DE3885706D1 - Magnetron-Bedampfungssystem zum Ätzen oder Niederschlagen. - Google Patents

Magnetron-Bedampfungssystem zum Ätzen oder Niederschlagen.

Info

Publication number
DE3885706D1
DE3885706D1 DE88113416T DE3885706T DE3885706D1 DE 3885706 D1 DE3885706 D1 DE 3885706D1 DE 88113416 T DE88113416 T DE 88113416T DE 3885706 T DE3885706 T DE 3885706T DE 3885706 D1 DE3885706 D1 DE 3885706D1
Authority
DE
Germany
Prior art keywords
deposition
etching
vapor deposition
magnetron
magnetron vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88113416T
Other languages
English (en)
Other versions
DE3885706T2 (de
Inventor
Donald J Mikalsen
Stephen M Rossnagel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3885706D1 publication Critical patent/DE3885706D1/de
Publication of DE3885706T2 publication Critical patent/DE3885706T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE88113416T 1987-10-29 1988-08-18 Magnetron-Bedampfungssystem zum Ätzen oder Niederschlagen. Expired - Fee Related DE3885706T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/114,896 US4824544A (en) 1987-10-29 1987-10-29 Large area cathode lift-off sputter deposition device

Publications (2)

Publication Number Publication Date
DE3885706D1 true DE3885706D1 (de) 1993-12-23
DE3885706T2 DE3885706T2 (de) 1994-05-11

Family

ID=22358082

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88113416T Expired - Fee Related DE3885706T2 (de) 1987-10-29 1988-08-18 Magnetron-Bedampfungssystem zum Ätzen oder Niederschlagen.

Country Status (4)

Country Link
US (1) US4824544A (de)
EP (1) EP0313750B1 (de)
JP (1) JPH07116599B2 (de)
DE (1) DE3885706T2 (de)

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Also Published As

Publication number Publication date
JPH01116070A (ja) 1989-05-09
EP0313750A1 (de) 1989-05-03
JPH07116599B2 (ja) 1995-12-13
DE3885706T2 (de) 1994-05-11
EP0313750B1 (de) 1993-11-18
US4824544A (en) 1989-04-25

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