DE60038563D1 - Selektive Ablagerung vom organischen Schutzmittel auf Kupfer - Google Patents

Selektive Ablagerung vom organischen Schutzmittel auf Kupfer

Info

Publication number
DE60038563D1
DE60038563D1 DE60038563T DE60038563T DE60038563D1 DE 60038563 D1 DE60038563 D1 DE 60038563D1 DE 60038563 T DE60038563 T DE 60038563T DE 60038563 T DE60038563 T DE 60038563T DE 60038563 D1 DE60038563 D1 DE 60038563D1
Authority
DE
Germany
Prior art keywords
copper
osp
coating
copper surface
selective deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038563T
Other languages
English (en)
Other versions
DE60038563T2 (de
Inventor
Karl F Wengenroth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Application granted granted Critical
Publication of DE60038563D1 publication Critical patent/DE60038563D1/de
Publication of DE60038563T2 publication Critical patent/DE60038563T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE60038563T 1999-08-26 2000-08-21 Selektive Ablagerung vom organischen Schutzmittel auf Kupfer Expired - Lifetime DE60038563T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/383,718 US6524644B1 (en) 1999-08-26 1999-08-26 Process for selective deposition of OSP coating on copper, excluding deposition on gold
US383718 1999-08-26
PCT/US2000/020787 WO2001014612A1 (en) 1999-08-26 2000-08-21 Process for selective deposition of copper substrates

Publications (2)

Publication Number Publication Date
DE60038563D1 true DE60038563D1 (de) 2008-05-21
DE60038563T2 DE60038563T2 (de) 2009-06-10

Family

ID=23514405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038563T Expired - Lifetime DE60038563T2 (de) 1999-08-26 2000-08-21 Selektive Ablagerung vom organischen Schutzmittel auf Kupfer

Country Status (8)

Country Link
US (1) US6524644B1 (de)
EP (1) EP1224339B1 (de)
KR (1) KR100556679B1 (de)
CN (1) CN1240873C (de)
AT (1) ATE391574T1 (de)
AU (1) AU6891000A (de)
DE (1) DE60038563T2 (de)
WO (1) WO2001014612A1 (de)

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* Cited by examiner, † Cited by third party
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ATE474944T1 (de) * 2003-03-19 2010-08-15 Shikoku Chem Lötverfahren unter verwendung einer imidazolverbindung
JP2006080493A (ja) * 2004-08-12 2006-03-23 Ricoh Microelectronics Co Ltd 電極基板
DE102005031181A1 (de) * 2005-07-01 2007-01-04 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte
US20080173470A1 (en) * 2005-10-03 2008-07-24 Michael Barbetta Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards
JP4843044B2 (ja) 2005-10-05 2011-12-21 エフ．ホフマン−ラ ロシュ アーゲー 非蛍光性エネルギー移動
US7494920B2 (en) * 2005-10-14 2009-02-24 Honeywell International Inc. Method of fabricating a vertically mountable IC package
US20070221503A1 (en) * 2006-03-22 2007-09-27 Brian Larson Precoat composition for organic solderability preservative
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
US20080268267A1 (en) * 2007-04-27 2008-10-30 Michael Barbetta Combined solderable multi-purpose surface finishes on circuit boards and method of manufacture of such boards
US20090233436A1 (en) * 2008-03-12 2009-09-17 Stats Chippac, Ltd. Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
US8166650B2 (en) 2008-05-30 2012-05-01 Steering Solutions IP Holding Company Method of manufacturing a printed circuit board
JP5313044B2 (ja) * 2008-08-08 2013-10-09 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
EP2445322B1 (de) * 2009-06-01 2013-07-10 Sumitomo Electric Industries, Ltd. Verbindungsverfahren
CN101575704B (zh) * 2009-06-12 2011-01-26 林原标 铜及铜合金表面处理剂
KR101140978B1 (ko) * 2010-08-20 2012-05-03 삼성전기주식회사 인쇄회로기판의 제조방법
KR101241681B1 (ko) * 2010-08-31 2013-03-11 엘지이노텍 주식회사 코팅액, 인쇄회로기판 및 그의 제조 방법
US20120171356A1 (en) * 2010-12-27 2012-07-05 Camtek Ltd. System for digital deposition of pad / interconnects coatings
CN102121108B (zh) * 2011-02-23 2012-11-21 广东东硕科技有限公司 无铅印制电路板用复配osp处理剂
US9441115B2 (en) 2011-11-14 2016-09-13 Tantz Environmental Technologies Ltd. Aqueous phase pore sealing agent imroving PCB coating oxidation-resistant and corrosion-resistant properties and method for using same
US8791014B2 (en) 2012-03-16 2014-07-29 Globalfoundries Inc. Methods of forming copper-based conductive structures on semiconductor devices
CN102873471A (zh) * 2012-09-13 2013-01-16 广东达志环保科技股份有限公司 一种烷基苯骈咪唑衍生物的组合溶液和有机保焊剂的制备方法
US8961678B2 (en) 2012-12-20 2015-02-24 Rohm And Haas Electronic Materials Llc Organic solderability preservative and method
CN103993301B (zh) * 2014-04-09 2016-09-21 苏州市阿萨诺电子科技有限公司 一种集成电路板金属表面保护剂
CN104388945B (zh) * 2014-12-04 2015-10-28 西安石油大学 高流速环境下抗co2腐蚀的曼尼希碱类缓蚀剂及其制备方法
DE202015008773U1 (de) 2015-12-22 2016-01-28 Continental Automotive Gmbh Steckkontakt mit organischer Beschichtung und Leiterplattenanordnung
US20170183783A1 (en) * 2015-12-29 2017-06-29 Rohm And Haas Electronic Materials Llc Method for forming organic coating on copper surface
DE102017113871A1 (de) * 2017-06-22 2018-12-27 Doduco Solutions Gmbh Bondsubstrat sowie Verfahren zum Schützen von zum Drahtbonden vorgesehenen Oberflächen
WO2019135989A1 (en) * 2018-01-03 2019-07-11 Ecolab Usa Inc. Process and method for reducing metal corrosion in water
US11676926B2 (en) 2020-08-24 2023-06-13 Schlumberger Technology Corporation Solder joints on nickel surface finishes without gold plating
JP7336491B2 (ja) * 2020-09-25 2023-08-31 株式会社タムラ製作所 プリント配線基板の表面処理方法、およびプリント配線基板の製造方法
CN114453695A (zh) * 2022-01-06 2022-05-10 深圳市虹喜科技发展有限公司 一种osp工艺及由该工艺制备的pcb

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Also Published As

Publication number Publication date
WO2001014612A1 (en) 2001-03-01
AU6891000A (en) 2001-03-19
DE60038563T2 (de) 2009-06-10
CN1391618A (zh) 2003-01-15
ATE391574T1 (de) 2008-04-15
EP1224339A4 (de) 2007-05-02
EP1224339A1 (de) 2002-07-24
KR100556679B1 (ko) 2006-03-10
EP1224339B1 (de) 2008-04-09
US6524644B1 (en) 2003-02-25
KR20020040788A (ko) 2002-05-30
CN1240873C (zh) 2006-02-08

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