JPH03217077A - Surface treatment of internal-layer base material for multilayer copper-clad laminated board - Google Patents
Surface treatment of internal-layer base material for multilayer copper-clad laminated boardInfo
- Publication number
- JPH03217077A JPH03217077A JP1205790A JP1205790A JPH03217077A JP H03217077 A JPH03217077 A JP H03217077A JP 1205790 A JP1205790 A JP 1205790A JP 1205790 A JP1205790 A JP 1205790A JP H03217077 A JPH03217077 A JP H03217077A
- Authority
- JP
- Japan
- Prior art keywords
- surface treatment
- layer base
- base material
- internal
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 title claims abstract description 63
- 239000000463 material Substances 0.000 title claims abstract description 55
- 239000007788 liquid Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 239000004094 surface-active agent Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000001035 drying Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000005406 washing Methods 0.000 abstract description 7
- 238000000059 patterning Methods 0.000 abstract description 5
- 239000012190 activator Substances 0.000 abstract 4
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- VBRBYBYVXWLHPX-UHFFFAOYSA-N 4-(3-ethyloxiran-2-yl)butyl-trimethoxysilane Chemical compound CCC1OC1CCCC[Si](OC)(OC)OC VBRBYBYVXWLHPX-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、エポキシ樹脂等の絶縁材を用いた多層銅張積
層板の内層基材の表面処理方法に関するものであり、特
に内層基材の銅箔の酸化処理面と樹脂層との接着性を向
上させる表面処理方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for surface treatment of an inner layer base material of a multilayer copper-clad laminate using an insulating material such as an epoxy resin, and particularly relates to a surface treatment method for an inner layer base material of a multilayer copper clad laminate using an insulating material such as an epoxy resin. The present invention relates to a surface treatment method for improving the adhesion between an oxidized surface of copper foil and a resin layer.
近年、銅張積層板の諸特性に対する要求はます１ー
ます厳しくなってきている。特に産業用や民生用のプリ
ント配線板用の銅張積層板にその傾向が顕著である。例
えば高密度化の要求により信号線はますます細くなり、
信頼性の確保のため銅箔と樹脂間の接着強度が重要とな
っている。また多層化の傾向も顕著で、銅箔の接着強度
は、銅箔粗化面のみならず、銅箔光沢面とこれに密着す
る樹脂層との間においても一層重要になってきている。In recent years, requirements for various properties of copper-clad laminates have become increasingly strict. This tendency is particularly noticeable in copper-clad laminates for industrial and consumer printed wiring boards. For example, due to the demand for higher density, signal lines are becoming thinner and thinner.
Adhesion strength between the copper foil and resin is important to ensure reliability. In addition, there is a remarkable trend toward multilayering, and the adhesive strength of copper foil is becoming more important not only between the roughened surface of the copper foil, but also between the shiny surface of the copper foil and the resin layer that adheres to it.
第３図は内層基材製造後の多層基板製造工程に至る多層
銅張積層板の製造工程を示す系統図である。FIG. 3 is a system diagram showing the manufacturing process of a multilayer copper-clad laminate up to the multilayer board manufacturing process after manufacturing the inner layer base material.
一般に内層基材としては０．５〜０ ． ６ｍｍ程度の
厚さの両面銅張積層板が用いられており、エッチング等
により両面の銅箔にパターニング（ａ）を行って所定の
回路パターンを形成したのち、整面（ｂ）、水洗（ｃ）
、乾燥（ｄ）の各工程を行う。そして酸化処理工程（ｅ
）において、銅箔の回路パターンを酸化処理して表面に
酸化膜を形成したのち、乾燥（ｆ）を行う。その後表面
処理工程（ｇ）において、一般にカップリング剤を含む
カップリング処理液を表−２−
面処理液として表面処理を行い、乾燥工程（ｈ）を経た
のち、多層基板製造工程（１）に入る。多層基板製造工
程（１）では、表面処理を行った内層基材と、ガラスク
ロスーエポキシ樹脂よりなるプリプレグとを交互に積層
し、最外層に銅箔を積層して加熱加圧成形することによ
り多層銅張積層板を製造する。Generally, the inner layer base material is 0.5 to 0. A double-sided copper-clad laminate with a thickness of about 6 mm is used, and after patterning (a) on the copper foil on both sides by etching etc. to form a predetermined circuit pattern, the surface is leveled (b) and washed with water (c). )
, drying (d). and oxidation treatment step (e
), the copper foil circuit pattern is oxidized to form an oxide film on the surface, and then dried (f). After that, in the surface treatment step (g), surface treatment is performed using a coupling treatment solution containing a coupling agent as Table 2- surface treatment solution, and after passing through the drying step (h), the multilayer substrate manufacturing step (1) is carried out. enter. In the multilayer board manufacturing process (1), the surface-treated inner layer base material and the prepreg made of glass cloth-epoxy resin are alternately laminated, and the outermost layer is laminated with copper foil and then heated and pressure molded. Manufactures multilayer copper-clad laminates.
第２図は表面処理装置を示す断面図であり、図において
、（］）は内層基材、（２）はその両側に積層された銅
箔の回路パターン、（３）は表面処理液、（４）は処理
液層である。FIG. 2 is a cross-sectional view showing the surface treatment apparatus. In the figure, ( ]) is the inner layer base material, (2) is the copper foil circuit pattern laminated on both sides thereof, (3) is the surface treatment liquid, ( 4) is a processing liquid layer.
従来の内層基材（１）の表面処理方法は、カップリング
剤を含むカップリング処理液からなる表面処理液（３）
を処理液槽（４）の中に入れ、その中に被処理材である
回路パターン（２）を形成した内層基材（１）を浸漬し
た後、引上げて乾燥し、表面処理膜を内層基材（１）表
面に形成する。そして乾燥後、内層基材（１）を次工程
の多層基板製造工程に供している。The conventional surface treatment method for the inner layer base material (1) is to use a surface treatment liquid (3) consisting of a coupling treatment liquid containing a coupling agent.
is placed in a treatment liquid tank (4), and the inner layer base material (1) on which the circuit pattern (2) is formed, which is the material to be treated, is immersed therein, then pulled up and dried, and the surface treated film is placed on the inner layer base material. Formed on the surface of material (1). After drying, the inner layer base material (1) is subjected to the next multilayer board manufacturing process.
３
しかしながら、上記のような従来の表面処理方法におい
ては、単に被処理材である内層基材（１）を、カップリ
ング剤を含む表面処理液（３）に浸漬したのち、引上げ
て乾燥する方法であったので、表面処理液の粘度や組成
の如何に拘らず、内層基材（１）の表面には銅箔の回路
パターン（２）が形成されている部分と、形成されてい
ない部分があるため、内層基材の表面に均一な表面処理
膜を一様に形成することができない。このため多層基板
製造工程で、表面処理膜とこれに密着する樹脂層間でフ
クレ、ハガレを生じたり、製造後の多層基板に接着力の
著しいバラツキを生じたり、実装時にハンダによるフク
レやハガレを生じることがあり、著しく信頼性を損うと
いう問題点があった。3 However, in the conventional surface treatment method as described above, the inner layer base material (1), which is the material to be treated, is simply immersed in a surface treatment liquid (3) containing a coupling agent, and then pulled up and dried. Therefore, regardless of the viscosity or composition of the surface treatment liquid, there are parts on the surface of the inner layer base material (1) where the copper foil circuit pattern (2) is formed and parts where it is not formed. Therefore, a uniform surface treatment film cannot be uniformly formed on the surface of the inner layer base material. For this reason, during the multilayer board manufacturing process, blistering and peeling may occur between the surface treatment film and the resin layer that adheres to it, significant variations in adhesive strength may occur in the multilayer board after manufacturing, and blistering and peeling may occur due to solder during mounting. There was a problem in that reliability was significantly impaired.
従来、表面処理液は水や溶剤並みの粘度であり、表面処
理膜は無色透明で、その厚さが極めて薄いので、表面処
理膜の付着状態と接着力の関係について充分な検討がな
されていなかった。Conventionally, surface treatment liquids have a viscosity similar to that of water or solvents, and surface treatment films are colorless and transparent, and their thickness is extremely thin, so the relationship between the adhesion state of the surface treatment film and its adhesive strength has not been sufficiently investigated. Ta.
本発明は前記の問題点を解決するためになされたもので
、表面処理膜を内層基材表面に一様に形４
成して、多層基板の内層基材との接着カを安定化すると
ともに向上させ、その信頼性を高めることができる多層
銅張積層板用内層基材の表面処理方法を提案することを
目的とする。The present invention was made in order to solve the above-mentioned problems, and it forms a surface treatment film uniformly on the surface of the inner layer base material to stabilize the adhesion with the inner layer base material of the multilayer substrate. The purpose of the present invention is to propose a surface treatment method for an inner layer base material for a multilayer copper-clad laminate, which can improve the reliability of the inner layer substrate.
本発明の多層銅張積層板用内層基材の表面処理方法は、
多層銅張積層板を形成するための内層基材の銅箔の酸化
膜表面に表面処理を行う方法において、界面活性剤を含
む洗浄液により内層基材を洗浄したのち、カップリング
剤を０．３〜５重量％含む表面処理液を用いて内層基材
の表面処理を行い、表面処理膜を形成する方法である。The method for surface treatment of an inner layer base material for a multilayer copper-clad laminate of the present invention includes:
In a method of surface-treating the surface of an oxide film of copper foil as an inner layer base material for forming a multilayer copper-clad laminate, after cleaning the inner layer base material with a cleaning solution containing a surfactant, a coupling agent of 0.3 In this method, the inner layer base material is surface treated using a surface treatment liquid containing ~5% by weight to form a surface treatment film.
本発明で使用する表面処理液のカップリング剤としては
、例えばシランカップリング剤、チタネー１一カップリ
ング剤、または両者の混合カップリング剤などがあげら
れる。また界面活性剤としては、フッ素系界面活性剤、
その他の界面活性剤があげられる。Examples of the coupling agent for the surface treatment liquid used in the present invention include a silane coupling agent, a titanium-1 coupling agent, and a mixed coupling agent of both. In addition, as surfactants, fluorine-based surfactants,
Other surfactants may be mentioned.
本発明の多層銅張積層板用内層基材の表面処理５
方法においては、界面活性剤を含む洗浄液により内層基
材の銅箔の酸化膜表面を洗浄したのち、カップリング剤
を含む表面処理液に内層基材を浸漬して表面処理を行い
、表面処理膜を形成する。In the method 5 for surface treatment of the inner layer base material for multilayer copper-clad laminates of the present invention, the oxide film surface of the copper foil of the inner layer base material is cleaned with a cleaning solution containing a surfactant, and then the surface treatment solution containing a coupling agent is used. The inner layer base material is immersed in the solution to perform surface treatment and form a surface treated film.
従来のカップリング処理液からなる表面処理液に、被処
理材である内層基材を浸漬して引上げると、その表面に
付着した表面処理液が内層基材表面のハジキや液ダマリ
のため表面に均一に付着せず、一様な表面処理膜を形成
できないが、これは被処理材の内層基材の表面に表面処
理液が接触した際の表面張力が大きいためである。この
ため本発明では、従来の表面処理液に界面活性剤を添加
することにより、予め界面活性剤を含む洗浄液により内
層基材を洗浄することにより、内層基材表面のハジキや
液ダマリを防止して、内層基材表面をぬれ易い表面に改
質し、これにより一様な表面処理膜を形成する。When the inner layer base material, which is the material to be treated, is immersed in a surface treatment liquid consisting of a conventional coupling treatment liquid and pulled up, the surface treatment liquid adhering to the surface of the inner layer base material may cause repellency or liquid clumps on the surface of the inner layer base material, causing the surface The surface treatment liquid does not adhere uniformly to the inner layer of the material to be treated, and a uniform surface treatment film cannot be formed. This is because the surface tension is high when the surface treatment liquid contacts the surface of the inner layer base material of the material to be treated. Therefore, in the present invention, by adding a surfactant to the conventional surface treatment liquid and cleaning the inner layer base material in advance with a cleaning liquid containing a surfactant, it is possible to prevent repelling and liquid clumps on the surface of the inner layer base material. Then, the surface of the inner layer base material is modified to a surface that is easily wetted, thereby forming a uniform surface treatment film.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
第１図はこの発明の一実旅例による内層基材製６
造後の多層基板製造工程に至る多層銅張積層板の製造工
程を示す系統図である。この実施例では、第３図に示す
従来の多層銅張積層板の製造工程におけるパターニング
（ａ）から多層基板製造（ｉ）に至る各工程のうち、乾
燥工程（ｆ）と表面処理工程（ｇ）の間に、界面活性剤
を含む洗浄液による洗浄工程（ｆ−２）、および乾燥工
程（ｆ−３）が追加されるだけで、他の工程は従来と同
様に行われる。洗浄工程（ｆ−２）における界面活性剤
の濃度は制限されないが、０．０５〜３重景％が好まし
い。乾燥工程（ｆ−３）後の表面処理工程（ｇ）は第２
図の表面処理装置を使用して従来と同様に行われる。FIG. 1 is a system diagram showing the manufacturing process of a multilayer copper-clad laminate up to the multilayer board manufacturing process after the inner layer base material manufacturing process according to an example of the present invention. In this example, the drying step (f) and the surface treatment step (g ), the other steps are performed in the same manner as before, except that a washing step (f-2) using a washing liquid containing a surfactant and a drying step (f-3) are added. The concentration of the surfactant in the washing step (f-2) is not limited, but is preferably 0.05 to 3%. The surface treatment step (g) after the drying step (f-3) is the second
This is carried out in the same manner as before using the surface treatment apparatus shown in the figure.
実施例１
まず内層基材（１）として、両面に厚さ７０μｍの銅箔
を張った全体の厚さ０．６０ｍｍのガラスクロスーエポ
キシ樹脂の銅張積層板を用いた。まず第１図のパターニ
ング（ａ）工程として、両面の銅箔に所定のパターンと
なるようにレジストを付与し、エッチングなどによりパ
ターニングし，回路パターン（２）を形成する。このパ
ターン面を整面（ｂ）、水洗７
（ｃ）、および乾燥（ｄ）シた後、酸化処理工程（ｅ）
として、黒化処理液（亜塩素酸ナトリウム３１ｇＩＱ、
水酸化ナトリウム１ ５ｇ／ｆｌ、リン酸三ナトリウム
１ ２ｇＩＱの水溶液）中に９５℃で２分間浸漬して酸
化膜を形成した後、１５０℃のオーブン中で１５分間乾
燥（ｆ）させた。そして洗浄工程（ｆ−２）として、メ
タノール溶液にフッ素系界面活性剤フロラードＦＣ−４
３０ （スリーエム（株）製、商品名）を０．５重量％
添加した洗浄液に内層基材（１）を浸漬して洗浄し、風
乾により乾燥（ｆ−３）Ｌた。Example 1 First, as the inner layer base material (1), a copper-clad laminate made of glass cloth-epoxy resin having a total thickness of 0.60 mm and having a copper foil of 70 μm thick on both sides was used. First, in the patterning step (a) in FIG. 1, a resist is applied to the copper foil on both sides so as to form a predetermined pattern, and patterning is performed by etching or the like to form a circuit pattern (2). After this pattern surface is leveled (b), washed with water (c), and dried (d), an oxidation treatment step (e) is performed.
As, blackening treatment liquid (sodium chlorite 31gIQ,
After forming an oxide film by immersing it in an aqueous solution of sodium hydroxide (15 g/fl, trisodium phosphate 12 g/fl) at 95°C for 2 minutes, it was dried (f) in an oven at 150°C for 15 minutes. Then, as a cleaning step (f-2), the fluorosurfactant Florad FC-4 was added to the methanol solution.
0.5% by weight of 30 (trade name, manufactured by 3M Co., Ltd.)
The inner layer base material (1) was washed by immersing it in the added washing liquid, and was air-dried (f-3).
次に表面処理工程（ｇ）として、カップリング処理液（
β−（３，４エボキシシク口ヘキシル）エチルトリメト
キシシラン ２重量％、酢酸０．５重量％、エタノール
６０重量％、水３７．５重量％）からなる表面処理液（
３）を用い、第２図の表面処理装置の処理液槽（４）に
満し、パターニングおよび酸化膜を形成した内層基材（
１）を吊下治具（図示せず）により固定して、表面処理
液（３）中に吊下げ浸漬した。Next, as a surface treatment step (g), a coupling treatment solution (
A surface treatment solution (2% by weight of β-(3,4-epoxyhexyl)ethyltrimethoxysilane, 0.5% by weight of acetic acid, 60% by weight of ethanol, 37.5% by weight of water)
3) is used to fill the treatment liquid tank (4) of the surface treatment apparatus shown in Figure 2, and the inner layer base material (4) on which the patterning and oxide film have been formed is applied.
1) was fixed with a hanging jig (not shown) and suspended and immersed in the surface treatment liquid (3).
その後、オーブン内にて、１１０゜Ｃで３０分間乾燥（
ｈ）して、カップリング剤の表面処理膜を形成した。Then, dry in the oven at 110°C for 30 minutes (
h) to form a surface-treated film of the coupling agent.
＝８−
この表面処理膜を形成した内層基材（１）は、多層基板
製造工程（ｉ）において、ガラスク口スーエポキシ樹脂
よりなるプリプレグ（図示せず）と交互に必要層数を積
層し、最外層に銅箔を積層してプレス成形することによ
り、多層銅張積層板を得た。=8- In the multilayer substrate manufacturing step (i), the inner layer base material (1) on which the surface treatment film is formed is alternately laminated with a prepreg (not shown) made of glass-based epoxy resin in the required number of layers, A multilayer copper-clad laminate was obtained by laminating copper foil on the outermost layer and press-molding it.
比較例１
洗浄工程（ｆ−２）および乾燥工程（ｆ−３）を行うこ
となく、実施例１と同様にして、多層銅張積層板を得た
。Comparative Example 1 A multilayer copper-clad laminate was obtained in the same manner as in Example 1 without performing the washing step (f-2) and drying step (f-3).
上記実施例１および比較例１の多層銅張積層板について
、その表面処理した銅箔とプリプレグ間の引剥し力を測
定した。結果を表１に示す。Regarding the multilayer copper-clad laminates of Example 1 and Comparative Example 1, the peeling force between the surface-treated copper foil and the prepreg was measured. The results are shown in Table 1.
表 １
上記実施例において、界面活性剤はフッ素系界面活性剤
を用いたが、添加により表面張力を下げ、表面処理液の
ハジキや液ダマリを防止して、均一な表面処理を行うこ
とができる界面活性剤やレベリング剤は、本発明の界面
活性剤として使用可能である。Table 1 In the above examples, a fluorine-based surfactant was used as the surfactant, but its addition lowers the surface tension, prevents repellency and clumps of the surface treatment solution, and enables uniform surface treatment. Surfactants and leveling agents can be used as the surfactant in the present invention.
以上のように、本発明によれば、界面活性剤を含む洗浄
液で内層基材を洗浄したのち、カップリング剤を含む表
面処理液を用いて表面処理することにより、特別な処理
装置を必要とせず、内層基材表面に一様な表面処理膜を
ムラな′く容易に形成することができ、これにより接着
力が安定するとともに、そのレベルを向上させることが
でき、多層銅張積層板の歩留および信頼性の向上に寄与
できる効果がある。As described above, according to the present invention, after cleaning the inner layer base material with a cleaning liquid containing a surfactant, surface treatment is performed using a surface treatment liquid containing a coupling agent, thereby eliminating the need for special treatment equipment. First, a uniform surface treatment film can be easily and evenly formed on the surface of the inner layer substrate, which stabilizes the adhesive strength and improves its level. This has the effect of contributing to improved yield and reliability.
第１図は実施例の多層銅張積層板の製造工程を示す系統
図、第２図は表面処理装置の断面図、第３図は従来の多
層銅張積層板の製造工程を示す系統図である。
図中、（１）は内層基材、（２）は回路パターン、（３
）は表面処理液，（４）は処理液槽である。Fig. 1 is a system diagram showing the manufacturing process of a multilayer copper-clad laminate according to an embodiment, Fig. 2 is a cross-sectional view of the surface treatment equipment, and Fig. 3 is a system diagram showing the manufacturing process of a conventional multilayer copper-clad laminate. be. In the figure, (1) is the inner layer base material, (2) is the circuit pattern, and (3) is the inner layer base material.
) is a surface treatment liquid, and (4) is a treatment liquid tank.
Claims (1)
の酸化膜表面に表面処理を行う方法において、界面活性
剤を含む洗浄液により内層基材を洗浄したのち、カップ
リング剤を０．３〜５重量％含む表面処理液を用いて内
層基材の表面処理を行い、表面処理膜を形成することを
特徴とする多層銅張積層板用内層基材の表面処理方法。(1) In a method of surface-treating the surface of the oxide film of the copper foil that is the inner layer base material for forming a multilayer copper-clad laminate, the inner layer base material is cleaned with a cleaning solution containing a surfactant, and then a coupling agent is applied. A method for surface treatment of an inner layer base material for a multilayer copper-clad laminate, comprising performing surface treatment on the inner layer base material using a surface treatment liquid containing 0.3 to 5% by weight to form a surface treatment film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1205790A JPH03217077A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1205790A JPH03217077A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03217077A true JPH03217077A (en) | 1991-09-24 |
Family
ID=11794974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1205790A Pending JPH03217077A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03217077A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5482174A (en) * | 1993-08-02 | 1996-01-09 | Fujitsu Limited | Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56118394A (en) * | 1980-02-22 | 1981-09-17 | Fujitsu Ltd | Method of manufacturing multilayer circuit board |
| JPS5944894A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS59151494A (en) * | 1983-02-18 | 1984-08-29 | 株式会社日立製作所 | Method of producing printed board |
| JPS62198192A (en) * | 1986-02-26 | 1987-09-01 | 住友ベークライト株式会社 | Manufacture of printed wiring board |
| JPS63190177A (en) * | 1987-02-03 | 1988-08-05 | Nippon Mining Co Ltd | Pretreatment of copper paste before electroless plating |
| JPS6437081A (en) * | 1987-08-03 | 1989-02-07 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
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1990
- 1990-01-22 JP JP1205790A patent/JPH03217077A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56118394A (en) * | 1980-02-22 | 1981-09-17 | Fujitsu Ltd | Method of manufacturing multilayer circuit board |
| JPS5944894A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS59151494A (en) * | 1983-02-18 | 1984-08-29 | 株式会社日立製作所 | Method of producing printed board |
| JPS62198192A (en) * | 1986-02-26 | 1987-09-01 | 住友ベークライト株式会社 | Manufacture of printed wiring board |
| JPS63190177A (en) * | 1987-02-03 | 1988-08-05 | Nippon Mining Co Ltd | Pretreatment of copper paste before electroless plating |
| JPS6437081A (en) * | 1987-08-03 | 1989-02-07 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5482174A (en) * | 1993-08-02 | 1996-01-09 | Fujitsu Limited | Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film |
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