JPH03217075A - Surface treatment of internal-layer base material for multilayer copper-clad laminated board - Google Patents
Surface treatment of internal-layer base material for multilayer copper-clad laminated boardInfo
- Publication number
- JPH03217075A JPH03217075A JP1204590A JP1204590A JPH03217075A JP H03217075 A JPH03217075 A JP H03217075A JP 1204590 A JP1204590 A JP 1204590A JP 1204590 A JP1204590 A JP 1204590A JP H03217075 A JPH03217075 A JP H03217075A
- Authority
- JP
- Japan
- Prior art keywords
- surface treatment
- base material
- layer base
- treatment liquid
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 title claims abstract description 98
- 239000000463 material Substances 0.000 title claims abstract description 74
- 239000007788 liquid Substances 0.000 claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000003746 surface roughness Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000000087 stabilizing effect Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000007822 coupling agent Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- VBRBYBYVXWLHPX-UHFFFAOYSA-N 4-(3-ethyloxiran-2-yl)butyl-trimethoxysilane Chemical compound CCC1OC1CCCC[Si](OC)(OC)OC VBRBYBYVXWLHPX-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、エポキシ樹脂等の絶縁材を用いた多層銅張積
層板の内層基材の表面処理方法に関するものであり、特
に内層基材の銅箔の酸化処理面と樹脂層との接着性を向
上させる表面処理方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for surface treatment of an inner layer base material of a multilayer copper-clad laminate using an insulating material such as an epoxy resin, and particularly relates to a surface treatment method for an inner layer base material of a multilayer copper clad laminate using an insulating material such as an epoxy resin. The present invention relates to a surface treatment method for improving the adhesion between an oxidized surface of copper foil and a resin layer.
−１ー
近年、銅張積層板の諸特性に対する要求はますます厳し
くなってきている。特に産業用や民生用のプリント配線
板用の銅張積層板にその傾向が顕著である゛。例えば高
密度化の要求により信号線はますます細くなり、信頼性
の確保のため銅箔と樹脂間の接着強度が重要となってい
る。また多層化の傾向も顕著で、銅箔の接着強度は、銅
箔粗化面のみならず、銅箔光沢面とこれに密着する樹脂
層との間においても一層重要になってきている。-1- In recent years, requirements for the various properties of copper-clad laminates have become increasingly strict. This tendency is particularly noticeable in copper-clad laminates for industrial and consumer printed wiring boards. For example, demand for higher density has made signal lines thinner and thinner, and the strength of the bond between copper foil and resin has become important to ensure reliability. In addition, there is a remarkable trend toward multilayering, and the adhesive strength of copper foil is becoming more important not only between the roughened surface of the copper foil, but also between the shiny surface of the copper foil and the resin layer that adheres to it.
第２図は内層基材製造後の多層基板製造工程に至る多層
銅張積層板の製造工程を示す系統図である。FIG. 2 is a system diagram showing the manufacturing process of a multilayer copper-clad laminate, which includes the manufacturing process of a multilayer board after manufacturing the inner layer base material.
一般に内層基材としては０．５〜０ ． ６ｍｍ程度の
厚さの両面銅張積層板が用いられており、エッチング等
により両面の銅箔にパターニング（ａ）を行って所定の
回路パターンを形成したのち、整面（ｂ）、水洗（ｃ）
、乾燥（ｄ）の各工程を行う。そして酸化処理工程（ｅ
）において、銅箔の回路パターンを酸化処理して表面に
酸化膜を形成したのち、乾燥（ｆ）を行う。その後表面
処理工程（ｇ）において、一般２
にカップリング剤を含むカップリング処理液を表面処理
液として表面処理を行い、乾燥工程（ｈ）を経たのち、
多層基板製造工程（１）に入る。多層基板製造工程（ｉ
）では，表面処理を行った内層基材と、ガラスクロスー
エポキシ樹脂よりなるプリプレグとを交互に積層し、最
外層に銅箔を積層して加熱加圧成形することにより多層
銅張Ｍ層板を製造する。Generally, the inner layer base material is 0.5 to 0. A double-sided copper-clad laminate with a thickness of about 6 mm is used, and after patterning (a) on the copper foil on both sides by etching etc. to form a predetermined circuit pattern, the surface is leveled (b) and washed with water (c). )
, drying (d). and oxidation treatment step (e
), the copper foil circuit pattern is oxidized to form an oxide film on the surface, and then dried (f). After that, in the surface treatment step (g), surface treatment is performed using a coupling treatment solution containing a coupling agent in general 2 as a surface treatment solution, and after passing through a drying step (h),
Enter the multilayer board manufacturing process (1). Multilayer board manufacturing process (i
), a multilayer copper-clad M-layer board is produced by alternately laminating a surface-treated inner layer base material and a prepreg made of glass cloth-epoxy resin, and then laminating copper foil on the outermost layer and molding under heat and pressure. Manufacture.
第３図は従来の表面処理装置を示す断面図であり、図に
おいて、（１）は内層基材、（２）はその両側に積層さ
れた銅箔の回路パターン、（３）は表面処理液、（４）
は処理液層である。Figure 3 is a cross-sectional view showing a conventional surface treatment device. In the figure, (1) is the inner layer base material, (2) is the copper foil circuit pattern laminated on both sides of the inner layer base material, and (3) is the surface treatment liquid. ,(4)
is the processing liquid layer.
従来の内層基材（１）の表面処理方法は、カップリング
剤を含むカップリング処理液からなる表面処理液（３）
を処理液槽（４）の中に入れ、その中に被処理材である
回路パターン（２）を形成した内層基材（１）を浸漬し
た後、引上げて乾燥し，表面処理膜を内層基材（１）表
面に形成する。そして乾燥後、内層基材（１）を次工程
の多層基板製造工程に供している。The conventional surface treatment method for the inner layer base material (1) is to use a surface treatment liquid (3) consisting of a coupling treatment liquid containing a coupling agent.
is placed in the treatment liquid tank (4), and the inner layer base material (1) on which the circuit pattern (2) is formed, which is the material to be treated, is immersed therein, then pulled up and dried, and the surface treated film is placed on the inner layer base material. Formed on the surface of material (1). After drying, the inner layer base material (1) is subjected to the next multilayer board manufacturing process.
３
〔発明が解決しようとする課題〕
しかしながら、上記のような従来の表面処理方法におい
ては、単に被処理材である内層基材（１）を、カップリ
ング剤を含む表面処理液（３）に浸漬したのち、引上げ
て乾燥する方法であったので、表面処理液の粘度や組成
の如何に拘らず、内層基材（１）の表面には銅箔の回路
パターン（２）が形成されている部分と、形成されてい
ない部分があるため、内層基材の表面に均一な表面処理
膜を一様に形成することができない。このため多層基板
製造工程で、表面処理膜とこれに密着する樹脂層間でフ
クレ、ハガレを生じたり、製造後の多層基板に接着力の
著しいバラツキを生じたり、実装時にハンダによるフク
レやハガレを生じることがあり、著しく信頼性を損うと
いう問題点があった。3 [Problems to be Solved by the Invention] However, in the conventional surface treatment method as described above, the inner layer base material (1), which is the material to be treated, is simply treated with a surface treatment liquid (3) containing a coupling agent. Since the method involved dipping, pulling up and drying, the copper foil circuit pattern (2) was formed on the surface of the inner layer base material (1) regardless of the viscosity or composition of the surface treatment liquid. Because there are some parts and some parts that are not formed, it is not possible to uniformly form a uniform surface treatment film on the surface of the inner layer base material. For this reason, during the multilayer board manufacturing process, blistering and peeling may occur between the surface treatment film and the resin layer that adheres to it, significant variations in adhesive strength may occur in the multilayer board after manufacturing, and blistering and peeling may occur due to solder during mounting. There was a problem in that reliability was significantly impaired.
従来、表面処理液は水や溶剤並みの粘度であり、表面処
理膜は無色透明で、その厚さが極めて薄いので、表面処
理膜の付着状態と接着力の関係について充分な検討がな
されていなかった。Conventionally, surface treatment liquids have a viscosity similar to that of water or solvents, and surface treatment films are colorless and transparent, and their thickness is extremely thin, so the relationship between the adhesion state of the surface treatment film and its adhesive strength has not been sufficiently studied. Ta.
本発明は前記の問題点を解決するためになされ４
たもので、表面処理膜を内層基材表面に一様に形成して
、多層基板の内層基材との接着力を安定化するとともに
向上させ、その信頼性を高めることができる多層銅張積
層板用内層基材の表面処理方法を提案することを目的と
する。The present invention has been made in order to solve the above-mentioned problems.It forms a surface treatment film uniformly on the surface of the inner layer base material, thereby stabilizing and improving the adhesive force with the inner layer base material of the multilayer substrate. The purpose of the present invention is to propose a surface treatment method for inner layer substrates for multilayer copper-clad laminates, which can increase the reliability of multilayer copper-clad laminates.
本発明の多層銅張積層板用内層基材の表面処理方法は、
多層銅張積層板を形成するための内層基材の銅箔の酸化
膜表面に表面処理を行う方法において、表面処理液を内
層基材に接触させたのち、表面粗さを５〜１５０μｍに
調整した絞り取りローラにより内層基材の表面処理液を
絞り取るとともに、内層基材に表面処理液を均一に付着
させて、表面処理を行い、表面処理膜を形成する方法で
ある。The method for surface treatment of an inner layer base material for a multilayer copper-clad laminate of the present invention includes:
In a method of surface-treating the oxide film surface of copper foil as an inner layer base material for forming a multilayer copper-clad laminate, the surface treatment liquid is brought into contact with the inner layer base material, and then the surface roughness is adjusted to 5 to 150 μm. In this method, the surface treatment liquid is squeezed out of the inner layer base material using a squeeze roller, and the surface treatment liquid is evenly applied to the inner layer base material to perform surface treatment and form a surface treatment film.
本発明で使用する表面処理液としては、例えばシランカ
ツプリング剤、チタネートカップリング剤、または両者
の混合カップリング剤などのカップリング剤を０．３〜
５重量％含む表面処理液があげられる。As the surface treatment liquid used in the present invention, a coupling agent such as a silane coupling agent, a titanate coupling agent, or a mixed coupling agent of both may be used in an amount of 0.3 to
An example is a surface treatment liquid containing 5% by weight.
本発明の多層銅張積層板用内層基材の表面処理方法にお
いては、表面処理液を内層基材に接触させたのち、表面
粗さを５〜１５０μｍに調整した絞り取りローラにより
内層基材の表面処理液を絞り取るとともに、内層基材に
表面処理液を均一に付着させて、表面処理を行い、表面
処理膜を形成する。In the method for surface treatment of an inner layer base material for a multilayer copper-clad laminate according to the present invention, after the surface treatment liquid is brought into contact with the inner layer base material, the inner layer base material is While squeezing out the surface treatment liquid, the surface treatment liquid is applied uniformly to the inner layer base material to perform surface treatment and form a surface treatment film.
従来のように、表面処理液に、被処理材である内層基材
を浸漬して引上げると、その表面に付着した表面処理液
が内層基材表面のハジキや液ダマリのため表面に均一に
付着せず、一様な表面処理膜を形成できないが、これは
被処理材の内層基材の表面に表面処理液が接触した際の
表面張力が大きいためである。このため本発明では、表
面処理液を内層基材に接触させたのち、表面粗さを５〜
１５０μｍに調整した絞り取りローラにより内層基材の
表面処理液を絞り取るとともに、内層基材に表面処理液
を均一に付着させて、これにより一様な表面処理膜を形
成する。Conventionally, when the inner layer substrate, which is the material to be treated, is immersed in a surface treatment liquid and pulled up, the surface treatment liquid adhering to the surface of the inner layer substrate is not uniformly distributed on the surface due to repellency or liquid clumps on the surface of the inner layer substrate. The surface treatment liquid does not adhere and cannot form a uniform surface treatment film, but this is because the surface tension is high when the surface treatment liquid contacts the surface of the inner layer base material of the material to be treated. Therefore, in the present invention, after bringing the surface treatment liquid into contact with the inner layer base material, the surface roughness is
The surface treatment liquid on the inner layer base material is squeezed out by a squeezing roller adjusted to 150 μm, and the surface treatment liquid is evenly applied to the inner layer base material, thereby forming a uniform surface treatment film.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
−６−
第１図は実施例で使用する表面処理装置の断面図であり
、図において、第３図と同一符号は同一または相当部分
を示す。表面処理装置は内層基材（１）が吊下治具（５
）に吊下げられた状態で垂直方向に浸漬できるように縦
長に形成されており、表面処理液（３）の上方には１対
の絞り取りローラ（６）が配置されている。絞り取りロ
ーラ（６）は表面粗さを５〜１５０ Ｉｔｍに調整した
金属、硬質プラスチック等の硬質ローラや、軟質プラス
チック、ゴム等の軟質ローラなどが使用でき、吊下治具
（５）により吊下げられた内層基材（１）の表面に両側
から接して、内層基材（１）に付着した表面処理液を絞
り取るとともに、内層基材（１）の全面に表面処理液を
均一に付着させるようになっている。-6- FIG. 1 is a sectional view of a surface treatment apparatus used in an example, and in the figure, the same reference numerals as in FIG. 3 indicate the same or corresponding parts. In the surface treatment equipment, the inner layer base material (1) is
), and a pair of squeezing rollers (6) are arranged above the surface treatment liquid (3). The squeezing roller (6) can be a hard roller made of metal or hard plastic with a surface roughness adjusted to 5 to 150 Itm, or a soft roller made of soft plastic or rubber. Contact the surface of the lowered inner layer base material (1) from both sides to squeeze out the surface treatment liquid adhering to the inner layer base material (1), and evenly apply the surface treatment liquid to the entire surface of the inner layer base material (1). It is designed to let you do so.
内層基材（１）の表面処理方法は、被処理材である内層
基材（１）を吊下治具（５）により吊下げた状態で、処
理液槽（４）内の表面処理液（３）に浸漬した後、その
上部に設けた絞り取りローラ（６）間を通過させ、内層
基材（１）の表面に付着した表面処理液を絞り取るとと
もに、内層基材（１）の全面に均一に７−
付着させる。このとき絞り取りローラ（６）は、内層基
材（１）のソリや曲り、あるいはその表面の銅箔の回路
パターン（２）の有無による凹凸にも拘らず、まず浸漬
により多量にムラのある状態で付着した表面処理液の膜
を均一に絞り取り、次に、内層基材（１）表面の凹凸面
の全面に一様に表面処理液を付着させる。絞り取りロー
ラ（６）はバネ圧、ローラ間のギャップ、ローラの材質
などにより表面処理液の付着状態をコントロールするこ
とができ、特にその表面に設けた粗面の微細な凹凸によ
り５表面処理液（３）のかき取りと付与を均一に行うこ
とができる。The surface treatment method for the inner layer base material (1) involves suspending the inner layer base material (1), which is a material to be treated, using a hanging jig (5), and applying a surface treatment solution ( 3), the surface treatment liquid is passed between the squeezing rollers (6) provided on the upper part of the liquid, and the surface treatment liquid adhering to the surface of the inner layer base material (1) is squeezed out, and the entire surface of the inner layer base material (1) is dipped. 7- Apply it evenly to the surface. At this time, the squeezing roller (6) first has a large amount of unevenness due to dipping, despite the warping or bending of the inner layer base material (1) or the unevenness caused by the presence or absence of the copper foil circuit pattern (2) on its surface. The film of the surface treatment liquid adhered to the inner layer base material (1) is then uniformly squeezed out, and then the surface treatment liquid is uniformly applied to the entire surface of the uneven surface of the inner layer base material (1). The state of adhesion of the surface treatment liquid to the squeezing roller (6) can be controlled by adjusting the spring pressure, the gap between the rollers, the material of the roller, etc. In particular, the fine irregularities on the rough surface provided on the surface of the squeeze roller (6) allow the surface treatment liquid to be adhered to the surface treatment liquid. (3) Scraping and application can be performed uniformly.
実施例１
まず内層基材（１）として、両面に厚さ７０μｍの銅箔
を張った全体の厚さ０．６０ｍｍのガラスクロスーエポ
キシ樹脂の銅張積層板を用いた。まず第２図のパターニ
ング（ａ）工程として、両面の銅箔に所定のパターンと
なるようにレジストを付与し、エッチングなどによりパ
ターニングし，回路パターン（２）を形成する。このパ
ターン面を整面（ｂ）、水洗８
（ｃ）、および乾燥（ｄ）シた後、酸化処理工程（ｅ）
として、黒化処理液（亜塩素酸ナトリウム３１ｇ／Ｑ、
水酸化ナトリウム１５ｇ／ｆｌ、リン酸三ナトリウム１
２ｇ／Ｑの水溶液）中に９５℃で２分間浸漬して酸化膜
を形成した後、１５０’Ｃのオーブン中で１５分間乾燥
（ｆ）させた。Example 1 First, as the inner layer base material (1), a copper-clad laminate made of glass cloth-epoxy resin having a total thickness of 0.60 mm and having a copper foil of 70 μm thick on both sides was used. First, in the patterning step (a) in FIG. 2, a resist is applied to the copper foil on both sides so as to form a predetermined pattern, and patterning is performed by etching or the like to form a circuit pattern (2). After this pattern surface is leveled (b), washed with water (c), and dried (d), an oxidation treatment step (e) is performed.
