-10

Family

ID=18749271

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107168T Expired - Lifetime DE60107168T2 (de) 2000-08-30 2001-08-24 Wärmleitende flüssige Silikonkautschukmischung für Fixierwalzen und mit einem Fluorkohlenwasserstoffharz beschichtete Fixierwalze

Country Status (8)

Country Link
US (1) US6569536B2 (de)
EP (1) EP1184421B1 (de)
JP (1) JP4435952B2 (de)
KR (1) KR100832726B1 (de)
AT (1) ATE282669T1 (de)
CA (1) CA2356110A1 (de)
DE (1) DE60107168T2 (de)
TW (1) TWI228140B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1331234C (en) * 1988-01-25 1994-08-02 Terence J. Swihart Crosslinkable pressure-sensitive adhesives containing a liquid copolymeric organopolysiloxane
DE69214574T2 (de) * 1991-08-22 1997-05-15 Dow Corning Feuchtigkeitshärtende druckempfindliche Silikonklebstoffe
JP2004086163A (ja) * 2002-06-26 2004-03-18 Hokushin Ind Inc 定着・加圧ロール
JP2004176016A (ja) * 2002-11-29 2004-06-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及びその成形体
JP4547169B2 (ja) * 2003-03-26 2010-09-22 信越化学工業株式会社 オルガノポリシロキサン組成物
JP4565491B2 (ja) * 2003-04-15 2010-10-20 東レ・ダウコーニング株式会社 熱伝導性付加硬化型液状シリコーンゴム組成物
DE602004024049D1 (de) * 2003-04-15 2009-12-24 Dow Corning Toray Co Ltd Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze
JP4193052B2 (ja) 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
JP4973845B2 (ja) * 2006-09-20 2012-07-11 信越化学工業株式会社 ローラ用付加硬化型液状導電性シリコーンゴム組成物及び現像ローラ
JP2008107770A (ja) * 2006-09-29 2008-05-08 Ricoh Printing Systems Ltd 定着装置およびそれを用いた画像形成装置
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
JP5031436B2 (ja) * 2007-05-08 2012-09-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 低透湿性ポリオルガノシロキサン組成物
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP6049684B2 (ja) 2011-03-23 2016-12-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ イミダゾリウム基を含むポリマーのイオン性化合物を含有する組成物
JP5967002B2 (ja) * 2013-04-08 2016-08-10 東洋インキＳｃホールディングス株式会社 易変形性凝集体、熱伝導性樹脂組成物、熱伝導性部材、および熱伝導性接着シート
KR102047418B1 (ko) * 2012-05-21 2019-11-22 토요잉크Sc홀딩스주식회사 이 변형성 응집체와 그 제조 방법, 열 전도성 수지 조성물, 열 전도성 부재와 그 제조 방법 및 열 전도성 접착 시트
JP6339761B2 (ja) * 2012-12-17 2018-06-06 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び熱伝導性部材
EP2899214A1 (de) 2014-01-27 2015-07-29 Basf Se Ethylenisch ungesättigte Polysaccharide, Verfahren zu deren Herstellung und deren Verwendung
EP2899213A1 (de) 2014-01-27 2015-07-29 Basf Se Modifizierte Polysaccharide, Verfahren zu deren Herstellung und deren Verwendung
WO2018225750A1 (ja) 2017-06-06 2018-12-13 東レ・ダウコーニング株式会社 定着部材形成用シリコーンゴム組成物および定着部材
CN114211903B (zh) * 2021-12-27 2023-08-15 苏州瑞高新材料有限公司 一种高导热硅胶压花辊筒及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137658C2 (de) * 1981-09-22 1985-06-05 H. Maihak Ag, 2000 Hamburg Vorrichtung zur Messung der Konzentration eines IR-, NIR-, VIS- oder UV-Strahlung absorbierenden Gases in einer Gasmatrix
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
JP2863019B2 (ja) 1991-03-05 1999-03-03 ポリプラスチックス株式会社 ランプリフレクター
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3385133B2 (ja) 1995-06-30 2003-03-10 信越化学工業株式会社 熱定着ローラー用付加硬化型シリコーンゴム組成物及びそれを用いた熱定着用ローラー
JP3592809B2 (ja) * 1995-09-13 2004-11-24 東レ・ダウコーニング・シリコーン株式会社 フッ素樹脂被覆定着ロール用シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JPH1039666A (ja) 1996-07-23 1998-02-13 Kin Yosha Kk 定着器用ローラ
JPH11158383A (ja) * 1997-11-27 1999-06-15 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物および定着ロール
KR20010096917A (ko) * 2000-04-19 2001-11-08 다우 코닝 도레이 실리콘 캄파니 리미티드 경화성 실리콘 조성물

Also Published As

Publication number Publication date
EP1184421B1 (de) 2004-11-17
US20020035190A1 (en) 2002-03-21
ATE282669T1 (de) 2004-12-15
TWI228140B (en) 2005-02-21
JP4435952B2 (ja) 2010-03-24
CA2356110A1 (en) 2002-02-28
JP2002072728A (ja) 2002-03-12
KR100832726B1 (ko) 2008-05-27
EP1184421A1 (de) 2002-03-06
KR20020018147A (ko) 2002-03-07
US6569536B2 (en) 2003-05-27
DE60107168T2 (de) 2005-11-10

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