BR8707102A - Laminado para a preparacao de um circuito impresso de multiplas camadas chapeando-se o metal condutor sem migracao de eletrons,processo para sua producao,e processo para producao de um circuito impresso para producao de um circuito impresso de multiplas camadas chapeado sem migracao de eletrons na parte superior - Google Patents
Laminado para a preparacao de um circuito impresso de multiplas camadas chapeando-se o metal condutor sem migracao de eletrons,processo para sua producao,e processo para producao de um circuito impresso para producao de um circuito impresso de multiplas camadas chapeado sem migracao de eletrons na parte superiorInfo
- Publication number
- BR8707102A BR8707102A BR8707102A BR8707102A BR8707102A BR 8707102 A BR8707102 A BR 8707102A BR 8707102 A BR8707102 A BR 8707102A BR 8707102 A BR8707102 A BR 8707102A BR 8707102 A BR8707102 A BR 8707102A
- Authority
- BR
- Brazil
- Prior art keywords
- production
- printed circuit
- multiplayered
- multiplayers
- laminate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/947,832 US4737446A (en) | 1986-12-30 | 1986-12-30 | Method for making multilayer circuits using embedded catalyst receptors |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8707102A true BR8707102A (pt) | 1988-08-02 |
Family
ID=25486855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8707102A BR8707102A (pt) | 1986-12-30 | 1987-12-29 | Laminado para a preparacao de um circuito impresso de multiplas camadas chapeando-se o metal condutor sem migracao de eletrons,processo para sua producao,e processo para producao de um circuito impresso para producao de um circuito impresso de multiplas camadas chapeado sem migracao de eletrons na parte superior |
Country Status (7)
Country | Link |
---|---|
US (1) | US4737446A (pt) |
EP (1) | EP0273374A3 (pt) |
JP (1) | JPS63175497A (pt) |
KR (1) | KR900006654B1 (pt) |
CN (1) | CN1012253B (pt) |
BR (1) | BR8707102A (pt) |
CA (1) | CA1275740C (pt) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302494A (en) * | 1985-06-10 | 1994-04-12 | The Foxboro Company | Multilayer circuit board having microporous layers and process for making same |
US5334488A (en) * | 1985-08-02 | 1994-08-02 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US5246817A (en) * | 1985-08-02 | 1993-09-21 | Shipley Company, Inc. | Method for manufacture of multilayer circuit board |
US4902610A (en) * | 1985-08-02 | 1990-02-20 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US4888208A (en) * | 1986-10-16 | 1989-12-19 | Toyo Boseki Kabushiki Kaisha | Ceramic substrate for printed circuits and production thereof |
US4859571A (en) * | 1986-12-30 | 1989-08-22 | E. I. Du Pont De Nemours And Company | Embedded catalyst receptors for metallization of dielectrics |
KR920700898A (ko) * | 1989-10-30 | 1992-08-10 | 원본미기재 | 미공성층을 가진 다층 회로 기판 및 그 제조방법 |
JPH03192718A (ja) * | 1989-12-22 | 1991-08-22 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
US5260170A (en) * | 1990-01-08 | 1993-11-09 | Motorola, Inc. | Dielectric layered sequentially processed circuit board |
FI88241C (fi) * | 1990-10-30 | 1993-04-13 | Nokia Mobile Phones Ltd | Foerfarande foer framstaellning av kretskort |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
EP0589241B1 (en) * | 1992-09-23 | 1999-04-28 | E.I. Du Pont De Nemours And Company | Photosensitive dielectric sheet composition and multilayer interconnect circuits |
US5310626A (en) * | 1993-03-01 | 1994-05-10 | Motorola, Inc. | Method for forming a patterned layer using dielectric materials as a light-sensitive material |
US5888697A (en) * | 1996-07-03 | 1999-03-30 | E. I. Du Pont De Nemours And Company | Flexographic printing element having a powder layer |
US5795647A (en) * | 1996-09-11 | 1998-08-18 | Aluminum Company Of America | Printing plate having improved wear resistance |
US6430810B1 (en) * | 1997-10-28 | 2002-08-13 | Uniax Corporation | Mechanical scribing methods of forming a patterned metal layer in an electronic device |
US7338908B1 (en) | 2003-10-20 | 2008-03-04 | Novellus Systems, Inc. | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage |
DE69910335T2 (de) | 1998-12-11 | 2004-07-01 | E.I. Du Pont De Nemours And Co., Wilmington | Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band |
FR2819144B1 (fr) * | 2000-12-29 | 2003-06-20 | Kermel | Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees |
FR2812515B1 (fr) * | 2000-07-27 | 2003-08-01 | Kermel | Procede de realisation d'une circuiterie comportant pistes, pastilles et microtraversees conductrices et utilisation de ce procede pour la realisation de circuits imprimes et de modules multicouches a haute densite d'integration |
KR100528950B1 (ko) * | 2001-01-29 | 2005-11-16 | 제이에스알 가부시끼가이샤 | 유전체용 복합 입자, 초미립자 복합 수지 입자, 유전체형성용 조성물 및 그의 용도 |
US6656314B2 (en) * | 2001-05-23 | 2003-12-02 | Hewlett-Packard Development Company, L.P. | Method of manufacturing multilayer substrates |
US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
US20040091818A1 (en) * | 2002-11-12 | 2004-05-13 | Russell Winstead | High resolution 3-D circuit formation using selective or continuous catalytic painting |
US20040249364A1 (en) * | 2003-06-03 | 2004-12-09 | Ilya Kaploun | Device and method for dispensing medication to tissue lining a body cavity |
US8158532B2 (en) * | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
US8530359B2 (en) * | 2003-10-20 | 2013-09-10 | Novellus Systems, Inc. | Modulated metal removal using localized wet etching |
US7972970B2 (en) | 2003-10-20 | 2011-07-05 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structure |
US7531463B2 (en) * | 2003-10-20 | 2009-05-12 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structure |
US8372757B2 (en) | 2003-10-20 | 2013-02-12 | Novellus Systems, Inc. | Wet etching methods for copper removal and planarization in semiconductor processing |
US7605082B1 (en) | 2005-10-13 | 2009-10-20 | Novellus Systems, Inc. | Capping before barrier-removal IC fabrication method |
KR20090025337A (ko) * | 2006-06-14 | 2009-03-10 | 바스프 에스이 | 지지체 상의 전기 전도성 표면의 제조 방법 |
CN101902884B (zh) * | 2009-05-26 | 2012-11-07 | 欣兴电子股份有限公司 | 形成复合材料电路板结构的方法 |
US8597461B2 (en) | 2009-09-02 | 2013-12-03 | Novellus Systems, Inc. | Reduced isotropic etchant material consumption and waste generation |
WO2018035184A1 (en) * | 2016-08-18 | 2018-02-22 | Sierra Circuits, Inc. | Plasma etched catalytic laminate with traces and vias |
CN115976501A (zh) * | 2022-12-27 | 2023-04-18 | 电子科技大学 | 绝缘基材表面金属图形及增材制造方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
US3330695A (en) * | 1962-05-21 | 1967-07-11 | First Safe Deposit Nat Bank Of | Method of manufacturing electric circuit structures |
US3259559A (en) * | 1962-08-22 | 1966-07-05 | Day Company | Method for electroless copper plating |
GB1095117A (en) * | 1963-12-26 | 1967-12-13 | Matsushita Electric Ind Co Ltd | Method of making printed circuit board |
AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
DE1615961A1 (de) * | 1967-04-12 | 1970-06-25 | Degussa | Verfahren zur Herstellung von gedruckten Schaltungen |
US3506482A (en) * | 1967-04-25 | 1970-04-14 | Matsushita Electric Ind Co Ltd | Method of making printed circuits |
US3822128A (en) * | 1971-10-22 | 1974-07-02 | Horizons Inc | Metal-plated images |
US4287253A (en) * | 1975-04-08 | 1981-09-01 | Photocircuits Division Of Kollmorgen Corp. | Catalytic filler for electroless metallization of hole walls |
JPS5288772A (en) * | 1976-01-20 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
US4110147A (en) * | 1976-03-24 | 1978-08-29 | Macdermid Incorporated | Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits |
US4229518A (en) * | 1976-07-08 | 1980-10-21 | E. I. Du Pont De Nemours And Company | Photohardenable elements with a non-tacky matte finish |
US4054479A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additive process for producing printed circuit elements using a self-supported photosensitive sheet |
US4054483A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additives process for producing plated holes in printed circuit elements |
US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
DE2839449A1 (de) * | 1978-09-11 | 1980-03-20 | Ipu Ltd | Strangbrennschneidmaschine |
US4292389A (en) * | 1979-01-31 | 1981-09-29 | Konishiroku Photo Industry Co., Ltd. | Process for preparing photosensitive plates for printing |
US4501810A (en) * | 1981-09-30 | 1985-02-26 | Howard A. Fromson | Lithographic printing plate with resin reinforced image and process |
US4478883A (en) * | 1982-07-14 | 1984-10-23 | International Business Machines Corporation | Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate |
US4454168A (en) * | 1982-09-29 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from metallized photoadhesive layers |
JPS60102794A (ja) * | 1983-11-09 | 1985-06-06 | ブラザー工業株式会社 | 回路基板の製造方法 |
US4567062A (en) * | 1984-10-26 | 1986-01-28 | E. I. Du Pont De Nemours And Company | Process for photoformed plastic multistrate using two layer film |
-
1986
- 1986-12-30 US US06/947,832 patent/US4737446A/en not_active Expired - Lifetime
-
1987
- 1987-12-22 CA CA000555091A patent/CA1275740C/en not_active Expired - Lifetime
- 1987-12-23 EP EP87119082A patent/EP0273374A3/en not_active Withdrawn
- 1987-12-28 JP JP62336734A patent/JPS63175497A/ja active Pending
- 1987-12-29 KR KR1019870015223A patent/KR900006654B1/ko not_active IP Right Cessation
- 1987-12-29 BR BR8707102A patent/BR8707102A/pt unknown
- 1987-12-30 CN CN87107655A patent/CN1012253B/zh not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0273374A2 (en) | 1988-07-06 |
KR900006654B1 (ko) | 1990-09-15 |
US4737446A (en) | 1988-04-12 |
EP0273374A3 (en) | 1989-06-07 |
CN87107655A (zh) | 1988-07-13 |
CA1275740C (en) | 1990-10-30 |
CN1012253B (zh) | 1991-03-27 |
KR880008725A (ko) | 1988-08-31 |
JPS63175497A (ja) | 1988-07-19 |
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