DE3889762T2 - Elektrische Schaltung mit supraleitender Mehrschichtstruktur und Herstellungsverfahren dafür. - Google Patents
Elektrische Schaltung mit supraleitender Mehrschichtstruktur und Herstellungsverfahren dafür.Info
- Publication number
- DE3889762T2 DE3889762T2 DE3889762T DE3889762T DE3889762T2 DE 3889762 T2 DE3889762 T2 DE 3889762T2 DE 3889762 T DE3889762 T DE 3889762T DE 3889762 T DE3889762 T DE 3889762T DE 3889762 T2 DE3889762 T2 DE 3889762T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- electrical circuit
- multilayer structure
- process therefor
- superconducting multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/10—Junction-based devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53285—Conductive materials containing superconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76891—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by using superconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/437—Superconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
- H10N60/0632—Intermediate layers, e.g. for growth control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0661—After-treatment, e.g. patterning
- H10N60/0688—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0661—After-treatment, e.g. patterning
- H10N60/0716—Passivation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/93—Electric superconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/703—Microelectronic device with superconducting conduction line
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62081487A JPH0634412B2 (ja) | 1987-04-01 | 1987-04-01 | 超電導体装置 |
JP63022384A JPH01197308A (ja) | 1988-02-01 | 1988-02-01 | 炭素膜で保護された酸化物超伝導体およびその作製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3889762D1 DE3889762D1 (de) | 1994-07-07 |
DE3889762T2 true DE3889762T2 (de) | 1994-09-08 |
Family
ID=26359589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3889762T Expired - Fee Related DE3889762T2 (de) | 1987-04-01 | 1988-03-31 | Elektrische Schaltung mit supraleitender Mehrschichtstruktur und Herstellungsverfahren dafür. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4960751A (de) |
EP (1) | EP0285445B1 (de) |
KR (1) | KR960006207B1 (de) |
CN (1) | CN1033543C (de) |
DE (1) | DE3889762T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0282012A3 (de) * | 1987-03-09 | 1989-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Supraleitende Halbleiteranordnung |
US5274268A (en) * | 1987-04-01 | 1993-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting layered structure |
US5248658A (en) * | 1987-04-07 | 1993-09-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a superconducting oxide pattern by laser sublimation |
US5401716A (en) * | 1987-04-15 | 1995-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing superconducting patterns |
AU599223B2 (en) * | 1987-04-15 | 1990-07-12 | Semiconductor Energy Laboratory Co. Ltd. | Superconducting ceramic pattern and its manufacturing method |
CA1329952C (en) | 1987-04-27 | 1994-05-31 | Yoshihiko Imanaka | Multi-layer superconducting circuit substrate and process for manufacturing same |
US5232903A (en) * | 1987-05-06 | 1993-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Oxide superconducting device having uniform oxygen concentration |
CA1326976C (en) * | 1987-05-26 | 1994-02-15 | Satoshi Takano | Superconducting member |
NL8701718A (nl) * | 1987-07-21 | 1989-02-16 | Philips Nv | Werkwijze voor het aanbrengen van dunne lagen van oxidisch supergeleidend materiaal. |
DE3889263T2 (de) * | 1987-08-24 | 1994-08-11 | Semiconductor Energy Lab | Elektronische Anordnungen unter Verwendung von supraleitenden Materialien. |
US5225394A (en) * | 1987-08-31 | 1993-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing high Tc superconducting circuits |
GB2211662B (en) * | 1988-01-16 | 1991-01-16 | Int Computers Ltd | Multichip carriers |
US5171732A (en) * | 1988-12-23 | 1992-12-15 | Troy Investments, Inc. | Method of making a josephson junction |
US5084437A (en) * | 1990-02-28 | 1992-01-28 | Westinghouse Electric Corp. | Method for making high-current, ohmic contacts between semiconductors and oxide superconductors |
JPH05894A (ja) * | 1990-06-28 | 1993-01-08 | Sumitomo Electric Ind Ltd | 複合酸化物超電導薄膜 |
US5212626A (en) * | 1990-11-09 | 1993-05-18 | International Business Machines Corporation | Electronic packaging and cooling system using superconductors for power distribution |
CA2062294C (en) * | 1991-03-04 | 1997-01-14 | Hiroshi Inada | Thin film of oxide superconductor possessing locally different crystal orientations and processes for preparing the same |
WO1992020092A1 (en) * | 1991-05-08 | 1992-11-12 | Superconductor Technologies, Inc. | Passivation coating for superconducting thin film device |
EP0570720A1 (de) * | 1992-05-20 | 1993-11-24 | Sumitomo Electric Industries, Ltd. | Leitendes oder superleitendes stabilisiertes Kohlenstoff-Cluster-Material sowie Herstellung und Verwendung |
US5455432A (en) * | 1994-10-11 | 1995-10-03 | Kobe Steel Usa | Diamond semiconductor device with carbide interlayer |
US5818071A (en) * | 1995-02-02 | 1998-10-06 | Dow Corning Corporation | Silicon carbide metal diffusion barrier layer |
JP4355039B2 (ja) * | 1998-05-07 | 2009-10-28 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
FI19992757A (fi) | 1999-12-22 | 2001-06-23 | Nanoway Oy | Menetelmä tunneliliitoskomponentin stabiloimiseksi ja stabiloitu tunneliliitoskomponentti |
US6518648B1 (en) * | 2000-09-27 | 2003-02-11 | Advanced Micro Devices, Inc. | Superconductor barrier layer for integrated circuit interconnects |
US20060060977A1 (en) * | 2004-09-22 | 2006-03-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
WO2010006000A1 (en) * | 2008-07-08 | 2010-01-14 | Sandisk 3D, Llc | Carbon-based resistivity-switching materials and methods of forming the same |
US8470646B2 (en) * | 2008-12-31 | 2013-06-25 | Sandisk 3D Llc | Modulation of resistivity in carbon-based read-writeable materials |
US9653398B1 (en) * | 2015-12-08 | 2017-05-16 | Northrop Grumman Systems Corporation | Non-oxide based dielectrics for superconductor devices |
US10608159B2 (en) | 2016-11-15 | 2020-03-31 | Northrop Grumman Systems Corporation | Method of making a superconductor device |
US10276504B2 (en) | 2017-05-17 | 2019-04-30 | Northrop Grumman Systems Corporation | Preclean and deposition methodology for superconductor interconnects |
US10763419B2 (en) | 2017-06-02 | 2020-09-01 | Northrop Grumman Systems Corporation | Deposition methodology for superconductor interconnects |
US10985059B2 (en) | 2018-11-01 | 2021-04-20 | Northrop Grumman Systems Corporation | Preclean and dielectric deposition methodology for superconductor interconnect fabrication |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US39A (en) * | 1836-10-04 | Purifying- wateil for use in steamt-boilees | ||
US3352008A (en) * | 1963-05-03 | 1967-11-14 | Nat Res Corp | Process of bonding copper foil to foil containing superconductive layer such as niobium stannide |
US3432783A (en) * | 1967-08-24 | 1969-03-11 | Atomic Energy Commission | Superconductor ribbon |
US3912611A (en) * | 1973-03-12 | 1975-10-14 | Bell Telephone Labor Inc | Film material and devices using same |
FR2273385B1 (de) * | 1974-05-29 | 1976-10-15 | Comp Generale Electricite | |
JPS5887884A (ja) * | 1981-11-20 | 1983-05-25 | Nippon Telegr & Teleph Corp <Ntt> | 酸化物超伝導体回路の電極形成方法 |
JPH0635323B2 (ja) * | 1982-06-25 | 1994-05-11 | 株式会社日立製作所 | 表面処理方法 |
US4470190A (en) * | 1982-11-29 | 1984-09-11 | At&T Bell Laboratories | Josephson device fabrication method |
JPH0648733B2 (ja) * | 1984-01-25 | 1994-06-22 | 株式会社日立製作所 | 極低温用半導体装置 |
JPH0682839B2 (ja) * | 1984-08-21 | 1994-10-19 | セイコー電子工業株式会社 | 表示用パネルの製造方法 |
JPH0710007B2 (ja) * | 1985-03-04 | 1995-02-01 | 株式会社日立製作所 | 超電導トランジスタ集積回路 |
DE3810494C2 (de) * | 1987-03-27 | 1998-08-20 | Hitachi Ltd | Integrierte Halbleiterschaltungseinrichtung mit supraleitender Schicht |
CA1329952C (en) * | 1987-04-27 | 1994-05-31 | Yoshihiko Imanaka | Multi-layer superconducting circuit substrate and process for manufacturing same |
JPH064278A (ja) * | 1992-06-17 | 1994-01-14 | Yaskawa Electric Corp | 小型計算機によるフロー図作成方法 |
-
1988
- 1988-03-29 US US07/174,790 patent/US4960751A/en not_active Expired - Fee Related
- 1988-03-31 EP EP88302957A patent/EP0285445B1/de not_active Expired - Lifetime
- 1988-03-31 KR KR1019880003574A patent/KR960006207B1/ko not_active IP Right Cessation
- 1988-03-31 CN CN88102047A patent/CN1033543C/zh not_active Expired - Lifetime
- 1988-03-31 DE DE3889762T patent/DE3889762T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR880013427A (ko) | 1988-11-30 |
KR960006207B1 (ko) | 1996-05-09 |
EP0285445A3 (en) | 1989-09-06 |
CN88102047A (zh) | 1988-10-19 |
EP0285445B1 (de) | 1994-06-01 |
EP0285445A2 (de) | 1988-10-05 |
DE3889762D1 (de) | 1994-07-07 |
CN1033543C (zh) | 1996-12-11 |
US4960751A (en) | 1990-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |