DE60030467D1 - Ein Herstellungsverfahren von Entkopplungskondensatoren durch lithographische Dummy-Füllmuster - Google Patents

Ein Herstellungsverfahren von Entkopplungskondensatoren durch lithographische Dummy-Füllmuster

Info

Publication number
DE60030467D1
DE60030467D1 DE60030467T DE60030467T DE60030467D1 DE 60030467 D1 DE60030467 D1 DE 60030467D1 DE 60030467 T DE60030467 T DE 60030467T DE 60030467 T DE60030467 T DE 60030467T DE 60030467 D1 DE60030467 D1 DE 60030467D1
Authority
DE
Germany
Prior art keywords
decoupling capacitors
fill patterns
dummy
making
lithographic fill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030467T
Other languages
English (en)
Other versions
DE60030467T2 (de
Inventor
M Reith
Louis Hsu
Henning Haffner
Gunther Lehmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Infineon Technologies North America Corp
Original Assignee
International Business Machines Corp
Infineon Technologies North America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp, Infineon Technologies North America Corp filed Critical International Business Machines Corp
Publication of DE60030467D1 publication Critical patent/DE60030467D1/de
Application granted granted Critical
Publication of DE60030467T2 publication Critical patent/DE60030467T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/50—Peripheral circuit region structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
DE60030467T 1999-11-18 2000-11-02 Ein Herstellungsverfahren von Entkopplungskondensatoren durch lithographische Dummy-Füllmuster Expired - Lifetime DE60030467T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US442890 1999-11-18
US09/442,890 US6232154B1 (en) 1999-11-18 1999-11-18 Optimized decoupling capacitor using lithographic dummy filler
PCT/US2000/030404 WO2001037320A2 (en) 1999-11-18 2000-11-02 Optimized decoupling capacitor using lithographic dummy filler

Publications (2)

Publication Number Publication Date
DE60030467D1 true DE60030467D1 (de) 2006-10-12
DE60030467T2 DE60030467T2 (de) 2007-05-03

Family

ID=23758553

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030467T Expired - Lifetime DE60030467T2 (de) 1999-11-18 2000-11-02 Ein Herstellungsverfahren von Entkopplungskondensatoren durch lithographische Dummy-Füllmuster

Country Status (7)

Country Link
US (2) US6232154B1 (de)
EP (1) EP1232519B1 (de)
JP (1) JP4532803B2 (de)
KR (1) KR20020058019A (de)
DE (1) DE60030467T2 (de)
TW (1) TW473824B (de)
WO (1) WO2001037320A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6157067A (en) * 1999-01-04 2000-12-05 International Business Machines Corporation Metal oxide semiconductor capacitor utilizing dummy lithographic patterns
JP3611468B2 (ja) * 1999-01-19 2005-01-19 松下電器産業株式会社 パターン生成方法
JP2001125943A (ja) * 1999-10-28 2001-05-11 Nec Corp 電源デカップリング回路の設計方法および設計支援システム
JP3912949B2 (ja) * 1999-12-28 2007-05-09 株式会社東芝 フォトマスクの形成方法及び半導体装置の製造方法
US6452250B1 (en) 2000-01-20 2002-09-17 Advanced Micro Devices, Inc. Stacked integrated circuit and capacitor structure containing via structures
US6544837B1 (en) * 2000-03-17 2003-04-08 International Business Machines Corporation SOI stacked DRAM logic
US6898769B2 (en) * 2002-10-10 2005-05-24 International Business Machines Corporation Decoupling capacitor sizing and placement
US6807656B1 (en) * 2003-04-03 2004-10-19 Lsi Logic Corporation Decoupling capacitance estimation and insertion flow for ASIC designs
US7412683B2 (en) * 2004-02-05 2008-08-12 Matsushita Electric Industrial Co., Ltd. Printed wiring board design method, program therefor, recording medium storing the program recorded therein, printed wiring board design device using them and CAD system
KR100610022B1 (ko) * 2005-01-18 2006-08-08 삼성전자주식회사 반도체 메모리 장치
US7689961B2 (en) * 2005-08-10 2010-03-30 International Business Machines Corporation Increased power line noise immunity in IC using capacitor structure in fill area
KR100675281B1 (ko) 2005-09-05 2007-01-29 삼성전자주식회사 디커플링 캐패시터를 갖는 반도체 소자 및 그 제조방법
JP4899666B2 (ja) * 2006-06-30 2012-03-21 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2010067661A (ja) * 2008-09-09 2010-03-25 Nec Electronics Corp 半導体装置
US20100065943A1 (en) * 2008-09-17 2010-03-18 Tien-Chang Chang Method for including decoupling capacitors into semiconductor circuit having logic circuit therein and semiconductor circuit thereof
US20100181847A1 (en) 2009-01-22 2010-07-22 Shen-Yu Huang Method for reducing supply voltage drop in digital circuit block and related layout architecture
JP5547934B2 (ja) * 2009-09-09 2014-07-16 ラピスセミコンダクタ株式会社 半導体装置、半導体装置の製造方法、及び半導体装置のレイアウト方法
CN110162913B (zh) * 2019-05-30 2023-08-29 上海华虹宏力半导体制造有限公司 一种电容版图设计方法
CN112530933B (zh) 2019-09-18 2024-03-22 铠侠股份有限公司 半导体装置
US11296093B2 (en) * 2020-02-28 2022-04-05 International Business Machines Corporation Deep trench capacitor distribution
TWI749645B (zh) * 2020-07-17 2021-12-11 瑞昱半導體股份有限公司 半導體裝置以及金氧半電容器結構
US11688680B2 (en) 2020-11-05 2023-06-27 International Business Machines Corporation MIM capacitor structures
TWI755932B (zh) * 2020-11-17 2022-02-21 華邦電子股份有限公司 用以量測重疊狀態的布局
KR102501412B1 (ko) * 2021-10-06 2023-02-21 주식회사 키파운드리 프로그램 시간을 줄이기 위한 병렬 프로그램이 가능한 비휘발성 메모리 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828476B2 (ja) * 1991-06-07 1996-03-21 富士通株式会社 半導体装置及びその製造方法
JP2827675B2 (ja) * 1992-03-26 1998-11-25 日本電気株式会社 半導体記憶装置
SE470415B (sv) * 1992-07-06 1994-02-14 Ericsson Telefon Ab L M Kondensator med hög kapacitans i ett integrerat funktionsblock eller en integrerad krets, förfarande för framställning av kondensatorn och användning av kondensatorn som en integrerad avkopplingskondensator
KR0183739B1 (ko) * 1995-09-19 1999-03-20 김광호 감결합 커패시터를 포함하는 반도체 장치 및 그 제조방법
US5885856A (en) * 1996-08-21 1999-03-23 Motorola, Inc. Integrated circuit having a dummy structure and method of making
DE19703611A1 (de) * 1997-01-31 1998-08-06 Siemens Ag Anwendungsspezifisches integriertes Halbleiterprodukt mit Dummy-Elementen
US5998846A (en) * 1998-03-30 1999-12-07 Vanguard International Semiconductor Corporation Layout structure of multi-use coupling capacitors in reducing ground bounces and replacing faulty logic components
US6157067A (en) * 1999-01-04 2000-12-05 International Business Machines Corporation Metal oxide semiconductor capacitor utilizing dummy lithographic patterns

Also Published As

Publication number Publication date
EP1232519A2 (de) 2002-08-21
US6232154B1 (en) 2001-05-15
DE60030467T2 (de) 2007-05-03
TW473824B (en) 2002-01-21
JP4532803B2 (ja) 2010-08-25
WO2001037320A3 (en) 2001-12-06
KR20020058019A (ko) 2002-07-12
WO2001037320A2 (en) 2001-05-25
EP1232519B1 (de) 2006-08-30
US6353248B1 (en) 2002-03-05
JP2003514391A (ja) 2003-04-15

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