JPS6437081A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPS6437081A JPS6437081A JP19393487A JP19393487A JPS6437081A JP S6437081 A JPS6437081 A JP S6437081A JP 19393487 A JP19393487 A JP 19393487A JP 19393487 A JP19393487 A JP 19393487A JP S6437081 A JPS6437081 A JP S6437081A
- Authority
- JP
- Japan
- Prior art keywords
- coupling agent
- inner layer
- layer material
- circuit
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To improve the adhesion strength of the inner layer material and hydrochloric acid resistant properties of a multilayer printed wiring board by a method wherein, after the inner layer material is etched to form a circuit, the surface of the circuit is subjected to an oxidation treatment and then a coupling agent treatment. CONSTITUTION:After a single- or double-sided metal-clad laminate which is an inner layer material is subjected to an etching process to form a circuit, the surface of the circuit is further subjected to an oxidation treatment such as a dark copper oxide treatment and then subjected to a coupling agent treatment with silane coupling agent or the like. The coupling agent treatment is carried out in such a manner that the inner layer material is dipped into the coupling agent solution and then heated to a required temperature. With this constitution, the adhesiveness between the inner layer material and a resin layer and hydrochloric acid resistant properties can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19393487A JPS6437081A (en) | 1987-08-03 | 1987-08-03 | Multilayer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19393487A JPS6437081A (en) | 1987-08-03 | 1987-08-03 | Multilayer printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437081A true JPS6437081A (en) | 1989-02-07 |
Family
ID=16316174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19393487A Pending JPS6437081A (en) | 1987-08-03 | 1987-08-03 | Multilayer printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437081A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02260695A (en) * | 1989-03-31 | 1990-10-23 | Toppan Printing Co Ltd | Copper plated laminated board of multilayer wiring board, and multilayer wiring board |
JPH03217078A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
JPH03217077A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
-
1987
- 1987-08-03 JP JP19393487A patent/JPS6437081A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02260695A (en) * | 1989-03-31 | 1990-10-23 | Toppan Printing Co Ltd | Copper plated laminated board of multilayer wiring board, and multilayer wiring board |
JPH03217078A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
JPH03217077A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
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