WO2004054755A3 - Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture - Google Patents

Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture Download PDF

Info

Publication number
WO2004054755A3
WO2004054755A3 PCT/FR2003/003688 FR0303688W WO2004054755A3 WO 2004054755 A3 WO2004054755 A3 WO 2004054755A3 FR 0303688 W FR0303688 W FR 0303688W WO 2004054755 A3 WO2004054755 A3 WO 2004054755A3
Authority
WO
WIPO (PCT)
Prior art keywords
opening
gripping
closure
moving
semiconductor plate
Prior art date
Application number
PCT/FR2003/003688
Other languages
English (en)
Other versions
WO2004054755A2 (fr
Inventor
Christophe Lero
Pierre Astegno
Alain Gaudon
Original Assignee
Recif Sa
Christophe Lero
Pierre Astegno
Alain Gaudon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Recif Sa, Christophe Lero, Pierre Astegno, Alain Gaudon filed Critical Recif Sa
Priority to EP03813172A priority Critical patent/EP1610927A2/fr
Priority to AU2003296827A priority patent/AU2003296827A1/en
Publication of WO2004054755A2 publication Critical patent/WO2004054755A2/fr
Publication of WO2004054755A3 publication Critical patent/WO2004054755A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B23Q7/043—Construction of the grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Abstract

Dispositif (12) permettant une préhension, à travers une ouverture (13) de poste de transfert (10) pour installation de traitement de plaques de semi-conducteur, d'au moins une plaque (11) de semi-conducteur adoptant la forme d'un disque, logée dans un conteneur (14) de plaques de semi-conducteur situé d'un premier (15) côté de ladite ouverture, à partir d'un espace (16) situé d'un deuxième (17) côté de ladite ouverture opposé au premier côté, ledit dispositif comprenant - un obturateur (1) mobile apte à se déplacer entre une première position de fermeture de ladite ouverture, et une deuxième position de libération de ladite ouverture permettant un accès à l'intérieur du conteneur, - des moyens de déplacement (18) dudit obturateur entre lesdites première et deuxième positions de celui-ci, ledit déplacement se situant au moins en partie dans un plan sensiblement parallèle au plan de ladite ouverture, ledit dispositif étant caractérisé en ce qu'il comprend - des moyens de préhension (2) d'au moins une plaque, (11) de semi-conducteur, aptes à pénétrer en partie dans ledit conteneur sous une plaque et à saisir cette dernière par sa partie périphérique, - des moyens de déplacement (3) desdits moyens de préhension à partir dudit espace situé du deuxième côté de l'ouverture vers le premier côté, ou inversement, - des moyens de liaison (4) au dit obturateur desdits moyens de déplacement des moyens de préhension.
PCT/FR2003/003688 2002-12-13 2003-12-12 Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture WO2004054755A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03813172A EP1610927A2 (fr) 2002-12-13 2003-12-12 Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture
AU2003296827A AU2003296827A1 (en) 2002-12-13 2003-12-12 Device for gripping a semiconductor plate through a transfer opening, using the closure of the opening

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43351602P 2002-12-13 2002-12-13
US60/433,516 2002-12-13

Publications (2)

Publication Number Publication Date
WO2004054755A2 WO2004054755A2 (fr) 2004-07-01
WO2004054755A3 true WO2004054755A3 (fr) 2004-10-21

Family

ID=32595207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2003/003688 WO2004054755A2 (fr) 2002-12-13 2003-12-12 Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture

Country Status (4)

Country Link
US (1) US7244088B2 (fr)
EP (1) EP1610927A2 (fr)
AU (1) AU2003296827A1 (fr)
WO (1) WO2004054755A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
US20070297885A1 (en) * 2006-06-27 2007-12-27 Jean Michel Processe Product designed to be used with handling system
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
TWI691388B (zh) 2011-03-11 2020-04-21 美商布魯克斯自動機械公司 基板處理裝置
US8958907B2 (en) * 2011-03-31 2015-02-17 Sinfonia Technology Co., Ltd. Robot arm apparatus
US9520264B2 (en) * 2012-03-19 2016-12-13 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for clamping and cooling a substrate for ion implantation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5984610A (en) * 1995-03-07 1999-11-16 Fortrend Engineering Corporation Pod loader interface
WO2000047501A1 (fr) * 1999-02-10 2000-08-17 Asyst Technologies, Inc. Systeme de transfert de reticule
WO2000051920A1 (fr) * 1999-03-03 2000-09-08 Pri Automation, Inc. Robot servant a deplacer une porte de support de substrat
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159964A (en) * 1978-06-06 1979-12-18 Shiroyama Kogyo Kk Articulated arm type manipulator
US4897015A (en) * 1987-05-15 1990-01-30 Ade Corporation Rotary to linear motion robot arm
JPH03154791A (ja) * 1989-11-14 1991-07-02 Sumitomo Eaton Noba Kk ロボット用多関節アーム
US5178512A (en) * 1991-04-01 1993-01-12 Equipe Technologies Precision robot apparatus
US5168168A (en) * 1991-05-10 1992-12-01 New Focus, Inc. Device for centering round articles
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
US5741113A (en) * 1995-07-10 1998-04-21 Kensington Laboratories, Inc. Continuously rotatable multiple link robot arm mechanism
US6231297B1 (en) 1995-10-27 2001-05-15 Brooks Automation, Inc. Substrate transport apparatus with angled arms
JP3693731B2 (ja) * 1996-01-23 2005-09-07 金 君榮 搬送ロボット
TW349897B (en) * 1996-02-02 1999-01-11 Komatsu Mfg Co Ltd Operational robot
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US5810549A (en) * 1996-04-17 1998-09-22 Applied Materials, Inc. Independent linear dual-blade robot and method for transferring wafers
US5765983A (en) * 1996-05-30 1998-06-16 Brooks Automation, Inc. Robot handling apparatus
JPH09323276A (ja) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd 搬送装置及びロボットアーム
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
JPH10329059A (ja) * 1997-05-30 1998-12-15 Daihen Corp ２アーム方式の搬送用ロボット装置
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
JP2001514439A (ja) * 1997-08-28 2001-09-11 シーブイシー プロダクツ， インク． 複数ステーションの機械のウエハー取り扱い装置
WO1999028952A2 (fr) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Interface de port de chargement a localisation de plaquettes
JPH11188671A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JP3519595B2 (ja) * 1998-03-31 2004-04-19 松下電器産業株式会社 ウエハ搬送装置
JP3863671B2 (ja) * 1998-07-25 2006-12-27 株式会社ダイヘン 搬送用ロボット装置
US6109568A (en) * 1998-10-23 2000-08-29 Innovative Transportation Systems International, Inc. Control system and method for moving multiple automated vehicles along a monorail
US6485250B2 (en) 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
AU2612500A (en) 1999-01-15 2000-08-01 Asyst Technologies, Inc. Workpiece handling robot
JP4255091B2 (ja) * 1999-04-07 2009-04-15 株式会社日立国際電気 半導体製造方法
US6474712B1 (en) * 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation
US6494663B2 (en) * 1999-07-16 2002-12-17 Storage Technology Corporation Method and system for sharing robotic mechanisms between automated storage libraries
JP3513437B2 (ja) * 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
US6260897B1 (en) * 2000-05-12 2001-07-17 Kevin K. Carano Disc gripping tools
US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner
US6297611B1 (en) * 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
JP2002184831A (ja) * 2000-12-11 2002-06-28 Hirata Corp Ｆｏｕｐオープナ
US6533521B1 (en) * 2001-03-29 2003-03-18 Genmark Automation, Inc. Integrated substrate handler having pre-aligner and storage pod access mechanism
US6541787B2 (en) * 2001-04-18 2003-04-01 Taiwan Semiconductor Manufacturing Co., Ltd Optically aligning a loadport on a process machine by transmitting light through a system of apertures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5984610A (en) * 1995-03-07 1999-11-16 Fortrend Engineering Corporation Pod loader interface
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
WO2000047501A1 (fr) * 1999-02-10 2000-08-17 Asyst Technologies, Inc. Systeme de transfert de reticule
WO2000051920A1 (fr) * 1999-03-03 2000-09-08 Pri Automation, Inc. Robot servant a deplacer une porte de support de substrat
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) *

Also Published As

Publication number Publication date
AU2003296827A1 (en) 2004-07-09
AU2003296827A8 (en) 2004-07-09
US7244088B2 (en) 2007-07-17
US20050063797A1 (en) 2005-03-24
EP1610927A2 (fr) 2006-01-04
WO2004054755A2 (fr) 2004-07-01

Similar Documents

Publication Publication Date Title
WO2004010476A3 (fr) Appareil pour traitement de substrats
CA2175430A1 (fr) Dispositif de communication sans fil a mecanisme de degagement du couvercle aligne axialement
CA2232228A1 (fr) Couvercle distributeur
TW200508103A (en) Closure device for a reclosable pouch
EP1659071A3 (fr) Fermeture constituée de deux parties pour un récipient
AU2003267522A1 (en) Removable grip handle device adaptable to containers of different thickness
CA2261400A1 (fr) Dispositif de stockage de dechets
WO2002089183A3 (fr) Dispositif de maintien pour des plaquettes de semi-conducteur
TW484750U (en) Opening/closing device for front-opened type wafer box
WO2004054755A3 (fr) Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture
SG113433A1 (en) Venting valve assembly for casting moulds
AU2002353267A1 (en) Semiconductor device, and means for checking the authenticity
WO2003040501A3 (fr) Assemblage d'actionneur
EP1260754A3 (fr) Dispositif pour chargement et déchargement d'outils dans/d'un magasin d'outils d'une machine-outil ou similaire
FR2598139B1 (fr) Dispositif de levage, notamment pour manutentionner et ouvrir des conteneurs comportant deux coquilles articulees.
HK1097236A1 (en) A device for opening flexible containers
WO2007031750A3 (fr) Dispositif de dissipation thermique
EG22307A (en) Crack resistant valve plate for a slide gate valve
CA2425606A1 (fr) Dispositif de retenue pour porte ou barriere
HK1039642A1 (en) Arm stopper assembly for a lid of opening.
WO2001040095A8 (fr) Dispositif de fermeture et de distribution par basculement, dote de moyens de blocage
JP2002151563A5 (fr)
IE823050L (en) Drum lid operation
AU7929800A (en) Support that can be opened, for a device for sealing various containers
WO2003018440A1 (fr) Conteneur du type a dechargement par le fond

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003813172

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003813172

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP

WWW Wipo information: withdrawn in national office

Ref document number: 2003813172

Country of ref document: EP