As, blackening treatment liquid (sodium chlorite 31g/Q,
Sodium hydroxide 15g/fl, trisodium phosphate 1
After forming an oxide film by immersing it in a 2g/Q aqueous solution at 95°C for 2 minutes, it was dried (f) in an oven at 150'C for 15 minutes.
次に表面処理工程（ｇ）として、カップリング処理液（
β一（３，４エポキシシク口ヘキシル）エチルトリメト
キシシラン２重景％、酢酸０．５重量％、エタノール６
０重量％、水３７．５重量％）がらなる表面処理液（３
）を用い、これを第１図の表面処理装置の処理液槽（４
）に満し、パターニングおよび酸化膜を形成した内層基
材（１）を吊下治具（５）により表面処理液（３）中に
吊下げ浸漬した。その後、表面粗さが２０〜３０μｍに
なるように研磨したフッ素樹脂（テフロン）皮膜を有す
る直径５０ｍＩＩ１のゴムローラ（硬さ： ＪＩＳ Ａ
４０”）からなる絞り取りローラ（６）間を押圧力５
００ｇの条件で通過させ、内層基材（１）の表面に付着
した表面処理液を絞り取るとともに、内層基材（１）の
表面に表面処理液を均一に付着さｑー
せた。そして室温で１ｏ分間風乾し、次にこれをオーブ
ン内にて、１１０℃で３０分間乾燥（ｈ）シて、カップ
リング剤の表面処理膜を形成した。Next, as a surface treatment step (g), a coupling treatment solution (
β-(3,4-epoxyhexyl)ethyltrimethoxysilane 2%, acetic acid 0.5% by weight, ethanol 6%
Surface treatment liquid (3.0% by weight, 37.5% by weight of water)
) and place it in the treatment liquid tank (4) of the surface treatment equipment shown in Figure 1.
), and the inner layer base material (1) on which patterning and an oxide film were formed was suspended and immersed in the surface treatment liquid (3) using a hanging jig (5). Thereafter, a rubber roller with a diameter of 50 mII1 (hardness: JIS A
A pressing force of 5 is applied between the squeezing rollers (6) consisting of
The surface treatment liquid was allowed to pass under the condition of 00 g, and the surface treatment liquid adhering to the surface of the inner layer base material (1) was squeezed out, and the surface treatment liquid was uniformly adhered to the surface of the inner layer base material (1). Then, it was air-dried at room temperature for 10 minutes, and then dried in an oven at 110° C. for 30 minutes (h) to form a surface-treated film of the coupling agent.
この表面処理膜を形成した内層基材（１）は、多層基板
製造工程（ｉ）において、ガラスクロスーエボキシ樹脂
よりなるプリプレグ（図示せず）と交互に必要層数を積
層し、最外層に銅箔を積層してプレス成形することによ
り、多層銅張積層板を得た。In the multilayer board manufacturing process (i), the inner layer base material (1) on which this surface treatment film is formed is laminated with a required number of layers alternately with a prepreg (not shown) made of glass cloth-epoxy resin, and the outermost layer is A multilayer copper-clad laminate was obtained by laminating copper foil and press-molding.
比較例ｌ
絞り取りローラ（６）による表面処理液の絞り取りと均
一付着を行わなかったほかは、実施例１と同様にして、
多層銅張積層板を得た。Comparative Example 1 The same procedure as in Example 1 was carried out, except that the surface treatment liquid was not squeezed out using the squeezing roller (6) and the surface treatment liquid was not uniformly adhered.
A multilayer copper-clad laminate was obtained.
上記実施例１および比較例１の多層銅張積層板について
、その表面処理した銅箔とプリプレグ間の引剥し力を測
定した。結果を表１に示す。Regarding the multilayer copper-clad laminates of Example 1 and Comparative Example 1, the peeling force between the surface-treated copper foil and the prepreg was measured. The results are shown in Table 1.
表１
１〇一
また絞り取りローラ（６）の表面粗さと、表面処理液の
均一付着性について実験を行った結果、表面粗さが５〜
１５０μｍにおいて均一な表面処理膜が形成されること
がわかった。Table 1 101 Also, as a result of experiments on the surface roughness of the squeezing roller (6) and the uniform adhesion of the surface treatment liquid, the surface roughness was 5 to 5.
It was found that a uniform surface treatment film was formed at a thickness of 150 μm.
なお、本発明の方法においては、単にカップリング剤を
含む表面処理液のみならず、一般市販のプライマーや接
着剤なども表面処理液として同様に用いることができる
。In addition, in the method of the present invention, not only a surface treatment liquid containing a coupling agent but also a commonly available primer or adhesive can be used as the surface treatment liquid.
また上記実施例において、均一に表面処理膜を形成する
ための絞り取りローラ（６）は、１対のみに限らず、数
対設置して段階的に処理するようにしてもよい。さらに
絞り取りローラ（６）の表面への粗度の付与は、表面に
筒状のメッシュを被覆したり、スポンジ状の材料を配し
たものなどでもよｂ）。Further, in the above embodiment, the number of squeezing rollers (6) for uniformly forming the surface treatment film is not limited to one pair, but may be installed in several pairs to perform the treatment in stages. Furthermore, roughness can be imparted to the surface of the squeezing roller (6) by coating the surface with a cylindrical mesh or by disposing a sponge-like material b).
以上のように、本発明によれば、表面処理液を内層基材
に接触させたのち、表面粗さを調整した絞り取りローラ
により内層基材の表面処理液を絞り取るとともに、内層
基材に表面処理液を均一に付着させるようにしたので、
内層基材表面に一様な表面処理膜をムラなく容易に形成
することができ、これにより接着力が安定するとともに
、そのレベルを向上させることができ、多層銅張積層板
の歩留および信頼性の向上に寄与できる効果がある。As described above, according to the present invention, after the surface treatment liquid is brought into contact with the inner layer base material, the surface treatment liquid is squeezed from the inner layer base material using a squeezing roller whose surface roughness is adjusted, and the surface treatment liquid is applied to the inner layer base material. Since the surface treatment liquid was applied evenly,
A uniform surface treatment film can be easily and evenly formed on the surface of the inner layer substrate, which stabilizes the adhesive strength and improves its level, improving the yield and reliability of multilayer copper-clad laminates. It has the effect of contributing to improving sexual performance.
第１図は実施例の表面処理装置の断面図、第２図は多層
銅張積層板の製造工程を示す系統図、第３図は従来の表
面処理装置の断面図である。
各図中、同一符号は同一または相当部分を示し、（１）
は内層基材、（２）は回路パターン、（３）は表面処理
液、（４）は処理液槽、（５）は吊下治具、（６）は絞
り取りローラである。FIG. 1 is a sectional view of a surface treatment apparatus according to an embodiment, FIG. 2 is a system diagram showing the manufacturing process of a multilayer copper-clad laminate, and FIG. 3 is a sectional view of a conventional surface treatment apparatus. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
(2) is an inner layer base material, (2) is a circuit pattern, (3) is a surface treatment liquid, (4) is a treatment liquid tank, (5) is a hanging jig, and (6) is a squeezing roller.
Claims (1)
の酸化膜表面に表面処理を行う方法において、表面処理
液を内層基材に接触させたのち、表面粗さを５〜１５０
μｍに調整した絞り取りローラにより内層基材の表面処
理液を絞り取るとともに、内層基材に表面処理液を均一
に付着させて、表面処理を行い、表面処理膜を形成する
ことを特徴とする多層銅張積層板用内層基材の表面処理
方法。(1) In a method of surface-treating the surface of the oxide film of the copper foil that is the inner layer base material for forming a multilayer copper-clad laminate, after bringing the surface treatment liquid into contact with the inner layer base material, the surface roughness is set to 5 to 5. 150
It is characterized by squeezing out the surface treatment liquid on the inner layer base material using a squeezing roller adjusted to μm, and uniformly applying the surface treatment liquid to the inner layer base material to perform surface treatment and form a surface treatment film. A method for surface treatment of an inner layer base material for a multilayer copper-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204590A JPH03217075A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204590A JPH03217075A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03217075A true JPH03217075A (en) | 1991-09-24 |
Family
ID=11794629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1204590A Pending JPH03217075A (en) | 1990-01-22 | 1990-01-22 | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03217075A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944894A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS5944893A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS6227773B2 (en) * | 1983-09-29 | 1987-06-16 | Nitta Gelatin Kk |
-
1990
- 1990-01-22 JP JP1204590A patent/JPH03217075A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944894A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS5944893A (en) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS6227773B2 (en) * | 1983-09-29 | 1987-06-16 | Nitta Gelatin Kk |
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