DE60015205T2 - Verfahren und Vorrichtung zur Steuerung einer variablen Apertur in einem Ionenimplantierungsgerät - Google Patents

Verfahren und Vorrichtung zur Steuerung einer variablen Apertur in einem Ionenimplantierungsgerät Download PDF

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Publication number
DE60015205T2
DE60015205T2 DE60015205T DE60015205T DE60015205T2 DE 60015205 T2 DE60015205 T2 DE 60015205T2 DE 60015205 T DE60015205 T DE 60015205T DE 60015205 T DE60015205 T DE 60015205T DE 60015205 T2 DE60015205 T2 DE 60015205T2
Authority
DE
Germany
Prior art keywords
ion beam
beam current
current
aperture
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60015205T
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German (de)
English (en)
Other versions
DE60015205D1 (de
Inventor
Paul Ashby Georgetown Loomis
Hans Jurg Lexington Rutishauser
Jun Beverly Lu
Michiro Niihama-shi Sugitani
Toru Niihama-shi Murakami
Hiroshi Saijo-shi Sogabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of DE60015205D1 publication Critical patent/DE60015205D1/de
Application granted granted Critical
Publication of DE60015205T2 publication Critical patent/DE60015205T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/09Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Physical Vapour Deposition (AREA)
DE60015205T 1999-02-19 2000-02-16 Verfahren und Vorrichtung zur Steuerung einer variablen Apertur in einem Ionenimplantierungsgerät Expired - Lifetime DE60015205T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/253,374 US6194734B1 (en) 1999-02-19 1999-02-19 Method and system for operating a variable aperture in an ion implanter
US253374 1999-02-19

Publications (2)

Publication Number Publication Date
DE60015205D1 DE60015205D1 (de) 2004-12-02
DE60015205T2 true DE60015205T2 (de) 2006-02-16

Family

ID=22960001

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60015205T Expired - Lifetime DE60015205T2 (de) 1999-02-19 2000-02-16 Verfahren und Vorrichtung zur Steuerung einer variablen Apertur in einem Ionenimplantierungsgerät

Country Status (7)

Country Link
US (1) US6194734B1 (enExample)
EP (1) EP1030343B1 (enExample)
JP (1) JP4692695B2 (enExample)
KR (1) KR100479375B1 (enExample)
DE (1) DE60015205T2 (enExample)
SG (1) SG82675A1 (enExample)
TW (1) TW448467B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6423976B1 (en) * 1999-05-28 2002-07-23 Applied Materials, Inc. Ion implanter and a method of implanting ions
US6403972B1 (en) * 1999-07-08 2002-06-11 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for alignment of ion beam systems using beam current sensors
JP3926745B2 (ja) * 2001-01-18 2007-06-06 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド イオン注入のための開口を制限する,調節可能なコンダクタンス
JP2003086400A (ja) * 2001-09-11 2003-03-20 Hitachi Ltd 加速器システム及び医療用加速器施設
US6777695B2 (en) 2002-07-12 2004-08-17 Varian Semiconductors Equipment Associates, Inc. Rotating beam ion implanter
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
US7217940B2 (en) * 2003-04-08 2007-05-15 Cymer, Inc. Collector for EUV light source
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
EP1916694A1 (en) * 2006-10-25 2008-04-30 ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik Mbh Adjustable aperture element for particle beam device, method of operating and manufacturing thereof
US7915597B2 (en) 2008-03-18 2011-03-29 Axcelis Technologies, Inc. Extraction electrode system for high current ion implanter
RU2395619C1 (ru) * 2008-12-08 2010-07-27 Федеральное государственное унитарное предприятие Научно-исследовательский институт комплексных испытаний оптико-электронных приборов и систем (ФГУП НИИКИ ОЭП) Способ получения легированных слоев ионной имплантацией
US8669539B2 (en) * 2010-03-29 2014-03-11 Advanced Ion Beam Technology, Inc. Implant method and implanter by using a variable aperture
US8278623B2 (en) * 2011-01-14 2012-10-02 Kla-Tencor Corporation High-vacuum variable aperture mechanism and method of using same
KR101769493B1 (ko) * 2011-12-23 2017-08-30 주식회사 원익아이피에스 기판처리장치 및 그를 가지는 기판처리시스템
JP6253362B2 (ja) * 2013-11-21 2017-12-27 住友重機械イオンテクノロジー株式会社 高エネルギーイオン注入装置、ビーム電流調整装置、及びビーム電流調整方法
JP6242314B2 (ja) * 2014-09-11 2017-12-06 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオンビームの調整方法
US9953801B1 (en) 2016-11-29 2018-04-24 Axcelis Technologies, Inc. Two-axis variable width mass resolving aperture with fast acting shutter motion
CN107195518A (zh) * 2017-06-22 2017-09-22 京东方科技集团股份有限公司 离子注入量调节装置及方法、离子注入设备、判断方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017403A (en) 1974-07-31 1977-04-12 United Kingdom Atomic Energy Authority Ion beam separators
GB1518282A (en) * 1974-07-31 1978-07-19 Atomic Energy Authority Uk Ion beam separators
JPS62272437A (ja) 1986-05-21 1987-11-26 Mitsubishi Electric Corp イオン注入装置用質量分析装置
JP3034009B2 (ja) * 1990-10-22 2000-04-17 株式会社日立製作所 イオン打込み装置
US5130552A (en) * 1990-12-17 1992-07-14 Applied Materials, Inc. Improved ion implantation using a variable mass resolving system
JP2668472B2 (ja) * 1991-10-17 1997-10-27 信越化学工業株式会社 含フッ素有機ケイ素化合物
JPH0620618A (ja) * 1992-07-02 1994-01-28 Fujitsu Ltd イオン注入装置
US5486702A (en) * 1993-09-21 1996-01-23 Genus, Inc. Scan technique to reduce transient wafer temperatures during ion implantation
JP3365066B2 (ja) * 1994-04-27 2003-01-08 日新電機株式会社 イオン注入方法およびその装置
JPH0945274A (ja) * 1995-07-31 1997-02-14 Nissin Electric Co Ltd イオン注入装置のドーズ量補正装置
US5640012A (en) * 1995-08-25 1997-06-17 Gatan, Inc. Precision-controlled slit mechanism for electron microscope
US5780863A (en) * 1997-04-29 1998-07-14 Eaton Corporation Accelerator-decelerator electrostatic lens for variably focusing and mass resolving an ion beam in an ion implanter
US5998798A (en) * 1998-06-11 1999-12-07 Eaton Corporation Ion dosage measurement apparatus for an ion beam implanter and method

Also Published As

Publication number Publication date
KR100479375B1 (ko) 2005-03-28
DE60015205D1 (de) 2004-12-02
SG82675A1 (en) 2001-08-21
US6194734B1 (en) 2001-02-27
JP2000243341A (ja) 2000-09-08
JP4692695B2 (ja) 2011-06-01
EP1030343A2 (en) 2000-08-23
EP1030343B1 (en) 2004-10-27
KR20010006660A (ko) 2001-01-26
TW448467B (en) 2001-08-01
EP1030343A3 (en) 2001-05-02

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