FR2819144B1 - Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees - Google Patents

Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees

Info

Publication number
FR2819144B1
FR2819144B1 FR0017249A FR0017249A FR2819144B1 FR 2819144 B1 FR2819144 B1 FR 2819144B1 FR 0017249 A FR0017249 A FR 0017249A FR 0017249 A FR0017249 A FR 0017249A FR 2819144 B1 FR2819144 B1 FR 2819144B1
Authority
FR
France
Prior art keywords
microtraverse
circuitry including
level circuitry
including tracks
multilevel level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0017249A
Other languages
English (en)
Other versions
FR2819144A1 (fr
Inventor
Robert Cassat
Vincent Lorentz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kermel SNC
Original Assignee
Kermel SNC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kermel SNC filed Critical Kermel SNC
Priority to FR0017249A priority Critical patent/FR2819144B1/fr
Priority to KR1020010005552A priority patent/KR20020022122A/ko
Priority to JP2001029348A priority patent/JP2002057460A/ja
Priority to CNA018222943A priority patent/CN1488235A/zh
Priority to BR0116760-0A priority patent/BR0116760A/pt
Priority to PCT/FR2001/004150 priority patent/WO2002054844A1/fr
Priority to MXPA03005841A priority patent/MXPA03005841A/es
Priority to CA002433222A priority patent/CA2433222A1/fr
Priority to US10/451,913 priority patent/US20040067447A1/en
Priority to EP01995753A priority patent/EP1364563A1/fr
Publication of FR2819144A1 publication Critical patent/FR2819144A1/fr
Application granted granted Critical
Publication of FR2819144B1 publication Critical patent/FR2819144B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
FR0017249A 2000-07-27 2000-12-29 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees Expired - Fee Related FR2819144B1 (fr)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FR0017249A FR2819144B1 (fr) 2000-12-29 2000-12-29 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees
JP2001029348A JP2002057460A (ja) 2000-07-27 2001-02-06 導電路及びマイクロビアから成る多層の回路を作製するための方法
KR1020010005552A KR20020022122A (ko) 2000-07-27 2001-02-06 트랙 및 마이크로비어로 이루어지는 다단 회로 소자의제조방법
BR0116760-0A BR0116760A (pt) 2000-12-29 2001-12-24 Processo de realização de um conjunto de circuitos de interconexão, uso do processo e conjunto de circuitos
PCT/FR2001/004150 WO2002054844A1 (fr) 2000-12-29 2001-12-24 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees
MXPA03005841A MXPA03005841A (es) 2000-12-29 2001-12-24 Procedimiento de fabricacion de un conjunto de circuitos de varios niveles que incluye pistas y microtravesias.
CNA018222943A CN1488235A (zh) 2000-12-29 2001-12-24 包括有若干印制线和微通路的多层电路的制造方法
CA002433222A CA2433222A1 (fr) 2000-12-29 2001-12-24 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees
US10/451,913 US20040067447A1 (en) 2000-12-29 2001-12-24 Method for making a multilevel circuitry comprising conductor tracks and microvias
EP01995753A EP1364563A1 (fr) 2000-12-29 2001-12-24 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0017249A FR2819144B1 (fr) 2000-12-29 2000-12-29 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees

Publications (2)

Publication Number Publication Date
FR2819144A1 FR2819144A1 (fr) 2002-07-05
FR2819144B1 true FR2819144B1 (fr) 2003-06-20

Family

ID=8858365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0017249A Expired - Fee Related FR2819144B1 (fr) 2000-07-27 2000-12-29 Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees

Country Status (8)

Country Link
US (1) US20040067447A1 (fr)
EP (1) EP1364563A1 (fr)
CN (1) CN1488235A (fr)
BR (1) BR0116760A (fr)
CA (1) CA2433222A1 (fr)
FR (1) FR2819144B1 (fr)
MX (1) MXPA03005841A (fr)
WO (1) WO2002054844A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US5260170A (en) * 1990-01-08 1993-11-09 Motorola, Inc. Dielectric layered sequentially processed circuit board
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5679498A (en) * 1995-10-11 1997-10-21 Motorola, Inc. Method for producing high density multi-layer integrated circuit carriers
US5789142A (en) * 1996-01-16 1998-08-04 Motorola, Inc. Solder mask system
US5998237A (en) * 1996-09-17 1999-12-07 Enthone-Omi, Inc. Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion

Also Published As

Publication number Publication date
CN1488235A (zh) 2004-04-07
US20040067447A1 (en) 2004-04-08
MXPA03005841A (es) 2005-04-19
BR0116760A (pt) 2004-01-13
FR2819144A1 (fr) 2002-07-05
WO2002054844A1 (fr) 2002-07-11
CA2433222A1 (fr) 2002-07-11
EP1364563A1 (fr) 2003-11-26

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070831