DE3781191D1 - Verfahren zur herstellung einer integrierten schaltungshalbleiteranordnung unter verwendung eines lithographieschrittes. - Google Patents

Verfahren zur herstellung einer integrierten schaltungshalbleiteranordnung unter verwendung eines lithographieschrittes.

Info

Publication number
DE3781191D1
DE3781191D1 DE8787105373T DE3781191T DE3781191D1 DE 3781191 D1 DE3781191 D1 DE 3781191D1 DE 8787105373 T DE8787105373 T DE 8787105373T DE 3781191 T DE3781191 T DE 3781191T DE 3781191 D1 DE3781191 D1 DE 3781191D1
Authority
DE
Germany
Prior art keywords
producing
integrated circuit
lithography step
semiconductor arrangement
circuit semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787105373T
Other languages
English (en)
Other versions
DE3781191T2 (de
Inventor
Masayuki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3781191D1 publication Critical patent/DE3781191D1/de
Publication of DE3781191T2 publication Critical patent/DE3781191T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE8787105373T 1986-04-10 1987-04-10 Verfahren zur herstellung einer integrierten schaltungshalbleiteranordnung unter verwendung eines lithographieschrittes. Expired - Lifetime DE3781191T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8348086 1986-04-10

Publications (2)

Publication Number Publication Date
DE3781191D1 true DE3781191D1 (de) 1992-09-24
DE3781191T2 DE3781191T2 (de) 1993-03-18

Family

ID=13803629

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787105373T Expired - Lifetime DE3781191T2 (de) 1986-04-10 1987-04-10 Verfahren zur herstellung einer integrierten schaltungshalbleiteranordnung unter verwendung eines lithographieschrittes.

Country Status (4)

Country Link
US (1) US4806457A (de)
EP (1) EP0242744B1 (de)
JP (1) JPS6366934A (de)
DE (1) DE3781191T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2536934Y2 (ja) * 1989-07-04 1997-05-28 東レ株式会社 防風性の編地
JPH03155112A (ja) * 1989-11-13 1991-07-03 Nikon Corp 露光条件測定方法
JPH0444307A (ja) * 1990-06-12 1992-02-14 Nec Corp 半導体装置の製造方法
US5044750A (en) * 1990-08-13 1991-09-03 National Semiconductor Corporation Method for checking lithography critical dimensions
EP0477957A1 (de) * 1990-09-28 1992-04-01 Nec Corporation Verfahren zum Herstellen von integrierten Halbleiterschaltkreisen mit mehreren lithographischen Prozessschritten und Teststrukturen
US5370923A (en) * 1993-02-26 1994-12-06 Advanced Micro Devices, Inc. Photolithography test structure
JP2658841B2 (ja) * 1993-11-16 1997-09-30 日本電気株式会社 フォトレジストチェックパターン
US5953128A (en) * 1997-08-28 1999-09-14 International Business Machines Corporation Optically measurable serpentine edge tone reversed targets
US8540493B2 (en) 2003-12-08 2013-09-24 Sta-Rite Industries, Llc Pump control system and method
US7854597B2 (en) 2004-08-26 2010-12-21 Pentair Water Pool And Spa, Inc. Pumping system with two way communication
US8469675B2 (en) 2004-08-26 2013-06-25 Pentair Water Pool And Spa, Inc. Priming protection
US7686589B2 (en) 2004-08-26 2010-03-30 Pentair Water Pool And Spa, Inc. Pumping system with power optimization
US7874808B2 (en) 2004-08-26 2011-01-25 Pentair Water Pool And Spa, Inc. Variable speed pumping system and method
US8019479B2 (en) 2004-08-26 2011-09-13 Pentair Water Pool And Spa, Inc. Control algorithm of variable speed pumping system
US8602745B2 (en) 2004-08-26 2013-12-10 Pentair Water Pool And Spa, Inc. Anti-entrapment and anti-dead head function
US8480373B2 (en) 2004-08-26 2013-07-09 Pentair Water Pool And Spa, Inc. Filter loading
US7845913B2 (en) 2004-08-26 2010-12-07 Pentair Water Pool And Spa, Inc. Flow control
US8579600B2 (en) 2008-03-28 2013-11-12 Sta-Rite Industries, Llc System and method for portable battery back-up sump pump
WO2010042406A1 (en) 2008-10-06 2010-04-15 Pentair Water Pool And Spa, Inc. Method of operating a safety vacuum release system
US9556874B2 (en) 2009-06-09 2017-01-31 Pentair Flow Technologies, Llc Method of controlling a pump and motor
US8564233B2 (en) 2009-06-09 2013-10-22 Sta-Rite Industries, Llc Safety system and method for pump and motor
SG191067A1 (en) 2010-12-08 2013-08-30 Pentair Water Pool & Spa Inc Discharge vacuum relief valve for safety vacuum release system
US9383244B2 (en) 2012-10-25 2016-07-05 Pentair Flow Technologies, Llc Fluid level sensor systems and methods
US9638193B2 (en) 2012-10-25 2017-05-02 Pentair Flow Technologies, Llc Sump pump remote monitoring systems and methods
US9885360B2 (en) 2012-10-25 2018-02-06 Pentair Flow Technologies, Llc Battery backup sump pump systems and methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998639A (en) * 1974-11-19 1976-12-21 Bell Telephone Laboratories, Incorporated Methods for determining feature-size accuracy of circuit patterns
US4200396A (en) * 1977-12-19 1980-04-29 Rca Corporation Optically testing the lateral dimensions of a pattern
US4330213A (en) * 1980-02-14 1982-05-18 Rca Corporation Optical line width measuring apparatus and method
JPS577933A (en) * 1980-06-19 1982-01-16 Nec Corp Manufacture of semiconductor device
JPS5741637A (en) * 1980-08-26 1982-03-08 Dainippon Printing Co Ltd Microstep tablet
US4408884A (en) * 1981-06-29 1983-10-11 Rca Corporation Optical measurements of fine line parameters in integrated circuit processes

Also Published As

Publication number Publication date
DE3781191T2 (de) 1993-03-18
EP0242744A2 (de) 1987-10-28
US4806457A (en) 1989-02-21
EP0242744B1 (de) 1992-08-19
JPS6366934A (ja) 1988-03-25
EP0242744A3 (en) 1989-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP