DE60002048D1 - Gegenstand, der eine schaltung mit gelöteten bauteilen enthält und verfahren zur wiederverwertung seiner abfälle - Google Patents
Gegenstand, der eine schaltung mit gelöteten bauteilen enthält und verfahren zur wiederverwertung seiner abfälleInfo
- Publication number
- DE60002048D1 DE60002048D1 DE60002048T DE60002048T DE60002048D1 DE 60002048 D1 DE60002048 D1 DE 60002048D1 DE 60002048 T DE60002048 T DE 60002048T DE 60002048 T DE60002048 T DE 60002048T DE 60002048 D1 DE60002048 D1 DE 60002048D1
- Authority
- DE
- Germany
- Prior art keywords
- recycling
- waste
- circuit
- object containing
- soldered components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B13/00—Obtaining lead
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H2009/0077—Details of switching devices, not covered by groups H01H1/00 - H01H7/00 using recyclable materials, e.g. for easier recycling or minimising the packing material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49819—Disassembling with conveying of work or disassembled work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49821—Disassembling by altering or destroying work part or connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49822—Disassembling by applying force
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Processing Of Solid Wastes (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP441199 | 1999-01-11 | ||
PCT/JP2000/000058 WO2000042829A1 (en) | 1999-01-11 | 2000-01-07 | Article having a circuit soldered with parts and method for recycling wastes of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60002048D1 true DE60002048D1 (de) | 2003-05-15 |
DE60002048T2 DE60002048T2 (de) | 2003-10-23 |
Family
ID=11583581
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60002048T Expired - Lifetime DE60002048T2 (de) | 1999-01-11 | 2000-01-07 | Gegenstand, der eine schaltung mit gelöteten bauteilen enthält und verfahren zur wiederverwertung seiner abfälle |
DE2000605801 Expired - Lifetime DE60005801T2 (de) | 1999-01-11 | 2000-01-07 | Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2000605801 Expired - Lifetime DE60005801T2 (de) | 1999-01-11 | 2000-01-07 | Verfahren zur Wiederverwertung von Abfällen eines Gegenstands, der eine Schaltung mit gelöteten Bauteilen enthält |
Country Status (8)
Country | Link |
---|---|
US (2) | US7540078B1 (de) |
EP (2) | EP1156706B1 (de) |
JP (1) | JP4960331B2 (de) |
KR (1) | KR100560235B1 (de) |
CN (2) | CN1187138C (de) |
DE (2) | DE60002048T2 (de) |
TW (1) | TW443954B (de) |
WO (1) | WO2000042829A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3838964B2 (ja) | 2002-03-13 | 2006-10-25 | 株式会社リコー | 機能性素子基板の製造装置 |
US7318265B2 (en) * | 2002-06-03 | 2008-01-15 | Mitsubishi Denki Kabushiki Kaisha | Recovery method for an electric appliance |
US6817527B2 (en) * | 2002-06-28 | 2004-11-16 | Nokia Corporation | Carriers for printed circuit board marking |
US7660724B2 (en) * | 2003-09-19 | 2010-02-09 | Vesta Medical, Llc | Waste sorting system utilizing removable liners |
US7562025B2 (en) * | 2003-09-19 | 2009-07-14 | Vesta Medical, Llc | Waste sorting system with query function, and method thereof |
US7119689B2 (en) * | 2003-09-19 | 2006-10-10 | Vesta Medical, Llc | System and method for sorting medical waste for disposal |
CN102166580A (zh) * | 2010-12-16 | 2011-08-31 | 广东奥美特集团有限公司 | 一种废冰箱破碎分选资源再利用方法 |
JP6138698B2 (ja) * | 2011-01-30 | 2017-05-31 | フィリップス ライティング ホールディング ビー ヴィ | プリント回路基板アセンブリ |
CN103340021B (zh) * | 2011-01-30 | 2016-11-02 | 皇家飞利浦电子股份有限公司 | 印刷电路板装配件 |
KR20130063459A (ko) * | 2011-12-06 | 2013-06-14 | (주) 네톰 | 전자제품의 금속자원 정보 시스템 |
CN104769777A (zh) * | 2012-08-09 | 2015-07-08 | 阿雷蒙公司 | 与车辆玻璃连接的电连接器 |
CN103611996B (zh) * | 2013-10-24 | 2016-03-23 | 中国航天科技集团公司第九研究院第七七一研究所 | 一种板间连接器长引针的焊接方法 |
US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
JP6103547B2 (ja) * | 2015-01-09 | 2017-03-29 | 三菱電機株式会社 | 電子基板ユニット |
RU2018131951A (ru) * | 2016-02-08 | 2020-03-11 | НЬЮСАУС ИННОВЕЙШЕНС ПиТиУай ЛИМИТЕД | Способ, устройство и система для переработки источника отходов со сложным составом |
CN106129760B (zh) * | 2016-06-28 | 2018-10-16 | 湖北三江航天万峰科技发展有限公司 | 一种高密度多排列镀金引脚板间连接器的装焊方法 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637693A (en) | 1979-09-05 | 1981-04-11 | Mitsui Mining & Smelting Co | Method of treating scraps for printed board and like |
JPH088966Y2 (ja) * | 1989-09-29 | 1996-03-13 | グローリー工業株式会社 | 紙葉類結束装置 |
US5654902A (en) * | 1993-05-03 | 1997-08-05 | Sony Deutschland Gmbh | Recyclable component with data storage for storing information for examining the component and product including such a component |
JPH0766512A (ja) * | 1993-08-30 | 1995-03-10 | Canon Inc | プリント基板 |
JP3424325B2 (ja) * | 1994-06-01 | 2003-07-07 | 株式会社日立製作所 | プリント基板およびその製造方法 |
JPH088500A (ja) | 1994-06-22 | 1996-01-12 | Matsushita Electric Ind Co Ltd | 識別マーク付加基板、基板の識別方法と実装支援方法およびその装置 |
DE4424385A1 (de) * | 1994-07-13 | 1996-01-18 | Frank Neelen | Verfahren und Vorrichtung zum Recyceln von Elektronikplatinen und Bauteilen |
US5629981A (en) * | 1994-07-29 | 1997-05-13 | Texas Instruments Incorporated | Information management and security system |
FR2724529B1 (fr) * | 1994-09-09 | 1996-12-20 | Demovale | Procede de destruction d'appareils electroniques |
JP3232963B2 (ja) * | 1994-10-11 | 2001-11-26 | 株式会社日立製作所 | 有機基板接続用鉛レスはんだ及びそれを用いた実装品 |
JP3569033B2 (ja) * | 1995-04-12 | 2004-09-22 | 株式会社リコー | リサイクル可能な部品を有する製品 |
GB2315488B (en) * | 1995-05-27 | 1999-07-21 | Ricoh Kk | Product including parts which can be recycled |
JP2713231B2 (ja) * | 1995-05-19 | 1998-02-16 | 日本電気株式会社 | 電子部品を実装したプリント基板からの有価物の回収方法 |
JPH08318223A (ja) * | 1995-05-26 | 1996-12-03 | Ricoh Co Ltd | 電池分別装置 |
US5547134A (en) * | 1995-06-06 | 1996-08-20 | Rubenstein; Julius | Method of processing and recovery of electronic and electric scrap |
JPH0917601A (ja) * | 1995-06-30 | 1997-01-17 | Matsushita Electric Ind Co Ltd | 電子部品およびその実装方法 |
JPH09103761A (ja) * | 1995-10-12 | 1997-04-22 | Hitachi Ltd | 電子部品搭載プリント配線基板の処理方法及びその装置 |
JP3284034B2 (ja) * | 1995-10-19 | 2002-05-20 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP3508349B2 (ja) | 1995-12-12 | 2004-03-22 | 株式会社日立製作所 | 製品の処理システム |
US6226617B1 (en) | 1995-12-12 | 2001-05-01 | Hitachi, Ltd. | Product disposal system |
US5667156A (en) * | 1996-01-04 | 1997-09-16 | Resource Concepts, Inc. | Process for the separation and isolation of precious and semi-precious metals from electronic circuit boards |
JPH09262573A (ja) | 1996-03-28 | 1997-10-07 | Hitachi Ltd | 廃電子部品搭載プリント配線基板からの資源回収方法 |
AU6279296A (en) * | 1996-06-12 | 1998-01-07 | International Business Machines Corporation | Lead-free, high tin ternary solder alloy of tin, silver, and indium |
JPH1041621A (ja) * | 1996-07-18 | 1998-02-13 | Fujitsu Ltd | 錫−ビスマスはんだの接合方法 |
CA2214130C (en) * | 1996-09-19 | 2003-12-02 | Northern Telecom Limited | Assemblies of substrates and electronic components |
JP3446517B2 (ja) * | 1996-10-09 | 2003-09-16 | 株式会社日立製作所 | Pbフリーはんだ材料及びそれを用いた電子機器 |
JP3688429B2 (ja) | 1997-04-25 | 2005-08-31 | 株式会社東芝 | 電子部品実装用基板および電子部品実装基板 |
JPH1134058A (ja) | 1997-07-24 | 1999-02-09 | Mitsubishi Electric Corp | 廃棄物処理装置 |
KR100295607B1 (ko) | 1998-05-19 | 2001-10-27 | 박성택 | 재활용가능한자원회수방법과그장치 |
JP3418787B2 (ja) * | 1999-06-30 | 2003-06-23 | 株式会社日立製作所 | 廃棄物処理方法及び装置 |
JP3365364B2 (ja) | 1999-08-31 | 2003-01-08 | 千住金属工業株式会社 | プリント基板 |
JP4073183B2 (ja) * | 2001-08-01 | 2008-04-09 | 株式会社日立製作所 | Pbフリーはんだを用いた混載実装方法及び実装品 |
-
2000
- 2000-01-07 CN CNB011257482A patent/CN1187138C/zh not_active Expired - Fee Related
- 2000-01-07 DE DE60002048T patent/DE60002048T2/de not_active Expired - Lifetime
- 2000-01-07 EP EP20010114977 patent/EP1156706B1/de not_active Expired - Lifetime
- 2000-01-07 KR KR1020017008711A patent/KR100560235B1/ko not_active IP Right Cessation
- 2000-01-07 CN CNB008026483A patent/CN1197440C/zh not_active Expired - Fee Related
- 2000-01-07 WO PCT/JP2000/000058 patent/WO2000042829A1/en not_active Application Discontinuation
- 2000-01-07 EP EP20000900157 patent/EP1151646B1/de not_active Expired - Lifetime
- 2000-01-07 DE DE2000605801 patent/DE60005801T2/de not_active Expired - Lifetime
- 2000-01-07 US US09/889,167 patent/US7540078B1/en not_active Expired - Fee Related
- 2000-01-10 TW TW89100276A patent/TW443954B/zh active
-
2008
- 2008-04-25 US US12/109,877 patent/US20080210604A1/en not_active Abandoned
- 2008-10-22 JP JP2008272288A patent/JP4960331B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60002048T2 (de) | 2003-10-23 |
US7540078B1 (en) | 2009-06-02 |
CN1337144A (zh) | 2002-02-20 |
EP1156706B1 (de) | 2003-10-08 |
JP2009044180A (ja) | 2009-02-26 |
CN1197440C (zh) | 2005-04-13 |
WO2000042829A1 (en) | 2000-07-20 |
CN1363427A (zh) | 2002-08-14 |
DE60005801T2 (de) | 2004-08-12 |
US20080210604A1 (en) | 2008-09-04 |
EP1156706A1 (de) | 2001-11-21 |
KR20010089804A (ko) | 2001-10-08 |
EP1151646B1 (de) | 2003-04-09 |
CN1187138C (zh) | 2005-02-02 |
JP4960331B2 (ja) | 2012-06-27 |
EP1151646A1 (de) | 2001-11-07 |
DE60005801D1 (de) | 2003-11-13 |
KR100560235B1 (ko) | 2006-03-10 |
TW443954B (en) | 2001-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |