DE3856248D1 - Siliciumwafer-handhabungssystem mit bernoulli-aufnahme - Google Patents

Siliciumwafer-handhabungssystem mit bernoulli-aufnahme

Info

Publication number
DE3856248D1
DE3856248D1 DE3856248T DE3856248T DE3856248D1 DE 3856248 D1 DE3856248 D1 DE 3856248D1 DE 3856248 T DE3856248 T DE 3856248T DE 3856248 T DE3856248 T DE 3856248T DE 3856248 D1 DE3856248 D1 DE 3856248D1
Authority
DE
Germany
Prior art keywords
bernoulli
mount
silicon wafer
handling system
wafer handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3856248T
Other languages
English (en)
Other versions
DE3856248T2 (de
Inventor
Dennis Goodwin
Richard Crabb
Mcdonald Robinson
Armand Ferro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM America Inc
Original Assignee
Advanced Semiconductor Materials America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Materials America Inc filed Critical Advanced Semiconductor Materials America Inc
Application granted granted Critical
Publication of DE3856248D1 publication Critical patent/DE3856248D1/de
Publication of DE3856248T2 publication Critical patent/DE3856248T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE3856248T 1988-06-17 1988-06-17 Siliciumwafer-handhabungssystem mit bernoulli-aufnahme Expired - Lifetime DE3856248T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1988/002115 WO1989012907A1 (en) 1988-06-17 1988-06-17 Wafer handling system with bernoulli pick-up

Publications (2)

Publication Number Publication Date
DE3856248D1 true DE3856248D1 (de) 1998-10-08
DE3856248T2 DE3856248T2 (de) 1999-03-25

Family

ID=22208755

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3856248T Expired - Lifetime DE3856248T2 (de) 1988-06-17 1988-06-17 Siliciumwafer-handhabungssystem mit bernoulli-aufnahme

Country Status (4)

Country Link
EP (1) EP0419461B1 (de)
JP (1) JP2801014B2 (de)
DE (1) DE3856248T2 (de)
WO (1) WO1989012907A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2661117B1 (fr) * 1990-04-24 1994-09-30 Commissariat Energie Atomique Procede de protection de surfaces contre la contamination particulaire ambiante a l'aide d'elements soufflants.
FR2664526A1 (fr) * 1990-07-16 1992-01-17 Villejuif Etudes Ind Systeme de manutention de tranche a protection contre les poussieres.
FR2673135A1 (fr) * 1991-02-25 1992-08-28 Villejuif Etudes Indles Dispositif de transfert articule a conduits de fluide incorpores.
US5470420A (en) * 1992-07-31 1995-11-28 Eastman Kodak Company Apparatus for label application using Bernoulli Effect
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
US8283813B2 (en) 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
CN101790673B (zh) 2007-06-27 2013-08-28 布鲁克斯自动化公司 用于自轴承电机的位置反馈
KR102617936B1 (ko) 2007-07-17 2023-12-27 브룩스 오토메이션 인코퍼레이티드 기판 운송 장치
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
DE102018004436A1 (de) * 2017-06-06 2018-12-06 Solaytec B.V. Wafergreifer-einheit, system und verwendung davon
FR3079439B1 (fr) * 2018-03-29 2020-04-24 Semco Technologies Sas Dispositif de prehension
EP3867047A1 (de) 2018-10-15 2021-08-25 General Electric Company Systeme und verfahren zur automatisierten folienentfernung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539216A (en) * 1968-01-11 1970-11-10 Sprague Electric Co Pickup device
JPS5116881A (en) * 1974-08-02 1976-02-10 Hitachi Ltd Eaa pinsetsuto
US3981687A (en) * 1975-05-08 1976-09-21 The United States Of America As Represented By The Secretary Of The Army Method of treating quartz crystal resonators
US4029351A (en) * 1976-06-02 1977-06-14 International Business Machines Corporation Bernoulli pickup head with self-restoring anti-tilt improvement
JPS5456356A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Dicing device
JPS57121028A (en) * 1981-01-20 1982-07-28 Sumitomo Chem Co Ltd Epoxy resin composition
CH649231A5 (de) * 1980-10-28 1985-05-15 Hans Christoph Siegmann Prof D Verfahren zum elektrischen aufladen von schwebeteilchen in gasen.
US4391773A (en) * 1981-06-08 1983-07-05 Flanagan G Patrick Method of purifying air and negative field generator
US4440553A (en) * 1982-06-05 1984-04-03 Helmus Martin C Air-filtration module with ionization for elimination of static electricity
JPS59201438A (ja) * 1983-04-28 1984-11-15 Toshiba Corp ウエ−ハ移し換え装置
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
JPS60175411A (ja) * 1984-02-22 1985-09-09 Hitachi Ltd 半導体薄膜の製造方法及びその製造装置
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
KR870005887A (ko) * 1985-12-30 1987-07-07 히로시 아까시 무접촉 운반 장치
GB8709064D0 (en) * 1986-04-28 1987-05-20 Varian Associates Wafer handling arm
JPS6378546A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd ウエハハンドリング装置
JPS63122235A (ja) * 1986-11-12 1988-05-26 Canon Inc ウエハ処理装置
JPS63125680A (ja) * 1986-11-13 1988-05-28 Babcock Hitachi Kk 気相堆積装置
JPS63127844A (ja) * 1986-11-17 1988-05-31 Hitachi Ltd 真空吸着装置

Also Published As

Publication number Publication date
DE3856248T2 (de) 1999-03-25
WO1989012907A1 (en) 1989-12-28
JP2801014B2 (ja) 1998-09-21
EP0419461B1 (de) 1998-09-02
EP0419461A1 (de) 1991-04-03
EP0419461A4 (en) 1992-05-20
JPH03505946A (ja) 1991-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASM AMERICA, INC. (N.D.GES.DES STAATES DELAWARE),