DE3887054T2 - Herstellung einer mehrschichtigen gedruckten Schaltungsplatte. - Google Patents

Herstellung einer mehrschichtigen gedruckten Schaltungsplatte.

Info

Publication number
DE3887054T2
DE3887054T2 DE3887054T DE3887054T DE3887054T2 DE 3887054 T2 DE3887054 T2 DE 3887054T2 DE 3887054 T DE3887054 T DE 3887054T DE 3887054 T DE3887054 T DE 3887054T DE 3887054 T2 DE3887054 T2 DE 3887054T2
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
printed circuit
multilayer printed
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3887054T
Other languages
English (en)
Other versions
DE3887054D1 (de
Inventor
John Vincent Palladino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Mcgean Rohco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mcgean Rohco Inc filed Critical Mcgean Rohco Inc
Publication of DE3887054D1 publication Critical patent/DE3887054D1/de
Application granted granted Critical
Publication of DE3887054T2 publication Critical patent/DE3887054T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
DE3887054T 1987-10-01 1988-09-28 Herstellung einer mehrschichtigen gedruckten Schaltungsplatte. Expired - Lifetime DE3887054T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10399587A 1987-10-01 1987-10-01

Publications (2)

Publication Number Publication Date
DE3887054D1 DE3887054D1 (de) 1994-02-24
DE3887054T2 true DE3887054T2 (de) 1994-07-21

Family

ID=22298136

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3887054T Expired - Lifetime DE3887054T2 (de) 1987-10-01 1988-09-28 Herstellung einer mehrschichtigen gedruckten Schaltungsplatte.

Country Status (5)

Country Link
EP (1) EP0310010B1 (de)
JP (1) JPH0666553B2 (de)
KR (1) KR0126135B1 (de)
BR (1) BR8805031A (de)
DE (1) DE3887054T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073456A (en) * 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
US5161093A (en) * 1990-07-02 1992-11-03 General Electric Company Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
DE69112181T2 (de) * 1990-11-30 1996-05-09 Toppan Printing Co Ltd Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine.
JP2721632B2 (ja) * 1992-02-25 1998-03-04 松下電工株式会社 回路板の銅回路の処理方法
US5385787A (en) * 1993-02-03 1995-01-31 Amp-Akzo Corporation Organosilane adhesion promotion in manufacture of additive printed wiring board
US5928790A (en) * 1996-04-23 1999-07-27 Mcgean-Rohco, Inc. Multilayer circuit boards and processes of making the same
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP4831783B2 (ja) 2008-02-01 2011-12-07 メック株式会社 導電層及びこれを用いた積層体と、これらの製造方法
JP5317099B2 (ja) 2008-07-02 2013-10-16 メック株式会社 接着層形成液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644166A (en) * 1968-03-28 1972-02-22 Westinghouse Electric Corp Oxide-free multilayer copper clad laminate
FR2361224A1 (fr) * 1976-08-11 1978-03-10 Uop Inc Produit stratifie a placage metallique et son procede de fabrication
JPS56118394A (en) * 1980-02-22 1981-09-17 Fujitsu Ltd Method of manufacturing multilayer circuit board
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4512818A (en) * 1983-05-23 1985-04-23 Shipley Company Inc. Solution for formation of black oxide
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits

Also Published As

Publication number Publication date
EP0310010A3 (en) 1989-09-13
KR0126135B1 (ko) 1997-12-26
BR8805031A (pt) 1989-05-09
DE3887054D1 (de) 1994-02-24
EP0310010A2 (de) 1989-04-05
JPH01109796A (ja) 1989-04-26
EP0310010B1 (de) 1994-01-12
KR890007625A (ko) 1989-06-20
JPH0666553B2 (ja) 1994-08-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE