JPS6437081A - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board

Info

Publication number
JPS6437081A
JPS6437081A JP19393487A JP19393487A JPS6437081A JP S6437081 A JPS6437081 A JP S6437081A JP 19393487 A JP19393487 A JP 19393487A JP 19393487 A JP19393487 A JP 19393487A JP S6437081 A JPS6437081 A JP S6437081A
Authority
JP
Japan
Prior art keywords
coupling agent
inner layer
layer material
circuit
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19393487A
Other languages
Japanese (ja)
Inventor
Yoshinori Urakuchi
Kazuhiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19393487A priority Critical patent/JPS6437081A/en
Publication of JPS6437081A publication Critical patent/JPS6437081A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To improve the adhesion strength of the inner layer material and hydrochloric acid resistant properties of a multilayer printed wiring board by a method wherein, after the inner layer material is etched to form a circuit, the surface of the circuit is subjected to an oxidation treatment and then a coupling agent treatment. CONSTITUTION:After a single- or double-sided metal-clad laminate which is an inner layer material is subjected to an etching process to form a circuit, the surface of the circuit is further subjected to an oxidation treatment such as a dark copper oxide treatment and then subjected to a coupling agent treatment with silane coupling agent or the like. The coupling agent treatment is carried out in such a manner that the inner layer material is dipped into the coupling agent solution and then heated to a required temperature. With this constitution, the adhesiveness between the inner layer material and a resin layer and hydrochloric acid resistant properties can be improved.
JP19393487A 1987-08-03 1987-08-03 Multilayer printed wiring board Pending JPS6437081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19393487A JPS6437081A (en) 1987-08-03 1987-08-03 Multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19393487A JPS6437081A (en) 1987-08-03 1987-08-03 Multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS6437081A true JPS6437081A (en) 1989-02-07

Family

ID=16316174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19393487A Pending JPS6437081A (en) 1987-08-03 1987-08-03 Multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS6437081A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260695A (en) * 1989-03-31 1990-10-23 Toppan Printing Co Ltd Copper plated laminated board of multilayer wiring board, and multilayer wiring board
JPH03217078A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
JPH03217077A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260695A (en) * 1989-03-31 1990-10-23 Toppan Printing Co Ltd Copper plated laminated board of multilayer wiring board, and multilayer wiring board
JPH03217078A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board
JPH03217077A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Surface treatment of internal-layer base material for multilayer copper-clad laminated board

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