JP4692695B2 - イオン注入装置における可変開口を操作する方法および装置 - Google Patents
イオン注入装置における可変開口を操作する方法および装置 Download PDFInfo
- Publication number
- JP4692695B2 JP4692695B2 JP2000039407A JP2000039407A JP4692695B2 JP 4692695 B2 JP4692695 B2 JP 4692695B2 JP 2000039407 A JP2000039407 A JP 2000039407A JP 2000039407 A JP2000039407 A JP 2000039407A JP 4692695 B2 JP4692695 B2 JP 4692695B2
- Authority
- JP
- Japan
- Prior art keywords
- ion beam
- beam current
- opening
- detector
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/253,374 US6194734B1 (en) | 1999-02-19 | 1999-02-19 | Method and system for operating a variable aperture in an ion implanter |
| US253374 | 1999-02-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000243341A JP2000243341A (ja) | 2000-09-08 |
| JP2000243341A5 JP2000243341A5 (enExample) | 2007-02-22 |
| JP4692695B2 true JP4692695B2 (ja) | 2011-06-01 |
Family
ID=22960001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000039407A Expired - Lifetime JP4692695B2 (ja) | 1999-02-19 | 2000-02-17 | イオン注入装置における可変開口を操作する方法および装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6194734B1 (enExample) |
| EP (1) | EP1030343B1 (enExample) |
| JP (1) | JP4692695B2 (enExample) |
| KR (1) | KR100479375B1 (enExample) |
| DE (1) | DE60015205T2 (enExample) |
| SG (1) | SG82675A1 (enExample) |
| TW (1) | TW448467B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9269541B2 (en) | 2013-11-21 | 2016-02-23 | Sumitomo Heavy Industries Ion Technology Co., Ltd. | High energy ion implanter, beam current adjuster, and beam current adjustment method |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423976B1 (en) * | 1999-05-28 | 2002-07-23 | Applied Materials, Inc. | Ion implanter and a method of implanting ions |
| US6403972B1 (en) * | 1999-07-08 | 2002-06-11 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for alignment of ion beam systems using beam current sensors |
| JP3926745B2 (ja) * | 2001-01-18 | 2007-06-06 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | イオン注入のための開口を制限する,調節可能なコンダクタンス |
| JP2003086400A (ja) * | 2001-09-11 | 2003-03-20 | Hitachi Ltd | 加速器システム及び医療用加速器施設 |
| US6777695B2 (en) | 2002-07-12 | 2004-08-17 | Varian Semiconductors Equipment Associates, Inc. | Rotating beam ion implanter |
| US6828572B2 (en) * | 2003-04-01 | 2004-12-07 | Axcelis Technologies, Inc. | Ion beam incident angle detector for ion implant systems |
| US7217940B2 (en) * | 2003-04-08 | 2007-05-15 | Cymer, Inc. | Collector for EUV light source |
| US7629597B2 (en) * | 2006-08-18 | 2009-12-08 | Axcelis Technologies, Inc. | Deposition reduction system for an ion implanter |
| EP1916694A1 (en) * | 2006-10-25 | 2008-04-30 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik Mbh | Adjustable aperture element for particle beam device, method of operating and manufacturing thereof |
| US7915597B2 (en) | 2008-03-18 | 2011-03-29 | Axcelis Technologies, Inc. | Extraction electrode system for high current ion implanter |
| RU2395619C1 (ru) * | 2008-12-08 | 2010-07-27 | Федеральное государственное унитарное предприятие Научно-исследовательский институт комплексных испытаний оптико-электронных приборов и систем (ФГУП НИИКИ ОЭП) | Способ получения легированных слоев ионной имплантацией |
| US8669539B2 (en) * | 2010-03-29 | 2014-03-11 | Advanced Ion Beam Technology, Inc. | Implant method and implanter by using a variable aperture |
| US8278623B2 (en) * | 2011-01-14 | 2012-10-02 | Kla-Tencor Corporation | High-vacuum variable aperture mechanism and method of using same |
| KR101769493B1 (ko) * | 2011-12-23 | 2017-08-30 | 주식회사 원익아이피에스 | 기판처리장치 및 그를 가지는 기판처리시스템 |
| JP6242314B2 (ja) * | 2014-09-11 | 2017-12-06 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置及びイオンビームの調整方法 |
| US9953801B1 (en) | 2016-11-29 | 2018-04-24 | Axcelis Technologies, Inc. | Two-axis variable width mass resolving aperture with fast acting shutter motion |
| CN107195518A (zh) * | 2017-06-22 | 2017-09-22 | 京东方科技集团股份有限公司 | 离子注入量调节装置及方法、离子注入设备、判断方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4017403A (en) | 1974-07-31 | 1977-04-12 | United Kingdom Atomic Energy Authority | Ion beam separators |
| GB1518282A (en) * | 1974-07-31 | 1978-07-19 | Atomic Energy Authority Uk | Ion beam separators |
| JPS62272437A (ja) | 1986-05-21 | 1987-11-26 | Mitsubishi Electric Corp | イオン注入装置用質量分析装置 |
| JP3034009B2 (ja) * | 1990-10-22 | 2000-04-17 | 株式会社日立製作所 | イオン打込み装置 |
| US5130552A (en) * | 1990-12-17 | 1992-07-14 | Applied Materials, Inc. | Improved ion implantation using a variable mass resolving system |
| JP2668472B2 (ja) * | 1991-10-17 | 1997-10-27 | 信越化学工業株式会社 | 含フッ素有機ケイ素化合物 |
| JPH0620618A (ja) * | 1992-07-02 | 1994-01-28 | Fujitsu Ltd | イオン注入装置 |
| US5486702A (en) * | 1993-09-21 | 1996-01-23 | Genus, Inc. | Scan technique to reduce transient wafer temperatures during ion implantation |
| JP3365066B2 (ja) * | 1994-04-27 | 2003-01-08 | 日新電機株式会社 | イオン注入方法およびその装置 |
| JPH0945274A (ja) * | 1995-07-31 | 1997-02-14 | Nissin Electric Co Ltd | イオン注入装置のドーズ量補正装置 |
| US5640012A (en) * | 1995-08-25 | 1997-06-17 | Gatan, Inc. | Precision-controlled slit mechanism for electron microscope |
| US5780863A (en) * | 1997-04-29 | 1998-07-14 | Eaton Corporation | Accelerator-decelerator electrostatic lens for variably focusing and mass resolving an ion beam in an ion implanter |
| US5998798A (en) * | 1998-06-11 | 1999-12-07 | Eaton Corporation | Ion dosage measurement apparatus for an ion beam implanter and method |
-
1999
- 1999-02-19 US US09/253,374 patent/US6194734B1/en not_active Expired - Lifetime
-
2000
- 2000-02-03 TW TW089101937A patent/TW448467B/zh not_active IP Right Cessation
- 2000-02-08 SG SG200000741A patent/SG82675A1/en unknown
- 2000-02-16 EP EP20000301219 patent/EP1030343B1/en not_active Expired - Lifetime
- 2000-02-16 DE DE60015205T patent/DE60015205T2/de not_active Expired - Lifetime
- 2000-02-17 JP JP2000039407A patent/JP4692695B2/ja not_active Expired - Lifetime
- 2000-02-19 KR KR10-2000-0008026A patent/KR100479375B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9269541B2 (en) | 2013-11-21 | 2016-02-23 | Sumitomo Heavy Industries Ion Technology Co., Ltd. | High energy ion implanter, beam current adjuster, and beam current adjustment method |
| US9576771B2 (en) | 2013-11-21 | 2017-02-21 | Sumitomo Heavy Industries Ion Technology Co., Ltd. | High energy ion implanter, beam current adjuster, and beam current adjustment method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100479375B1 (ko) | 2005-03-28 |
| DE60015205D1 (de) | 2004-12-02 |
| SG82675A1 (en) | 2001-08-21 |
| US6194734B1 (en) | 2001-02-27 |
| JP2000243341A (ja) | 2000-09-08 |
| EP1030343A2 (en) | 2000-08-23 |
| DE60015205T2 (de) | 2006-02-16 |
| EP1030343B1 (en) | 2004-10-27 |
| KR20010006660A (ko) | 2001-01-26 |
| TW448467B (en) | 2001-08-01 |
| EP1030343A3 (en) | 2001-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4915490B2 (ja) | イオン注入装置用の可変開口アセンブリ、ビームラインアセンブリ及びそのための制御装置 | |
| JP4692695B2 (ja) | イオン注入装置における可変開口を操作する方法および装置 | |
| US4743767A (en) | Systems and methods for ion implantation | |
| US4980562A (en) | Method and apparatus for high efficiency scanning in an ion implanter | |
| US5811823A (en) | Control mechanisms for dosimetry control in ion implantation systems | |
| US5834786A (en) | High current ribbon beam ion implanter | |
| US4754200A (en) | Systems and methods for ion source control in ion implanters | |
| JP5467430B2 (ja) | イオン注入機に用いる装置及びイオン注入を実行する方法 | |
| US4517465A (en) | Ion implantation control system | |
| KR101380149B1 (ko) | 이온 주입기를 위한 패러데이 컵의 자기적 모니터링 | |
| WO1998002900A9 (en) | High current ribbon beam ion implanter | |
| IL154563A (en) | Methods and device for adjusting the parallelism of a beam in ion implants | |
| KR19990088180A (ko) | 광방출분광학을사용하는이온주입제어시스템 | |
| KR20020020933A (ko) | 빔 전류 센서를 사용하여 이온 빔 시스템을 정렬하기 위한방법 및 장치 | |
| EP0942453A2 (en) | Monitoring of plasma constituents using optical emission spectroscopy | |
| TWI778990B (zh) | 具有快速作用的遮閉器動作的雙軸可變寬度之質量解析孔隙 | |
| KR20070084347A (ko) | 주사된 이온 주입 중 선량 균일도의 개선 | |
| US7189980B2 (en) | Methods and systems for optimizing ion implantation uniformity control | |
| KR101819972B1 (ko) | 입자 가속기의 빔 전하량 극대화 장치 및 이를 이용한 입자 가속기의 빔 전하량 극대화 방법 | |
| US6693289B1 (en) | Operationally positionable source magnet field | |
| JPH03219544A (ja) | 荷電粒子注入装置 | |
| EP0701268A1 (en) | Ion implantation apparatus | |
| US20250336642A1 (en) | Energy accuracy for an rf linear accelerator ion implantation system | |
| JPS62271339A (ja) | イオン打込装置 | |
| WO2002084713A2 (en) | Occluding beamline ion implanter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061227 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090701 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090930 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20091005 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091030 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100602 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100831 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101006 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110105 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110126 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110208 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140304 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4692695 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |