DE4192038C2 - Herstellungsverfahren für bedruckte Schaltungsplatinen, bei dem sowohl Wellenlöten als auch das Einpressen von Bauteilen ermöglicht wird - Google Patents

Herstellungsverfahren für bedruckte Schaltungsplatinen, bei dem sowohl Wellenlöten als auch das Einpressen von Bauteilen ermöglicht wird

Info

Publication number
DE4192038C2
DE4192038C2 DE4192038A DE4192038A DE4192038C2 DE 4192038 C2 DE4192038 C2 DE 4192038C2 DE 4192038 A DE4192038 A DE 4192038A DE 4192038 A DE4192038 A DE 4192038A DE 4192038 C2 DE4192038 C2 DE 4192038C2
Authority
DE
Germany
Prior art keywords
holes
circuit board
pcb
pins
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4192038A
Other languages
German (de)
English (en)
Other versions
DE4192038T (Direct
Inventor
Blane T Mcmichen
Kerry J Mcmullen
Iii John A Sudanowicz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Codex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Codex Corp filed Critical Codex Corp
Application granted granted Critical
Publication of DE4192038C2 publication Critical patent/DE4192038C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE4192038A 1990-09-10 1991-09-04 Herstellungsverfahren für bedruckte Schaltungsplatinen, bei dem sowohl Wellenlöten als auch das Einpressen von Bauteilen ermöglicht wird Expired - Fee Related DE4192038C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/580,408 US5092035A (en) 1990-09-10 1990-09-10 Method of making printed circuit board assembly
PCT/US1991/006416 WO1992004812A1 (en) 1990-09-10 1991-09-04 Printed circuit board manufacturing method accommodates wave soldering and press fitting of components

Publications (1)

Publication Number Publication Date
DE4192038C2 true DE4192038C2 (de) 1996-10-31

Family

ID=24320987

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4192038A Expired - Fee Related DE4192038C2 (de) 1990-09-10 1991-09-04 Herstellungsverfahren für bedruckte Schaltungsplatinen, bei dem sowohl Wellenlöten als auch das Einpressen von Bauteilen ermöglicht wird
DE19914192038 Pending DE4192038T (Direct) 1990-09-10 1991-09-04

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19914192038 Pending DE4192038T (Direct) 1990-09-10 1991-09-04

Country Status (7)

Country Link
US (1) US5092035A (Direct)
JP (1) JPH05502341A (Direct)
KR (1) KR960010739B1 (Direct)
CA (1) CA2073008C (Direct)
DE (2) DE4192038C2 (Direct)
MX (1) MX174268B (Direct)
WO (1) WO1992004812A1 (Direct)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364280A (en) * 1993-07-16 1994-11-15 Molex Incorporated Printed circuit board connector assembly
US5692297A (en) * 1994-11-25 1997-12-02 Sumitomo Wiring Systems, Ltd. Method of mounting terminal to flexible printed circuit board
US5773195A (en) * 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
DE19809138A1 (de) * 1998-03-04 1999-09-30 Philips Patentverwaltung Leiterplatte mit SMD-Bauelementen
ES1040584Y (es) * 1998-07-01 1999-08-16 Mecanismos Aux Ind Conector compatible para soldadura de refusion y ola.
KR100319291B1 (ko) 1999-03-13 2002-01-09 윤종용 회로 기판 및 회로 기판의 솔더링 방법
CN100484371C (zh) * 2004-06-21 2009-04-29 鸿富锦精密工业（深圳）有限公司 防止主机板短路的焊盘
CN1735321A (zh) * 2004-08-11 2006-02-15 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
JP4370225B2 (ja) * 2004-08-19 2009-11-25 住友電装株式会社 プリント基板への端子実装方法、該方法で形成した端子実装プリント基板および該端子実装プリント基板を収容している電気接続箱
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
US9179536B2 (en) 2012-05-30 2015-11-03 Lear Corporation Printed circuit board assembly and solder validation method
CN104325207A (zh) * 2013-07-22 2015-02-04 珠海格力电器股份有限公司 过锡载具、焊接机和防连锡短路方法
US9138821B2 (en) * 2014-01-17 2015-09-22 Medtronic, Inc. Methods for simultaneously brazing a ferrule and lead pins
EP3291658B1 (en) * 2015-04-27 2021-01-13 FUJI Corporation Working machine
US10868401B1 (en) 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2807874A1 (de) * 1978-02-24 1979-08-30 Licentia Gmbh Mehrlagenverbindungsplatte aus uebereinander angeordneten, doppelt kaschierten leiterplatten
EP0043224B1 (en) * 1980-06-26 1985-05-22 McKenzie, Joseph A., Jr. Component mask for printed circuit boards
DE3790315C2 (Direct) * 1986-06-20 1989-11-23 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka, Jp
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535769A (en) * 1969-05-23 1970-10-27 Burroughs Corp Formation of solder joints across gaps
US3834015A (en) * 1973-01-29 1974-09-10 Philco Ford Corp Method of forming electrical connections
US3932934A (en) * 1974-09-16 1976-01-20 Amp Incorporated Method of connecting terminal posts of a connector to a circuit board
DE2524581A1 (de) * 1975-06-03 1976-12-23 Siemens Ag Flexible gedruckte schaltung
US4185378A (en) * 1978-02-10 1980-01-29 Chuo Meiban Mfg. Co., LTD. Method for attaching component leads to printed circuit base boards and printed circuit base board advantageously used for working said method
US4216576A (en) * 1978-06-13 1980-08-12 Elfab Corporation Printed circuit board, electrical connector and method of assembly
DE2840890A1 (de) * 1978-09-20 1980-04-03 Licentia Gmbh Mehrlagenverbindungsplatte mit mindestens einer loecher aufweisenden metallplatte und mit mindestens einer durchplattierte loecher ausweisenden gedruckten leiterplatte
DE2938254C2 (de) * 1979-09-21 1982-04-22 Siemens AG, 1000 Berlin und 8000 München Flexible gedruckte Schaltung
US4435740A (en) * 1981-10-30 1984-03-06 International Business Machines Corporation Electric circuit packaging member
US4551914A (en) * 1983-10-05 1985-11-12 Hewlett-Packard Company Method of making flexible circuit connections
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2807874A1 (de) * 1978-02-24 1979-08-30 Licentia Gmbh Mehrlagenverbindungsplatte aus uebereinander angeordneten, doppelt kaschierten leiterplatten
EP0043224B1 (en) * 1980-06-26 1985-05-22 McKenzie, Joseph A., Jr. Component mask for printed circuit boards
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
DE3790315C2 (Direct) * 1986-06-20 1989-11-23 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka, Jp

Also Published As

Publication number Publication date
DE4192038T (Direct) 1992-08-27
KR920702599A (ko) 1992-09-04
CA2073008A1 (en) 1992-03-11
JPH05502341A (ja) 1993-04-22
MX174268B (es) 1994-05-02
US5092035A (en) 1992-03-03
KR960010739B1 (ko) 1996-08-07
CA2073008C (en) 1995-12-26
WO1992004812A1 (en) 1992-03-19

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MOTOROLA INC.(N.D.GES.D. STAATES DELAWARE), SCHAUM

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee