BR8805031A - Processo para a formacao de um painel de circuito impresso com camadas multiplas contendo furos atravessantes condutores que estabelecem contacto eletrico com uma serie de camadas condutoras eletricas atraves de diversas camadas isolantes;painel formado pelo processo - Google Patents

Processo para a formacao de um painel de circuito impresso com camadas multiplas contendo furos atravessantes condutores que estabelecem contacto eletrico com uma serie de camadas condutoras eletricas atraves de diversas camadas isolantes;painel formado pelo processo

Info

Publication number
BR8805031A
BR8805031A BR8805031A BR8805031A BR8805031A BR 8805031 A BR8805031 A BR 8805031A BR 8805031 A BR8805031 A BR 8805031A BR 8805031 A BR8805031 A BR 8805031A BR 8805031 A BR8805031 A BR 8805031A
Authority
BR
Brazil
Prior art keywords
layers
drills
series
printed circuit
forming
Prior art date
Application number
BR8805031A
Other languages
English (en)
Portuguese (pt)
Inventor
John Vincent Palladino
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8805031A publication Critical patent/BR8805031A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
BR8805031A 1987-10-01 1988-09-29 Processo para a formacao de um painel de circuito impresso com camadas multiplas contendo furos atravessantes condutores que estabelecem contacto eletrico com uma serie de camadas condutoras eletricas atraves de diversas camadas isolantes;painel formado pelo processo BR8805031A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10399587A 1987-10-01 1987-10-01

Publications (1)

Publication Number Publication Date
BR8805031A true BR8805031A (pt) 1989-05-09

Family

ID=22298136

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8805031A BR8805031A (pt) 1987-10-01 1988-09-29 Processo para a formacao de um painel de circuito impresso com camadas multiplas contendo furos atravessantes condutores que estabelecem contacto eletrico com uma serie de camadas condutoras eletricas atraves de diversas camadas isolantes;painel formado pelo processo

Country Status (5)

Country Link
EP (1) EP0310010B1 (de)
JP (1) JPH0666553B2 (de)
KR (1) KR0126135B1 (de)
BR (1) BR8805031A (de)
DE (1) DE3887054T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073456A (en) * 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
US5161093A (en) * 1990-07-02 1992-11-03 General Electric Company Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
EP0488299B1 (de) * 1990-11-30 1995-08-16 Toppan Printing Co., Ltd. Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine
JP2721632B2 (ja) * 1992-02-25 1998-03-04 松下電工株式会社 回路板の銅回路の処理方法
US5385787A (en) * 1993-02-03 1995-01-31 Amp-Akzo Corporation Organosilane adhesion promotion in manufacture of additive printed wiring board
US5928790A (en) * 1996-04-23 1999-07-27 Mcgean-Rohco, Inc. Multilayer circuit boards and processes of making the same
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP4831783B2 (ja) 2008-02-01 2011-12-07 メック株式会社 導電層及びこれを用いた積層体と、これらの製造方法
JP5317099B2 (ja) 2008-07-02 2013-10-16 メック株式会社 接着層形成液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644166A (en) * 1968-03-28 1972-02-22 Westinghouse Electric Corp Oxide-free multilayer copper clad laminate
FR2361224A1 (fr) * 1976-08-11 1978-03-10 Uop Inc Produit stratifie a placage metallique et son procede de fabrication
JPS56118394A (en) * 1980-02-22 1981-09-17 Fujitsu Ltd Method of manufacturing multilayer circuit board
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4512818A (en) * 1983-05-23 1985-04-23 Shipley Company Inc. Solution for formation of black oxide
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits

Also Published As

Publication number Publication date
KR0126135B1 (ko) 1997-12-26
EP0310010A2 (de) 1989-04-05
KR890007625A (ko) 1989-06-20
JPH0666553B2 (ja) 1994-08-24
EP0310010A3 (en) 1989-09-13
JPH01109796A (ja) 1989-04-26
DE3887054D1 (de) 1994-02-24
EP0310010B1 (de) 1994-01-12
DE3887054T2 (de) 1994-07-21

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