JPS5944893A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention relates to a method for manufacturing a multilayer printed circuit board, and more particularly, to a method for pre-treating circuit steel foil for an inner layer circuit board with reeds embedded within the multilayer printed circuit board. A multilayer printed circuit board is a printed circuit board with a pre-stamped inner layer circuit formed. Glass fiber is not required, and additional materials such as woven cloth and nonwoven fabric are used on the side, and polyimide 4υj resin, etc. (L) fP curable resin is used on the side. The inner layer is fully compressed and the pre-greg is hardened by multi-layer bonding to make it semi-convenient. circuit 4
ii It is manufactured by inserting it inside through the Kegrigreg γ. .

Conventionally, this (/used in the construction of multi-layer printed circuit boards in the J Building, 2nd and 1st layer!/) The circuit wells of the inner layer circuit boards was prepared with the front surface on the back. Double-sided roughened copper with rough edges?ゐ、And then there is the oxide film forming treatment on the surface of the circuit copper foil in 7? r: Between each layer (/
It has good J contact properties. However, in the case of both m-roughened copper, the cost is higher and the roughened surface is not sufficiently stabilized compared to the single-sided roughened copper of n'. In addition, the 'I-J'M machine with the Ryuka film formation process is inferior to the process of branching when forming through-hole plating! l Deterioration of contact between the copper foil surface and the side fat occurs.

The present invention has been made in view of one point of difficulty in manufacturing, and includes an inner layer circuit board on which a circuit pattern of copper foil is formed 81';
In the manufacturing method of multilayer printed circuit boards, the inner layer circuit board is impregnated with a thermosetting resin, dried, and then embedded inside through the holes. It is a method in which an oxide film is chemically formed on the surface and treated with a silane coupling agent 2.

In other words, the present invention is a multilayer printed circuit board manufacturing process in which an oxide film is oxidized on the printed "1" name plate with an inner layer circuit formed in advance on the foil moat surface, and the surface R31Xs (
The surface of the RPI organic functional group (X&: a hydrometer group bonded to a silicon atom) is treated with a silane coupling agent.

Inner layer circuit 82 (1) circuit In order to completely form an oxide film on the surface of the copper foil, it is preferable to immerse the copper foil in a water bath containing sodium hydroxide, trisodium phosphate, or sodium chlorite (IJ mixed water).

Sodium hydroxide 6~+ Og/1. Trisodium phosphate 5-20 g/71. Sodium chlorite 10~
A composition of 50 g/l is particularly preferred.

If the amount exceeds the above amount (/J), the oxide film formation rate will be fast and a stable uniform oxide film layer will not be obtained.If the amount is less than the above amount, the formation will be slow and the process will not be stable and a uniform layer will not be obtained. .

Examples of the silane coupling agents used in the present invention include γ-aminoglobiltriethoxysilane, γ-mercaptofurobiltrimethoxysilane, γ-crisitoxyprobyltrimethoxysilane, vinyltriethoxysilane, -glycidoxymethyldimethoxysilane N-β
- Dimethoxysilane etc. are used, and the most increased silane coupling agent is used for rL/+ resin for IL4.1 [ru0] As for the silane coupling agent treatment on the inner layer circuit board, an oxide film is chemically formed in advance, and Immerse the circuit board in a solution of silane coupling agent C/J 0.1 to 1o% (M%, same hereinafter) or methanol acetone.
Shisono Shun 5o-1o.

There is a method of removing the solvent by drying at ℃.

Resins that can be used include C/J thermosetting resins such as epoxy resin and polyimide resin.

Example 1 A copper-clad laminate (double-sided board) using an epoxy resin was prepared with an inner layer path formed in advance to make a printed circuit board (/Jk).The following method was followed by CV treatment.

Degreasing → roughening → washing with water → (sodium hydroxide 0.5% + trisodium phosphorus 1% sodium decathate 5%) aqueous solution 70°C, 1 minute 1 h J immersion → water resistance → silane treatment (Nippon Unicar Product name: A11+2o.

N-β-(aminoether)-γ-aminoglohiltrimethoxysilane) 1% aqueous solution mud flow 1 hour immersion → drying 100
'C, for 50 minutes, heat and pressurize this mark A11lj circuit board according to the configuration shown in the drawing (pressure 6 ok/(1) 11 knitting 17
0°C 5 hours 120 minutes) Multi-layer bonding and multi-M machine t1'
The obtained multilayer board (/, 1%) is shown in Table 1.

In addition, in one drawing, 1 is printed circuit board (inner layer), 2 is circuit copper foil, 5 is
4 is prepreg and 4 is copper foil.

Implementation 12-2 Under the same conditions as in Example 1, the silane coupling agent was replaced with γ-crisidoxyglobiltrimethoxysilane (product name: KBM-406, manufactured by Shin-Etsu Chemical), and immersed in a 1% aqueous solution in a vortex for 1 minute. N board was created. The obtained fL and multilayer tropism are shown in Table 1.

Example 6 A silane casso gelling agent treated with silane under the same conditions as in Example 1, gamma-ami7glo and lutriethoxysilane (Nippon Unicar Co., Ltd., product name A-1100), 1% aqueous solution, 1 minute I in a chamber.
As an MJ actor, I created all the multilayer boards. Obtained 7 multilayer 41
! The characteristic sounds of No. 2 are shown in Table 1.

Example 4.5 夷7iI! i? Under the same conditions as in 111, the silanization bath liquid concentration was 71. 2'1. % 0.1% and 10%, multilayer plates τ were prepared. Multi-layer board (/J special 1 raw material table 1)
NIN BUTTER 8 EXAMPLE 6 A multilayer board was prepared under the same conditions as in Example e111 using a substrate made of polyamide but also gold. Table 1 shows the properties of the multilayer board.

Comparative Example 1.2 A multilayer board was prepared under the same conditions as in Example 1 and Example 06 without performing the silane treatment; .

Comparative Example 5 Oxide film formation was carried out under the conditions of Examples 1 and 1h.
Table 1 shows the properties of the multilayer board produced by Q and J'l.

Table 1 Measurement method 9 inside 1@Copper foil peeling test '4RJIS-C6481/Solder heat resistance test 10 Q Cut into m+u angle Fυ"
All test pieces were re-soldered at 260°C for 20 seconds with a float for 10 seconds to observe the external appearance.

O acid resistance test $ 2 160 x 30 mm square cut Wr L A diameter 1 (m
Drill 56 holes and place in 19% hydrochloric acid and measure the time it takes for hydrochloric acid to infuse into the inner surface.

Q Hydrochloric acid resistance 44] Premature residual limb Q: Good (no seepage)
:Use()
Sodium Vide 1.5% + trisodium phosphate 0.8G
;'o+sodium 5.2%) Water bath ridge 85℃
, 2 minutes 6o reaction ζl → water (redundant → silane treatment (tlfff)
Manufactured by Unicar "Original product name A-1120% N-β-(7mi/ethyl)-γ-aminonorohyltrimethoxysilane) 1%
Water bath liquid history edition 1 minute direction 8! Top → dry bed + Oo”c, 30
A multilayer plate ttt- was formed by processing molecules. The obtained multi-layer structure is shown in Table 2, and the number of tests is 17 and I=J l/Song. Add the characteristics of the multilayer board created by θgu et al. to Cloth 2.

Table 2 As explained above, Kita, J: In the present invention, sea urchin r, 1. It is possible to obtain a multilayer printed circuit with various performances such as resistance to erosion, CIJf<n, and a multilayer printed circuit with improved reliability.

[Brief explanation of the drawing]

The drawing is a cross-sectional view showing the multilayer & [J manufacturing method. Explanation of sign +j 1 Inner layer circuit base 2 Inner layer circuit ga; board up circuit W6 set foil 5 Prepreg 4 Copper foil

Claims (1)

[Claims] 1. To Kaishihaku! :/) In the multilayer printed circuit board UJ manufacturing method, the inner layer circuit board on which a circuit pattern has been formed is inserted into the interior through a prepreg that has been impregnated with P-curable side fat as a base material and dried. Before embedding it inside through the Bripregket, apply an oxide film to the surface of the circuit steel foil.
A method for producing a multilayer printed circuit board characterized by treatment with a silane coupling agent. 2. Inner layer Ifl! The surface of the circuit steel foil of the J-board is treated with a water solution of sodium hydroxide, trisodium phosphate, and sodium chlorite to form an oxide film. ! 'F NiV calculation range 1st term dC1 mounting method for multilayer printed circuit board. 6. Water 1 Sodium iguide 5-10g/β, Trisodium phosphate 5-20'g/6. The amount of sodium chlorite bleached is 10~50g/l't'', and the treatment with the silane coupling agent is 081~10% of the plan coupling agent (
Power t) Line 9 @ Correction request (1) Range 1 with bath liquid, also tJ
2nd term = R method for manufacturing self-mounted multilayer printed circuit board.