DE69016113T2 - Verfahren zur Korrosionsinhibierung in einer elektronischen Packung. - Google Patents
Verfahren zur Korrosionsinhibierung in einer elektronischen Packung.Info
- Publication number
- DE69016113T2 DE69016113T2 DE69016113T DE69016113T DE69016113T2 DE 69016113 T2 DE69016113 T2 DE 69016113T2 DE 69016113 T DE69016113 T DE 69016113T DE 69016113 T DE69016113 T DE 69016113T DE 69016113 T2 DE69016113 T2 DE 69016113T2
- Authority
- DE
- Germany
- Prior art keywords
- electronic package
- inhibiting corrosion
- inhibiting
- corrosion
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F15/00—Other methods of preventing corrosion or incrustation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/370,355 US5049201A (en) | 1989-06-22 | 1989-06-22 | Method of inhibiting corrosion in an electronic package |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69016113D1 DE69016113D1 (de) | 1995-03-02 |
DE69016113T2 true DE69016113T2 (de) | 1995-06-29 |
Family
ID=23459279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69016113T Expired - Fee Related DE69016113T2 (de) | 1989-06-22 | 1990-04-10 | Verfahren zur Korrosionsinhibierung in einer elektronischen Packung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5049201A (de) |
EP (1) | EP0407324B1 (de) |
JP (1) | JPH0760929B2 (de) |
DE (1) | DE69016113T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4002327A1 (de) * | 1990-01-26 | 1991-08-01 | Wacker Chemitronic | Verfahren zur nasschemischen behandlung von halbleiteroberflaechen und loesung zu seiner durchfuehrung |
US6121217A (en) | 1990-11-05 | 2000-09-19 | Ekc Technology, Inc. | Alkanolamine semiconductor process residue removal composition and process |
US6242400B1 (en) | 1990-11-05 | 2001-06-05 | Ekc Technology, Inc. | Method of stripping resists from substrates using hydroxylamine and alkanolamine |
US7205265B2 (en) * | 1990-11-05 | 2007-04-17 | Ekc Technology, Inc. | Cleaning compositions and methods of use thereof |
US20040018949A1 (en) * | 1990-11-05 | 2004-01-29 | Wai Mun Lee | Semiconductor process residue removal composition and process |
US6000411A (en) * | 1990-11-05 | 1999-12-14 | Ekc Technology, Inc. | Cleaning compositions for removing etching residue and method of using |
US6110881A (en) * | 1990-11-05 | 2000-08-29 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
US5753601A (en) * | 1991-01-25 | 1998-05-19 | Ashland Inc | Organic stripping composition |
US5332444A (en) * | 1992-11-25 | 1994-07-26 | Air Products And Chemicals, Inc. | Gas phase cleaning agents for removing metal containing contaminants from integrated circuit assemblies and a process for using the same |
US7144849B2 (en) * | 1993-06-21 | 2006-12-05 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
JPH08231989A (ja) * | 1995-02-23 | 1996-09-10 | Kurita Water Ind Ltd | 洗浄剤組成物及び洗浄方法 |
DE19631363C1 (de) * | 1996-08-02 | 1998-02-12 | Siemens Ag | Wässrige Reinigungslösung für ein Halbleitersubstrat |
US6066609A (en) * | 1997-07-31 | 2000-05-23 | Siemens Aktiengesellschaft | Aqueous solution for cleaning a semiconductor substrate |
US6147225A (en) * | 1998-06-02 | 2000-11-14 | Betzdearborn Inc. | Thiacrown ether compound |
US6187227B1 (en) * | 1998-06-02 | 2001-02-13 | Betzdearborn | Thiacrown ether compound corrosion inhibitors for alkanolamine units |
US6641933B1 (en) * | 1999-09-24 | 2003-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting EL display device |
DE102015121344B4 (de) | 2015-12-08 | 2023-11-02 | Infineon Technologies Austria Ag | Halbleitervorrichtung und verfahren zu ihrer herstellung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
US4271425A (en) * | 1979-11-02 | 1981-06-02 | Western Electric Company, Inc. | Encapsulated electronic devices and encapsulating compositions having crown ethers |
US4396796A (en) * | 1980-10-30 | 1983-08-02 | Western Electric Company, Inc. | Encapsulated electronic devices and encapsulating compositions |
US4711853A (en) * | 1982-06-07 | 1987-12-08 | The President And Trustees Of The Miami University | Method of detecting potassium ions using trifluoromethyl-substituted chromogenic crown ethers |
SU1344814A1 (ru) * | 1985-07-08 | 1987-10-15 | Всесоюзный Научно-Исследовательский Инструментальный Институт | Раствор дл очистки поверхности металлических изделий |
JPH02103292A (ja) * | 1988-10-12 | 1990-04-16 | Fujitsu Ltd | フラックス残渣洗浄液 |
JPH03208343A (ja) * | 1990-01-10 | 1991-09-11 | Fujitsu Ltd | 半導体基板用洗浄剤 |
DE4002327A1 (de) * | 1990-01-26 | 1991-08-01 | Wacker Chemitronic | Verfahren zur nasschemischen behandlung von halbleiteroberflaechen und loesung zu seiner durchfuehrung |
-
1989
- 1989-06-22 US US07/370,355 patent/US5049201A/en not_active Expired - Fee Related
-
1990
- 1990-04-10 EP EP90480057A patent/EP0407324B1/de not_active Expired - Lifetime
- 1990-04-10 DE DE69016113T patent/DE69016113T2/de not_active Expired - Fee Related
- 1990-06-20 JP JP2160065A patent/JPH0760929B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69016113D1 (de) | 1995-03-02 |
JPH0760929B2 (ja) | 1995-06-28 |
EP0407324A2 (de) | 1991-01-09 |
JPH0344091A (ja) | 1991-02-25 |
US5049201A (en) | 1991-09-17 |
EP0407324B1 (de) | 1995-01-18 |
EP0407324A3 (en) | 1993-03-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |