DE3879813D1 - Integrierte halbleiterschaltung mit signallinien. - Google Patents

Integrierte halbleiterschaltung mit signallinien.

Info

Publication number
DE3879813D1
DE3879813D1 DE8888113947T DE3879813T DE3879813D1 DE 3879813 D1 DE3879813 D1 DE 3879813D1 DE 8888113947 T DE8888113947 T DE 8888113947T DE 3879813 T DE3879813 T DE 3879813T DE 3879813 D1 DE3879813 D1 DE 3879813D1
Authority
DE
Germany
Prior art keywords
signal lines
semiconductor circuit
integrated semiconductor
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888113947T
Other languages
English (en)
Other versions
DE3879813T2 (de
Inventor
Toshiki C O Patent Di Morimoto
Seji C O Patent Divis Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3879813D1 publication Critical patent/DE3879813D1/de
Publication of DE3879813T2 publication Critical patent/DE3879813T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE88113947T 1987-08-27 1988-08-26 Integrierte Halbleiterschaltung mit Signallinien. Expired - Fee Related DE3879813T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62213545A JPH0828421B2 (ja) 1987-08-27 1987-08-27 半導体集積回路装置

Publications (2)

Publication Number Publication Date
DE3879813D1 true DE3879813D1 (de) 1993-05-06
DE3879813T2 DE3879813T2 (de) 1993-10-07

Family

ID=16640970

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88113947T Expired - Fee Related DE3879813T2 (de) 1987-08-27 1988-08-26 Integrierte Halbleiterschaltung mit Signallinien.

Country Status (4)

Country Link
US (1) US4883980A (de)
EP (1) EP0304930B1 (de)
JP (1) JPH0828421B2 (de)
DE (1) DE3879813T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229124A (ja) * 1988-07-19 1990-01-31 Toshiba Corp スタンダードセル
JPH02106968A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体集積回路装置及びその形成方法
US5072132A (en) * 1989-06-09 1991-12-10 Digital Equipment Corporation Vsli latch system and sliver pulse generator with high correlation factor
JP2917434B2 (ja) * 1989-09-08 1999-07-12 セイコーエプソン株式会社 マスタースライス集積回路装置
US5304826A (en) * 1989-09-22 1994-04-19 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
JP2545626B2 (ja) * 1990-02-07 1996-10-23 三菱電機株式会社 ゲートアレイ
US5291043A (en) * 1990-02-07 1994-03-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device having gate array
JPH03278449A (ja) * 1990-03-02 1991-12-10 Matsushita Electron Corp 半導体集積回路の自動配線方法
JPH04116951A (ja) * 1990-09-07 1992-04-17 Fujitsu Ltd 半導体集積回路
KR930008310B1 (ko) * 1991-02-05 1993-08-27 삼성전자 주식회사 반도체 메모리장치의 워드라인드라이버단 배치방법
JP2917604B2 (ja) * 1991-08-30 1999-07-12 日本電気株式会社 半導体集積回路のレイアウト設計方法
KR940008722B1 (ko) * 1991-12-04 1994-09-26 삼성전자 주식회사 반도체 메모리 장치의 워드라인 드라이버 배열방법
JP3178932B2 (ja) * 1993-03-02 2001-06-25 富士通株式会社 半導体集積回路装置
EP0650194B1 (de) * 1993-10-21 1999-11-10 Advanced Micro Devices, Inc. Dynamischer Bus von hoher Dichte
EP0791930B1 (de) * 1995-10-02 2004-02-18 Matsushita Electric Industrial Co., Ltd. Elektrische Signalversorgungsschaltung und Halbleiterspeicheranordnung
JPH10246754A (ja) * 1997-03-03 1998-09-14 Mitsubishi Electric Corp クロックドライバ回路及び半導体集積回路装置
JP4025044B2 (ja) * 2001-09-27 2007-12-19 株式会社東芝 半導体集積回路装置
US7628452B2 (en) * 2008-02-29 2009-12-08 Shanghai Industries Group, Ltd. Rocker base
CN110824181B (zh) * 2019-10-18 2021-10-15 中国航空工业集团公司西安飞行自动控制研究所 一种低电阻敏感器件信号连接方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818289A (en) * 1972-04-10 1974-06-18 Raytheon Co Semiconductor integrated circuit structures
JPS5835963A (ja) * 1981-08-28 1983-03-02 Fujitsu Ltd 集積回路装置
JPS59182540A (ja) * 1983-04-01 1984-10-17 Hitachi Ltd 半導体装置における配線パタ−ンの設計方法
US4575745A (en) * 1983-06-21 1986-03-11 Rca Corporation Tailorable standard cells and method for tailoring the performance of IC designs
JPH0630377B2 (ja) * 1984-06-15 1994-04-20 株式会社日立製作所 半導体集積回路装置
JPS62141737A (ja) * 1985-12-16 1987-06-25 Matsushita Electric Ind Co Ltd セルの配置方法
JPS62140430A (ja) * 1985-12-16 1987-06-24 Toshiba Corp 半導体集積回路の配線方法

Also Published As

Publication number Publication date
EP0304930A2 (de) 1989-03-01
DE3879813T2 (de) 1993-10-07
EP0304930B1 (de) 1993-03-31
JPH0828421B2 (ja) 1996-03-21
US4883980B1 (de) 1993-02-23
EP0304930A3 (en) 1989-04-05
US4883980A (en) 1989-11-28
JPS6455841A (en) 1989-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee