DE60036371D1 - Ventil mit zwei schiebern und dessen anwendung - Google Patents

Ventil mit zwei schiebern und dessen anwendung

Info

Publication number
DE60036371D1
DE60036371D1 DE60036371T DE60036371T DE60036371D1 DE 60036371 D1 DE60036371 D1 DE 60036371D1 DE 60036371 T DE60036371 T DE 60036371T DE 60036371 T DE60036371 T DE 60036371T DE 60036371 D1 DE60036371 D1 DE 60036371D1
Authority
DE
Germany
Prior art keywords
valve
open
slot
transport
servicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036371T
Other languages
English (en)
Other versions
DE60036371T2 (de
Inventor
Tony R Kroeker
Benjamin W Mooring
Nicolas J Bright
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60036371D1 publication Critical patent/DE60036371D1/de
Application granted granted Critical
Publication of DE60036371T2 publication Critical patent/DE60036371T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
    • F16K3/18—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Valves (AREA)
  • Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
  • Time-Division Multiplex Systems (AREA)
  • Pens And Brushes (AREA)
  • Bag Frames (AREA)
  • Manipulator (AREA)
DE60036371T 1999-03-29 2000-02-29 Ventil mit zwei schiebern und dessen anwendung Expired - Lifetime DE60036371T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US280177 1999-03-29
US09/280,177 US6095741A (en) 1999-03-29 1999-03-29 Dual sided slot valve and method for implementing the same
PCT/US2000/005159 WO2000058654A1 (en) 1999-03-29 2000-02-29 Dual-sided slot valve and method for implementing the same

Publications (2)

Publication Number Publication Date
DE60036371D1 true DE60036371D1 (de) 2007-10-25
DE60036371T2 DE60036371T2 (de) 2008-06-05

Family

ID=23072008

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60036371T Expired - Lifetime DE60036371T2 (de) 1999-03-29 2000-02-29 Ventil mit zwei schiebern und dessen anwendung

Country Status (8)

Country Link
US (1) US6095741A (de)
EP (1) EP1165993B1 (de)
JP (1) JP4532749B2 (de)
KR (1) KR100783120B1 (de)
AT (1) ATE373193T1 (de)
AU (1) AU3610500A (de)
DE (1) DE60036371T2 (de)
WO (1) WO2000058654A1 (de)

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US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6267545B1 (en) * 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6390448B1 (en) 2000-03-30 2002-05-21 Lam Research Corporation Single shaft dual cradle vacuum slot valve
US6913243B1 (en) * 2000-03-30 2005-07-05 Lam Research Corporation Unitary slot valve actuator with dual valves
CN101499413B (zh) * 2001-11-02 2011-05-04 应用材料股份有限公司 单个晶片的干燥装置和干燥方法
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
US7100892B2 (en) * 2003-08-26 2006-09-05 Kitz Sct Corporation Non-rubbing gate valve for semiconductor fabrication apparatus
JP3912604B2 (ja) * 2003-11-04 2007-05-09 入江工研株式会社 ゲート弁
JP4462912B2 (ja) * 2003-12-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理装置の管理方法
US20050205210A1 (en) * 2004-01-06 2005-09-22 Devine Daniel J Advanced multi-pressure workpiece processing
US20050205209A1 (en) * 2004-03-18 2005-09-22 Aelan Mosden Replacing chamber components in a vacuum environment
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US20060102282A1 (en) * 2004-11-15 2006-05-18 Supercritical Systems, Inc. Method and apparatus for selectively filtering residue from a processing chamber
US7767145B2 (en) * 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
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US20060278164A1 (en) * 2005-06-10 2006-12-14 Petrach Philip M Dual gate isolating maintenance slit valve chamber with pumping option
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KR101447184B1 (ko) * 2006-11-10 2014-10-08 엘아이지에이디피 주식회사 게이트슬릿 개폐장치가 구비된 공정챔버
DE102008027944B3 (de) * 2008-06-12 2009-07-30 Vat Holding Ag Schieberventil
DE102008049353A1 (de) * 2008-09-29 2010-04-08 Vat Holding Ag Vakuumventil
KR200473996Y1 (ko) 2008-12-22 2014-08-13 주식회사 테스 슬릿밸브
EP2224153A1 (de) * 2009-02-25 2010-09-01 VAT Holding AG Vakuumdoppelschieberventil
TWI541465B (zh) * 2009-10-27 2016-07-11 Ｖａｔ控股股份有限公司 用於真空閥之封閉單元
KR101762984B1 (ko) * 2010-01-29 2017-07-28 배트 홀딩 아게 개구부를 폐쇄하기 위한 도어
JP5806827B2 (ja) * 2011-03-18 2015-11-10 東京エレクトロン株式会社 ゲートバルブ装置及び基板処理装置並びにその基板処理方法
KR101352929B1 (ko) * 2011-12-20 2014-01-20 주식회사 에스에프에이 글라스 처짐이 방지된 인라인 진공장치
KR101338387B1 (ko) * 2011-12-23 2013-12-06 이동민 진공 공정용 게이트 밸브
TWI656293B (zh) * 2014-04-25 2019-04-11 瑞士商Ｖａｔ控股股份有限公司 閥
JP6160923B2 (ja) * 2014-04-30 2017-07-12 Smc株式会社 ゲートバルブ
JP6584829B2 (ja) * 2014-07-04 2019-10-02 バット ホールディング アーゲー バルブ
US10184291B2 (en) * 2014-12-19 2019-01-22 Vat Holding Ag Door for closing a chamber opening in a chamber wall of a vacuum chamber
JP6677738B2 (ja) 2015-03-09 2020-04-08 バット ホールディング アーゲー 真空バルブ
TWI705212B (zh) 2016-01-19 2020-09-21 瑞士商Ｖａｔ控股股份有限公司 用於對壁中開口進行真空密封的密封裝置
US9666461B1 (en) * 2016-02-05 2017-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor process and semiconductor processing device using the same
TWI740981B (zh) 2016-08-22 2021-10-01 瑞士商Ｖａｔ控股股份有限公司 真空閥
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
CN113130345B (zh) * 2019-12-31 2023-12-08 中微半导体设备(上海)股份有限公司 基片处理系统及其维护方法
US11328943B2 (en) * 2020-04-03 2022-05-10 Applied Materials, Inc. Dual gate and single actuator system

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Also Published As

Publication number Publication date
EP1165993A1 (de) 2002-01-02
ATE373193T1 (de) 2007-09-15
EP1165993B1 (de) 2007-09-12
JP4532749B2 (ja) 2010-08-25
KR20010109331A (ko) 2001-12-08
KR100783120B1 (ko) 2007-12-07
AU3610500A (en) 2000-10-16
WO2000058654A1 (en) 2000-10-05
JP2002540612A (ja) 2002-11-26
US6095741A (en) 2000-08-01
DE60036371T2 (de) 2008-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition