JPS62198192A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS62198192A JPS62198192A JP3904886A JP3904886A JPS62198192A JP S62198192 A JPS62198192 A JP S62198192A JP 3904886 A JP3904886 A JP 3904886A JP 3904886 A JP3904886 A JP 3904886A JP S62198192 A JPS62198192 A JP S62198192A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed wiring
- wiring board
- alkaline aqueous
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000007747 plating Methods 0.000 claims description 37
- 239000000126 substance Substances 0.000 claims description 16
- 239000004094 surface-active agent Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000007864 aqueous solution Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000007788 roughening Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 3
- -1 polyoxyethylene Polymers 0.000 description 11
- 238000007654 immersion Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005237 degreasing agent Methods 0.000 description 4
- 239000013527 degreasing agent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000008055 alkyl aryl sulfonates Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000010685 fatty oil Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明は、フル７デイテイブプロセスで化学銅めっきに
よりプリント配線板を製造するに際して、基板に塗布さ
れた接着剤層と化学鋼めっき皮膜との密着性を改良する
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to an adhesive layer applied to a substrate and a chemical steel plating film when manufacturing a printed wiring board by chemical copper plating in a full seven-day process. This invention relates to a method for improving adhesion with
［従来技術１
フルアディティブプロセスの工程は、標僧的には、接着
剤が塗布された基板にドリル穴あけ後、接着剤層を粗面
化し、触媒付着した後、めっきレジストを形成し、化学
銅めっき（Ｐ′ｆ、付け）をしてプリント配線板を得る
工程である。[Prior art 1] The full additive process typically involves drilling holes in a substrate coated with an adhesive, roughening the adhesive layer, adhering a catalyst, forming a plating resist, and applying chemical copper. This is a process of plating (P'f, attachment) to obtain a printed wiring board.
フル７デイテイブプロセスにおける化学銅めっき皮膜と
接着剤層との密着性を改良する方法に関しで、例えば、
特公昭５９−２２７３８号では、樹脂基板を粗面化後、
残留酸化物を中和するために触媒付与及び活性化の前に
樹脂表面を処理する組成物を提供している。Regarding a method for improving the adhesion between a chemical copper plating film and an adhesive layer in a full 7 date process, for example,
In Japanese Patent Publication No. 59-22738, after roughening the resin substrate,
Compositions are provided that treat resin surfaces prior to catalysis and activation to neutralize residual oxides.
しかし、基板に塗布された接着剤層を粗面化後、特公昭
５ ’：） −２２７３８号に開示された処理剤による
処理を実施し、触媒付与及び活性化後、更にめっきレジ
ストを形成しくこのめっきレジストの形成は特公昭５９
２２７３８％には開示されていない）、化学銅めっき
した場合には、粗面化された接着剤層と化学銅めっき皮
膜との密着性は未だ十分ではなく、化学銅めっき皮膜の
ひきはカル強度は１．２〜１．６ｋｇ／ｃｍのレベルで
ある。However, after roughening the adhesive layer applied to the substrate, a treatment using the treatment agent disclosed in Japanese Patent Publication No. 5':)-22738 is carried out, and after catalyst application and activation, a plating resist is further formed. The formation of this plating resist was carried out in the 1980s.
22738%), in the case of chemical copper plating, the adhesion between the roughened adhesive layer and the chemical copper plating film is still insufficient, and the chemical copper plating film has poor cal strength. is at a level of 1.2-1.6 kg/cm.
［発明の目的１
本発明者らは、従来化学銅めっき皮膜の基板からのひき
はカル強度が実用上十分でなかったものを改良するため
に鋭意研究した結果、めっきレノスト形／＆′後、めっ
きレノスト形成時の熱処理で基板及びめっきレジストよ
り発生した有機物による触媒表面の汚染を脱脂処理して
除くことにより触媒が再活性され、化学銅めっきの密着
性が増大するという知見を得、本発明を完成するに至っ
たものである６［発明の構成１
本発明は、フルアディティブプロセスにおいで、めっき
レジスト層形成後の絶縁基板を、有機溶剤とアルカリ性
水溶液、又はアルカリ性水溶液と界面活性剤、又は有機
溶剤とアルカリ性水溶液と界面活性剤でそれぞれ脱脂処
理した後、化学銅めっきすることを特徴とするプリント
配線板の製造方法である。[Objective of the Invention 1] As a result of intensive research in order to improve the conventional chemical copper plating film, which did not have sufficient cal strength for practical purposes, the present inventors found that after plating Renost type/&', The present invention was based on the knowledge that by degreasing and removing contamination of the catalyst surface due to organic matter generated from the substrate and plating resist during heat treatment during the formation of plating renost, the catalyst is reactivated and the adhesion of chemical copper plating is increased. 6 [Summary of the Invention 1 The present invention provides that, in a fully additive process, an insulating substrate after forming a plating resist layer is treated with an organic solvent and an alkaline aqueous solution, or an alkaline aqueous solution and a surfactant, or This method of manufacturing a printed wiring board is characterized by degreasing with an organic solvent, an alkaline aqueous solution, and a surfactant, followed by chemical copper plating.
本発明において、脱脂処理剤として用いる有機溶剤、ア
ルカリ性水溶液及び界面活性剤について説明する。In the present invention, the organic solvent, alkaline aqueous solution, and surfactant used as the degreasing agent will be explained.
有機溶剤としては、アセトン、メチルエチルケトン、ト
リクロルエタン、トリクロロエチレン、メチルアルコー
ル、エチルアルコール等があり、安全上トリクロルエタ
ン又はトリクロロエチレンが好ましい。Examples of the organic solvent include acetone, methyl ethyl ketone, trichloroethane, trichloroethylene, methyl alcohol, and ethyl alcohol, with trichloroethane or trichloroethylene being preferred for safety reasons.
次に、アルカリ性水溶液としては、苛性ソーダ、苛性カ
リ、アンモニア、炭酸ソーダ等の希薄水溶液がある。Next, examples of alkaline aqueous solutions include dilute aqueous solutions of caustic soda, caustic potash, ammonia, soda carbonate, and the like.
更に、界面活性剤としては、ポリオキシエチレンアルキ
レンエーテル、ポリオキシエチレンアルキルフェ７−ル
工−テル、ポリオキシエチレンアルキルエステル、ソル
ビタンアルキルエステル、ポリオキシエチレンソルビタ
ンアルキルエステル等の７ニオン界面活性剤、脂肪酸塩
、高級アルコール硫酸エステル塩、液体脂肪油硫酸エス
テル塩、脂肪族アミン又は脂肪族アマイドの硫酸塩、脂
肪族アルコールのリン酸エステル塩、二塩基性脂肪酸エ
ステルのスルホン塩、脂肪酸アミドスルホン酸塩、アル
キルアリルスルホン酸塩等の７ニオン界面活性剤、脂肪
族アミン塩、第４級アンモニウム塩、アルキルピリジニ
ウム塩等のカチオン界面活性剤、あるいはこれら界面活
性剤の混合物等である。Furthermore, as surfactants, 7-ion surfactants such as polyoxyethylene alkylene ether, polyoxyethylene alkyl phenol, polyoxyethylene alkyl ester, sorbitan alkyl ester, polyoxyethylene sorbitan alkyl ester, etc. Fatty acid salt, higher alcohol sulfate ester salt, liquid fatty oil sulfate ester salt, sulfate of aliphatic amine or aliphatic amide, phosphate ester salt of aliphatic alcohol, sulfone salt of dibasic fatty acid ester, fatty acid amide sulfonate , 7-ion surfactants such as alkylaryl sulfonates, cationic surfactants such as aliphatic amine salts, quaternary ammonium salts, alkylpyridinium salts, or mixtures of these surfactants.
これらの界面活性剤には少量の酸又はアルカリを含有さ
せることら可能である。These surfactants can contain a small amount of acid or alkali.
上記界面活性剤としては、具体的には、アイコーローフ
（株）のロプレップ−８５（ノニオン型）、上材工業（
株）のクリーンメイト（アニオン型）、荏原ニーシライ
ト（株）の０Ｐ−１４４（アニオン型・ノニオン型混合
）等を使用することができる。Specifically, the above-mentioned surfactants include Loprep-85 (nonionic type) manufactured by Aikoloaf Co., Ltd., and Uezai Kogyo (
Cleanmate (anionic type) manufactured by Ebara Nishilight Co., Ltd., 0P-144 (mixed anionic type and nonionic type) manufactured by Ebara Nishilight Co., Ltd., and the like can be used.
本発明において、脱脂処理剤による脱脂処理条件は、１
０〜９０゛Ｃで、３０秒〜１０分が適当であるが、４（
１〜８０゛Ｃで、３〜７分がより好ましい。前記脱脂処
理剤による脱脂処理は有機溶剤又はアルカリ性水溶液又
は界面活性剤への浸せきのみでも比較的良好な密着性が
得られるが、有機溶剤浸せきとアルカリ性水溶液浸せき
、又はアルカリ性水溶液浸せきと界面活性剤浸せき、又
は有機溶剤浸せきとアルカリ性水溶液浸せきと界面活性
剤浸せきを併用することにより、より一層めっき皮膜の
密着性向上の効果を上げることができる。In the present invention, the degreasing treatment conditions using the degreasing agent are 1
30 seconds to 10 minutes at 0 to 90°C is appropriate, but 4 (
More preferably, the temperature is 1 to 80°C for 3 to 7 minutes. Relatively good adhesion can be obtained by degreasing with the above-mentioned degreasing agent only by immersion in an organic solvent, alkaline aqueous solution, or surfactant, but organic solvent immersion and alkaline aqueous solution immersion, or alkaline aqueous solution immersion and surfactant immersion. Alternatively, by using organic solvent immersion, alkaline aqueous solution immersion, and surfactant immersion in combination, the effect of improving the adhesion of the plating film can be further enhanced.
前記脱脂処理剤の脱脂処理順序としては、右磯溶剤→ア
ルカリ性水溶液→界面活性剤が最も効果的である。The most effective degreasing order of the degreasing agent is Uiso solvent→alkaline aqueous solution→surfactant.
［発明の効果１
本発明によれば、めっきレジスト形成の段階でめっきレ
ジスト等より発生する有機物により汚染された絶縁基板
を脱脂して、接着剤層に付着している触媒を再活性化す
ることができるので、後工程の化学銅めっき段階におい
て、触媒が付着し活性化された接着剤層と化学銅めっき
皮膜との密着性を大幅に向上することができる。[Effect of the invention 1 According to the present invention, an insulating substrate contaminated with organic matter generated from a plating resist etc. during the plating resist formation stage is degreased and the catalyst attached to the adhesive layer is reactivated. Therefore, in the subsequent chemical copper plating step, the adhesion between the activated adhesive layer to which the catalyst is attached and the chemical copper plating film can be significantly improved.
従って、従来のようにめっきレジスト形成後の絶縁基板
を脱脂処理しない場合、銅めっき皮膜のひきはカル強度
は１．２〜１．６ｋｇ／ｃｎ＋であるのと比較して、本
発明のように脱脂処理した場合には２．０〜２，４．ｋ
ｇ／ｃｍと大幅な向上が達成される。Therefore, when the insulating substrate is not degreased after forming the plating resist as in the conventional case, the cal strength of the copper plating film is 1.2 to 1.6 kg/cn+. 2.0 to 2.4 when degreased. k
A significant improvement of g/cm is achieved.
また、はんだ耐熱性においても、前記の如き脱脂処理工
程のない場合、２６０℃で５〜１０秒であったものが、
本発明の場合には２０〜３０秒と大幅な向上がみられる
。In addition, regarding soldering heat resistance, it was 5 to 10 seconds at 260°C without the degreasing process as described above.
In the case of the present invention, a significant improvement of 20 to 30 seconds can be seen.
［実施例１
本発明のプリント配線板の製造方法について、以下に実
施例及び比較例により説明する６
実施例１
住友ベークライト（株）製 アディティブめっき用接着
剤付積層板ＰＬ−８１４７ＡＤを下記の工程で処理した
。[Example 1] The manufacturing method of the printed wiring board of the present invention will be explained below using Examples and Comparative Examples 6. Example 1 A laminate with adhesive for additive plating PL-8147AD manufactured by Sumitomo Bakelite Co., Ltd. was subjected to the following process. Processed with.
Ａ 予備焼成 １７０℃ １０分
Ｂ ドリル穴あけ
Ｃ粗面化処理 クロム酸／硫酸５０℃ １０分Ｄ 触
媒処理
Ｅ 活性化処理
Ｆ めっきレジスト （１）エポキシ樹脂系レジスト印
刷（表面）（２）乾燥 １５０℃ １５分Ｇ同上（裏面
）
Ｈトリクロロエチレン浸せき ２０℃ ５分１５％苛性
ソーダ浸せき ４０℃ ５分Ｊ ロプレップ−８５
５０℃ ５分
Ｋ 化学銅めっき
上記工程によりめっき厚３０μｍのプリント配線板を得
た。A Preliminary firing 170℃ 10 minutes B Drilling C Surface roughening treatment Chromic acid/sulfuric acid 50℃ 10 minutes D Catalyst treatment E Activation treatment F Plating resist (1) Epoxy resin resist printing (surface) (2) Drying 150℃ 15 minutes G Same as above (back side) H Trichlorethylene immersion 20℃ 5 minutes 15% caustic soda immersion 40℃ 5 minutes J Roprep-85
50° C. 5 minutes K Chemical copper plating A printed wiring board with a plating thickness of 30 μm was obtained through the above steps.
実施例２
実施例１において、Ｊの工程を省略した以外は実施例１
と同じ工程によりめっき厚３０μｍのプリント配線板を
得た。Example 2 Example 1 except that step J was omitted in Example 1.
A printed wiring board with a plating thickness of 30 μm was obtained by the same process as above.
実施例３
実施例１において、Ｈの工程を省略した以外は実施例１
と同じ工程によりめっき厚３０μｍのプリント配線板を
得た。Example 3 Same as Example 1 except that step H was omitted in Example 1.
A printed wiring board with a plating thickness of 30 μm was obtained by the same process as above.
比較例１
実施例１において、Ｈ１■及びＪの工程を削除した以外
は実施例１と同じ工程によりぬつぎ厚３０μｍのプリン
ト配線板を得た。Comparative Example 1 A printed wiring board with a seam thickness of 30 μm was obtained by the same steps as in Example 1 except that steps H1 and J were omitted.
実施例１．２．３及び比較例１で得られたプリント配線
板について、めっき外観を観察し、ＪＩＳ Ｃ６４８１
によるひぎはカル強度及びはんだ耐熱性を測定した。結
果を第１表に示す。The plating appearance of the printed wiring boards obtained in Example 1.2.3 and Comparative Example 1 was observed, and JIS C6481
Higi measured the cull strength and soldering heat resistance. The results are shown in Table 1.
第１表
実施例１ 実施例２ 実施例３ 比較例１ひ外はがし強
度 ２．３ ２，２ ２，２ １．２に
７０ｍ）
はんだ耐熱性 ２７ ２５ ２５
５２６０℃、 ）Table 1 Example 1 Example 2 Example 3 Comparative Example 1 External peel strength 2.3 2,2 2,2 1.2 to 70m) Solder heat resistance 27 25 25
5260℃, )
Claims (1)
着剤層を粗面化し、化学めっき用触媒を付着後めっきレ
ジスト層を形成し、次いで化学めっきをしてプリント配
線板を製造する方法において、めっきレジスト層形成後
、絶縁基板を有機溶剤とアルカリ性水溶液、又はアルカ
リ性水溶液と界面活性剤、又は有機溶剤とアルカリ性水
溶液と界面活性剤でそれぞれ脱脂処理した後、化学銅め
っきすることを特徴とするプリント配線板の製造方法。A method of manufacturing a printed wiring board by forming an adhesive layer for plating on an insulating substrate, roughening the adhesive layer, adhering a chemical plating catalyst, forming a plating resist layer, and then performing chemical plating. After forming the plating resist layer, the insulating substrate is degreased with an organic solvent and an alkaline aqueous solution, an alkaline aqueous solution and a surfactant, or an organic solvent and an alkaline aqueous solution and a surfactant, and then chemical copper plating is performed. A method for manufacturing a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3904886A JPS62198192A (en) | 1986-02-26 | 1986-02-26 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3904886A JPS62198192A (en) | 1986-02-26 | 1986-02-26 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62198192A true JPS62198192A (en) | 1987-09-01 |
Family
ID=12542243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3904886A Pending JPS62198192A (en) | 1986-02-26 | 1986-02-26 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62198192A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03217077A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
| JP2007327131A (en) * | 2006-06-09 | 2007-12-20 | Rohm & Haas Electronic Materials Llc | Method of electroless plating on resin surface |
| EP2624671A4 (en) * | 2010-09-27 | 2016-12-21 | Jx Nippon Mining & Metals Corp | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board |
-
1986
- 1986-02-26 JP JP3904886A patent/JPS62198192A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03217077A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
| JP2007327131A (en) * | 2006-06-09 | 2007-12-20 | Rohm & Haas Electronic Materials Llc | Method of electroless plating on resin surface |
| EP2624671A4 (en) * | 2010-09-27 | 2016-12-21 | Jx Nippon Mining & Metals Corp | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board |
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