JPS56118394A - Method of manufacturing multilayer circuit board - Google Patents

Method of manufacturing multilayer circuit board

Info

Publication number
JPS56118394A
JPS56118394A JP2141580A JP2141580A JPS56118394A JP S56118394 A JPS56118394 A JP S56118394A JP 2141580 A JP2141580 A JP 2141580A JP 2141580 A JP2141580 A JP 2141580A JP S56118394 A JPS56118394 A JP S56118394A
Authority
JP
Japan
Prior art keywords
circuit board
multilayer circuit
manufacturing multilayer
manufacturing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2141580A
Other languages
Japanese (ja)
Inventor
Norio Saruwatari
Isao Watanabe
Kazumasa Saitou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2141580A priority Critical patent/JPS56118394A/en
Publication of JPS56118394A publication Critical patent/JPS56118394A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2141580A 1980-02-22 1980-02-22 Method of manufacturing multilayer circuit board Pending JPS56118394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2141580A JPS56118394A (en) 1980-02-22 1980-02-22 Method of manufacturing multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2141580A JPS56118394A (en) 1980-02-22 1980-02-22 Method of manufacturing multilayer circuit board

Publications (1)

Publication Number Publication Date
JPS56118394A true JPS56118394A (en) 1981-09-17

Family

ID=12054374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2141580A Pending JPS56118394A (en) 1980-02-22 1980-02-22 Method of manufacturing multilayer circuit board

Country Status (1)

Country Link
JP (1) JPS56118394A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944893A (en) * 1982-09-08 1984-03-13 日立化成工業株式会社 Method of producing multilayer printed circuit board
JPH01109796A (en) * 1987-10-01 1989-04-26 E I Du Pont De Nemours & Co Multi-layer printed circuit board construction
JPH02500555A (en) * 1987-08-26 1990-02-22 マクダーミツド　インコーポレーテツド Multilayer circuit board manufacturing method
JPH03217077A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
JPH03217078A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
US5061550A (en) * 1989-10-02 1991-10-29 Nippon Denkai, Co. Ltd. Multilayer material having a resistance layer formed on an electrically conductive layer and a multilayer board for a printed circuit board which has a resistance layer
WO1997003542A1 (en) * 1995-07-10 1997-01-30 Hitachi, Ltd. Circuit board and method of manufacturing the same
US6506314B1 (en) 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
US7842403B2 (en) 2006-02-23 2010-11-30 Atotech Deutschland Gmbh Antifriction coatings, methods of producing such coatings and articles including such coatings

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944893A (en) * 1982-09-08 1984-03-13 日立化成工業株式会社 Method of producing multilayer printed circuit board
JPH02500555A (en) * 1987-08-26 1990-02-22 マクダーミツド　インコーポレーテツド Multilayer circuit board manufacturing method
JPH01109796A (en) * 1987-10-01 1989-04-26 E I Du Pont De Nemours & Co Multi-layer printed circuit board construction
US5061550A (en) * 1989-10-02 1991-10-29 Nippon Denkai, Co. Ltd. Multilayer material having a resistance layer formed on an electrically conductive layer and a multilayer board for a printed circuit board which has a resistance layer
JPH03217077A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
JPH03217078A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
WO1997003542A1 (en) * 1995-07-10 1997-01-30 Hitachi, Ltd. Circuit board and method of manufacturing the same
US5958600A (en) * 1995-07-10 1999-09-28 Hitachi, Ltd. Circuit board and method of manufacturing the same
US6506314B1 (en) 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
US7842403B2 (en) 2006-02-23 2010-11-30 Atotech Deutschland Gmbh Antifriction coatings, methods of producing such coatings and articles including such coatings

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