DE60030612D1 - Anzeigevorrichtung und elektronisches Gerät - Google Patents

Anzeigevorrichtung und elektronisches Gerät

Info

Publication number
DE60030612D1
DE60030612D1 DE60030612T DE60030612T DE60030612D1 DE 60030612 D1 DE60030612 D1 DE 60030612D1 DE 60030612 T DE60030612 T DE 60030612T DE 60030612 T DE60030612 T DE 60030612T DE 60030612 D1 DE60030612 D1 DE 60030612D1
Authority
DE
Germany
Prior art keywords
display device
electronic device
electronic
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030612T
Other languages
English (en)
Other versions
DE60030612T2 (de
Inventor
Kogo Endo
Eiji Oishi
Yasuhito Aruga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE60030612D1 publication Critical patent/DE60030612D1/de
Publication of DE60030612T2 publication Critical patent/DE60030612T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
DE60030612T 1999-03-26 2000-03-22 Anzeigevorrichtung und elektronisches Gerät Expired - Lifetime DE60030612T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8476999 1999-03-26
JP11084769A JP2000276068A (ja) 1999-03-26 1999-03-26 表示装置及び電子機器

Publications (2)

Publication Number Publication Date
DE60030612D1 true DE60030612D1 (de) 2006-10-26
DE60030612T2 DE60030612T2 (de) 2007-01-11

Family

ID=13839899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030612T Expired - Lifetime DE60030612T2 (de) 1999-03-26 2000-03-22 Anzeigevorrichtung und elektronisches Gerät

Country Status (8)

Country Link
US (1) US7119801B1 (de)
EP (1) EP1039331B1 (de)
JP (1) JP2000276068A (de)
KR (1) KR100522321B1 (de)
CN (1) CN1135424C (de)
DE (1) DE60030612T2 (de)
HK (1) HK1031918A1 (de)
TW (1) TWI269913B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4352598B2 (ja) * 2000-08-24 2009-10-28 ソニー株式会社 液晶表示装置および携帯端末
TWI304909B (de) 2000-10-04 2009-01-01 Matsushita Electric Ind Co Ltd
JP2002258766A (ja) * 2001-02-28 2002-09-11 Seiko Epson Corp フレキシブル基板、電気光学装置および電子機器
JP2003108021A (ja) * 2001-09-28 2003-04-11 Hitachi Ltd 表示装置
US7508479B2 (en) 2001-11-15 2009-03-24 Samsung Electronics Co., Ltd. Liquid crystal display
KR100789139B1 (ko) * 2001-11-15 2007-12-28 삼성전자주식회사 온 글라스 싱글칩 액정표시장치
KR100511349B1 (ko) * 2001-12-29 2005-08-31 엘지.필립스 엘시디 주식회사 액정 표시 장치
JP3977299B2 (ja) 2002-09-18 2007-09-19 セイコーエプソン株式会社 電気光学装置、マトリクス基板、及び電子機器
CN100452131C (zh) * 2002-12-30 2009-01-14 皇家飞利浦电子股份有限公司 显示系统、包含该显示系统的显示设备和显示器
JP2004247373A (ja) 2003-02-12 2004-09-02 Semiconductor Energy Lab Co Ltd 半導体装置
JP3770240B2 (ja) * 2003-02-20 2006-04-26 セイコーエプソン株式会社 電気光学装置および電子機器
KR100925466B1 (ko) * 2003-02-27 2009-11-06 삼성전자주식회사 액정 표시 장치
JP4357868B2 (ja) * 2003-04-25 2009-11-04 シャープ株式会社 表示装置
JP4349009B2 (ja) 2003-06-24 2009-10-21 セイコーエプソン株式会社 電気光学装置、製造方法及び電子機器
JP2005062582A (ja) * 2003-08-18 2005-03-10 Hitachi Displays Ltd 表示装置
KR20060039658A (ko) * 2004-11-03 2006-05-09 엘지전자 주식회사 유기 전계 발광 소자 키트
CN101322170B (zh) * 2005-12-02 2012-10-10 株式会社半导体能源研究所 显示模块以及使用其的电子设备
US8786582B2 (en) * 2009-10-27 2014-07-22 Sharp Kabushiki Kaisha Display panel and display apparatus
US8711570B2 (en) 2011-06-21 2014-04-29 Apple Inc. Flexible circuit routing
US9041176B2 (en) 2012-10-08 2015-05-26 Qualcomm Incorporated Hybrid semiconductor module structure
WO2015178059A1 (ja) * 2014-05-22 2015-11-26 シャープ株式会社 接続配線
US20160335835A1 (en) * 2015-05-15 2016-11-17 Wms Gaming Inc. Gaming systems and electronic gaming machines with multi-display device arrangements
KR102391249B1 (ko) * 2015-05-28 2022-04-28 삼성디스플레이 주식회사 표시 장치
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
US10902769B2 (en) * 2017-07-12 2021-01-26 Facebook Technologies, Llc Multi-layer fabrication for pixels with calibration compensation
CN107561764A (zh) * 2017-10-30 2018-01-09 上海天马微电子有限公司 一种显示面板及其显示装置
WO2024124460A1 (zh) * 2022-12-15 2024-06-20 刘叔弦 一种胆固醇显示模块与其制作方法及一种胆固醇显示设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040953C2 (de) * 1979-11-01 1984-03-15 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Bildanzeigeeinrichtung
JPS59231518A (ja) 1983-06-14 1984-12-26 Matsushita Electric Ind Co Ltd 液晶とプリント基板の接続装置
JPH01259395A (ja) 1988-04-11 1989-10-17 Toshiba Corp 液晶表示装置及びその製造方法
JPH02102769U (de) 1989-02-03 1990-08-15
JP2724890B2 (ja) 1989-11-14 1998-03-09 ティーディーケイ株式会社 プリント基板回路の立体組立構造体及びその製造方法
JPH0433077A (ja) 1990-05-24 1992-02-04 Matsushita Electric Ind Co Ltd 画像塗りつぶし装置
JPH0433077U (de) * 1990-07-16 1992-03-18
US6067062A (en) * 1990-09-05 2000-05-23 Seiko Instruments Inc. Light valve device
US5347154A (en) * 1990-11-15 1994-09-13 Seiko Instruments Inc. Light valve device using semiconductive composite substrate
US5241454A (en) 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
JPH05224224A (ja) 1992-02-10 1993-09-03 Sharp Corp 液晶表示装置
JPH05303109A (ja) 1992-04-27 1993-11-16 Sanyo Electric Co Ltd 液晶表示装置
US5592199A (en) 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
JPH06235929A (ja) 1993-02-10 1994-08-23 Seiko Epson Corp 液晶表示装置の製造方法および液晶表示装置
US5467210A (en) * 1993-02-16 1995-11-14 Casio Computer Co., Ltd. Arrangement of bonding IC chip to liquid crystal display device
KR0144283B1 (ko) * 1993-10-28 1998-07-15 쯔지 하루오 리워킹이 용이한 소형경량 표시장치 및 그 실장방법
US5841414A (en) 1994-08-16 1998-11-24 Citizen Watch Co., Ltd. Liquid crystal display device
JPH0878954A (ja) 1994-09-08 1996-03-22 Citizen Watch Co Ltd 発振器およびその製造方法
JP3556315B2 (ja) 1995-03-20 2004-08-18 株式会社東芝 表示装置及び半導体素子
JPH0962199A (ja) 1995-08-30 1997-03-07 Toshiba Corp 液晶表示装置
JPH09120079A (ja) 1995-10-26 1997-05-06 Hitachi Ltd 液晶表示装置
JPH10268333A (ja) * 1997-03-27 1998-10-09 Alps Electric Co Ltd 液晶表示装置
KR100233005B1 (ko) * 1997-04-24 1999-12-01 윤종용 Lcd패널과 그 제조방법
JPH1124097A (ja) 1997-07-03 1999-01-29 Citizen Watch Co Ltd 液晶表示装置
JP3873478B2 (ja) * 1997-12-25 2007-01-24 セイコーエプソン株式会社 液晶表示装置、電子機器及び液晶表示装置の製造方法

Also Published As

Publication number Publication date
US7119801B1 (en) 2006-10-10
DE60030612T2 (de) 2007-01-11
JP2000276068A (ja) 2000-10-06
EP1039331B1 (de) 2006-09-13
CN1269521A (zh) 2000-10-11
KR20000071488A (ko) 2000-11-25
EP1039331A3 (de) 2001-01-24
HK1031918A1 (en) 2001-06-29
TWI269913B (en) 2007-01-01
EP1039331A2 (de) 2000-09-27
CN1135424C (zh) 2004-01-21
KR100522321B1 (ko) 2005-10-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition