DE60005801D1 - Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält - Google Patents

Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält

Info

Publication number
DE60005801D1
DE60005801D1 DE60005801T DE60005801T DE60005801D1 DE 60005801 D1 DE60005801 D1 DE 60005801D1 DE 60005801 T DE60005801 T DE 60005801T DE 60005801 T DE60005801 T DE 60005801T DE 60005801 D1 DE60005801 D1 DE 60005801D1
Authority
DE
Germany
Prior art keywords
circuit
object containing
recycling waste
soldered components
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60005801T
Other languages
English (en)
Other versions
DE60005801T2 (de
Inventor
Kenichiro Suetsugu
Shunji Hibino
Masato Hirano
Atsushi Yamaguchi
Mikiya Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60005801D1 publication Critical patent/DE60005801D1/de
Application granted granted Critical
Publication of DE60005801T2 publication Critical patent/DE60005801T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/06—Obtaining tin from scrap, especially tin scrap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B13/00—Obtaining lead
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H2009/0077—Details of switching devices, not covered by groups H01H1/00 - H01H7/00 using recyclable materials, e.g. for easier recycling or minimising the packing material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Solid Wastes (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
DE2000605801 1999-01-11 2000-01-07 Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält Expired - Lifetime DE60005801T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP441199 1999-01-11
JP441199 1999-01-11

Publications (2)

Publication Number Publication Date
DE60005801D1 true DE60005801D1 (de) 2003-11-13
DE60005801T2 DE60005801T2 (de) 2004-08-12

Family

ID=11583581

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2000605801 Expired - Lifetime DE60005801T2 (de) 1999-01-11 2000-01-07 Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält
DE2000602048 Expired - Lifetime DE60002048T2 (de) 1999-01-11 2000-01-07 Gegenstand, der eine schaltung mit gelöteten bauteilen enthält und verfahren zur wiederverwertung seiner abfälle

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE2000602048 Expired - Lifetime DE60002048T2 (de) 1999-01-11 2000-01-07 Gegenstand, der eine schaltung mit gelöteten bauteilen enthält und verfahren zur wiederverwertung seiner abfälle

Country Status (8)

Country Link
US (2) US7540078B1 (de)
EP (2) EP1156706B1 (de)
JP (1) JP4960331B2 (de)
KR (1) KR100560235B1 (de)
CN (2) CN1197440C (de)
DE (2) DE60005801T2 (de)
TW (1) TW443954B (de)
WO (1) WO2000042829A1 (de)

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US6817527B2 (en) * 2002-06-28 2004-11-16 Nokia Corporation Carriers for printed circuit board marking
US7562025B2 (en) 2003-09-19 2009-07-14 Vesta Medical, Llc Waste sorting system with query function, and method thereof
US7660724B2 (en) * 2003-09-19 2010-02-09 Vesta Medical, Llc Waste sorting system utilizing removable liners
US7119689B2 (en) * 2003-09-19 2006-10-10 Vesta Medical, Llc System and method for sorting medical waste for disposal
CN102166580A (zh) * 2010-12-16 2011-08-31 广东奥美特集团有限公司 一种废冰箱破碎分选资源再利用方法
EP2668834A1 (de) * 2011-01-30 2013-12-04 Koninklijke Philips N.V. Anordnung aus bestückten leiterplatten
CN103340021B (zh) * 2011-01-30 2016-11-02 皇家飞利浦电子股份有限公司 印刷电路板装配件
KR20130063458A (ko) * 2011-12-06 2013-06-14 (주) 네톰 전자제품의 금속자원 정보 시스템
US9504174B2 (en) * 2012-08-09 2016-11-22 A. Raymond Et Cie Electrical connector for attachment to vehicle glass
CN103611996B (zh) * 2013-10-24 2016-03-23 中国航天科技集团公司第九研究院第七七一研究所 一种板间连接器长引针的焊接方法
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
JP6103547B2 (ja) * 2015-01-09 2017-03-29 三菱電機株式会社 電子基板ユニット
MX2018009615A (es) * 2016-02-08 2019-05-06 Newsouth Innovations Pty Ltd Un metodo, aparato y sistema para procesar una fuente de desechos compuestos.
CN106129760B (zh) * 2016-06-28 2018-10-16 湖北三江航天万峰科技发展有限公司 一种高密度多排列镀金引脚板间连接器的装焊方法

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Also Published As

Publication number Publication date
US20080210604A1 (en) 2008-09-04
CN1187138C (zh) 2005-02-02
JP4960331B2 (ja) 2012-06-27
JP2009044180A (ja) 2009-02-26
DE60002048T2 (de) 2003-10-23
EP1151646A1 (de) 2001-11-07
CN1197440C (zh) 2005-04-13
US7540078B1 (en) 2009-06-02
EP1156706B1 (de) 2003-10-08
DE60002048D1 (de) 2003-05-15
EP1156706A1 (de) 2001-11-21
WO2000042829A1 (en) 2000-07-20
CN1337144A (zh) 2002-02-20
TW443954B (en) 2001-07-01
KR20010089804A (ko) 2001-10-08
DE60005801T2 (de) 2004-08-12
CN1363427A (zh) 2002-08-14
KR100560235B1 (ko) 2006-03-10
EP1151646B1 (de) 2003-04-09

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Owner name: PANASONIC CORP., KADOMA, OSAKA, JP