DE3765381D1 - Verfahren und system fuer vorbohrverarbeitung von mehrlagig gedruckten schaltungsplatten. - Google Patents

Verfahren und system fuer vorbohrverarbeitung von mehrlagig gedruckten schaltungsplatten.

Info

Publication number
DE3765381D1
DE3765381D1 DE8787308979T DE3765381T DE3765381D1 DE 3765381 D1 DE3765381 D1 DE 3765381D1 DE 8787308979 T DE8787308979 T DE 8787308979T DE 3765381 T DE3765381 T DE 3765381T DE 3765381 D1 DE3765381 D1 DE 3765381D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
drilling processing
multiple printed
drilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787308979T
Other languages
English (en)
Inventor
John W Wilent
Robert F Benson
Robert A Sparks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LOMA PARK ASSOC Inc
Original Assignee
LOMA PARK ASSOC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LOMA PARK ASSOC Inc filed Critical LOMA PARK ASSOC Inc
Application granted granted Critical
Publication of DE3765381D1 publication Critical patent/DE3765381D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/08—Cutting by use of rotating axially moving tool with means to regulate operation by use of templet, tape, card, or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/21—Cutting by use of rotating axially moving tool with signal, indicator, illuminator or optical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y10T83/175—With condition sensor
    • Y10T83/178—Responsive to work

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8787308979T 1986-10-09 1987-10-09 Verfahren und system fuer vorbohrverarbeitung von mehrlagig gedruckten schaltungsplatten. Expired - Fee Related DE3765381D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/916,779 US4790694A (en) 1986-10-09 1986-10-09 Method and system for multi-layer printed circuit board pre-drill processing

Publications (1)

Publication Number Publication Date
DE3765381D1 true DE3765381D1 (de) 1990-11-08

Family

ID=25437829

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8717655U Expired - Lifetime DE8717655U1 (de) 1986-10-09 1987-10-09 Vorrichtung zum Vorbereiten einer mit gedruckten Schaltungen versehenen Multi-Layer-Platine für das automatische Bohren in einer Bohreinrichtung
DE8787308979T Expired - Fee Related DE3765381D1 (de) 1986-10-09 1987-10-09 Verfahren und system fuer vorbohrverarbeitung von mehrlagig gedruckten schaltungsplatten.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE8717655U Expired - Lifetime DE8717655U1 (de) 1986-10-09 1987-10-09 Vorrichtung zum Vorbereiten einer mit gedruckten Schaltungen versehenen Multi-Layer-Platine für das automatische Bohren in einer Bohreinrichtung

Country Status (5)

Country Link
US (1) US4790694A (de)
EP (1) EP0264243B1 (de)
JP (1) JPS63200906A (de)
KR (1) KR880005842A (de)
DE (2) DE8717655U1 (de)

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US5111406A (en) * 1990-01-05 1992-05-05 Nicolet Instrument Corporation Method for determining drill target locations in a multilayer board panel
JP2561166B2 (ja) * 1990-03-26 1996-12-04 株式会社精工舎 プリント基板の穴明け方法及びその装置
DE4016088C2 (de) * 1990-05-18 1996-04-18 Siemens Nixdorf Inf Syst Verfahren zum Bohren von Mehrlagenleiterplatten
CA2073266A1 (en) * 1991-07-09 1993-01-10 Mehmet Rona Distal targeting system
JP3127269B2 (ja) * 1992-03-11 2001-01-22 セイコープレシジョン株式会社 プリント基板の加工方法
US5332340A (en) * 1992-07-27 1994-07-26 Excellon Automation Drilling method and apparatus using variable dwell times
WO1994008443A1 (en) * 1992-09-29 1994-04-14 Berg N Edward Method and apparatus for fabricating printed circuit boards
DE4343404A1 (de) * 1993-12-18 1995-06-22 Gildemeister Devlieg System Verfahren und Vorrichtung zum Einstellen von Reibahlen und dergleichen
DE69514016T2 (de) * 1994-02-28 2000-10-19 Dynamotion/Abi Corp., Santa Ana Bohrkoordinaten-Optimierung für mehrschichtige Leiterplatten
US5479722A (en) * 1994-08-24 1996-01-02 Excellon Automation Co. Movable registration pin mechanism
DE69514972T2 (de) * 1994-09-19 2000-07-20 Totani Giken Kogyo Co. Ltd., Kyoto Maschine zum Herstellen von Beuteln
NL1001113C2 (nl) * 1995-09-01 1997-03-04 Henricus Dethmer Ubbo Ubbens Werkwijze voor het bepalen van onderlinge posities van een aantal lagen van een meerlaags printpaneel, inrichting geschikt voor het uitvoeren van een dergelijke wijze alsmede meetstift en printpaneel geschikt voor toepassing bij een dergelijke werkwijze.
US6030154A (en) * 1998-06-19 2000-02-29 International Business Machines Corporation Minimum error algorithm/program
US6205364B1 (en) * 1999-02-02 2001-03-20 Creo Ltd. Method and apparatus for registration control during processing of a workpiece particularly during producing images on substrates in preparing printed circuit boards
US6276676B1 (en) 1999-07-30 2001-08-21 Excellon Automation Company Manual registration pin alignment system
US6199290B1 (en) 1999-07-30 2001-03-13 Excellon Automation Co. Method and apparatus for automatic loading and registration of PCBs
FR2800312B1 (fr) * 1999-10-29 2002-01-25 Automa Tech Sa Machine de poinconnage pour panneaux
JP3802309B2 (ja) * 2000-03-28 2006-07-26 株式会社アドテックエンジニアリング 多層回路基板製造における位置合わせ装置及び露光装置
JP3466147B2 (ja) * 2000-10-26 2003-11-10 日東電工株式会社 回路基板の孔加工方法
US6593066B2 (en) 2001-02-28 2003-07-15 Creo Il. Ltd. Method and apparatus for printing patterns on substrates
US6493064B2 (en) 2001-02-28 2002-12-10 Creo Il, Ltd. Method and apparatus for registration control in production by imaging
JP2003131401A (ja) * 2001-10-26 2003-05-09 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置
US20040118605A1 (en) * 2002-12-20 2004-06-24 Van Der Laan Ruud Circuit board having a multi-functional hole
DK176448B1 (da) * 2003-02-03 2008-03-03 Coloplast As Stomistöttebeklædningsstykke og fremstilling af dette
US20050227049A1 (en) * 2004-03-22 2005-10-13 Boyack James R Process for fabrication of printed circuit boards
DE102004049439A1 (de) * 2004-10-08 2006-04-13 Feinfocus Gmbh Bohrvorrichtung zum Bohren von Kontaktierungsbohrungen zum Verbinden von Kontaktierungsflächen von Mehrschicht-Leiterplatten
DE102005053202A1 (de) * 2005-11-08 2007-05-10 Comet Gmbh Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen
US20100255973A1 (en) * 2007-05-15 2010-10-07 Desmedt Eric Method of making and inspecting bags
KR100883176B1 (ko) 2007-12-03 2009-02-12 세호로보트산업 주식회사 기판 타발 장치
DE102008064166A1 (de) * 2008-12-22 2010-06-24 Schmoll Maschinen Gmbh Automatisierte Werkzeugmaschine und Verfahren zum Einbringen von Referenzbohrungen in Leiterplatten
CN103914328B (zh) * 2012-12-29 2017-03-29 中国航空工业集团公司第六三一研究所 一种自动生成印制板流水号的方法
US9481028B2 (en) * 2013-09-26 2016-11-01 The Boeing Company Automated drilling through pilot holes
ES2537501B1 (es) * 2013-12-04 2015-12-04 Servicios Técnicos Eqdis, S.L.L. Máquina y procedimiento para el avellanado de orificios existentes en una placa
JP6449584B2 (ja) * 2014-08-04 2019-01-09 株式会社トプコン 角度検出装置、測量装置
WO2016023161A1 (zh) * 2014-08-11 2016-02-18 深圳崇达多层线路板有限公司 一种排板装置及排板方法
JP6252809B1 (ja) * 2016-09-14 2017-12-27 株式会社ムラキ 多層回路基板基準穴明機に応用される自動搬送装置
AT522980B1 (de) 2019-10-07 2022-06-15 Univ Wien Tech VORRICHTUNG ZUM AUFTRAGSSCHWEIßEN
DE102020113134A1 (de) * 2020-05-14 2021-11-18 Skybrain Vermögensverwaltungs Gmbh Bearbeitungsstation und Verfahren zur Bearbeitung von Werkstücken
CN114619514B (zh) * 2020-12-14 2023-09-08 华为技术有限公司 一种二次钻孔工艺
CN114158191B (zh) * 2021-11-19 2024-10-01 江门市浩远科技有限公司 一种柔性电路板的打孔方法及打孔系统
CN118450612A (zh) * 2024-05-15 2024-08-06 深圳市侨锋永业电子有限公司 一种弓曲结构的pcb板钻孔定位装置

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US3447924A (en) * 1965-08-16 1969-06-03 Charles J Trzyna Aligning method
US3573455A (en) * 1968-09-13 1971-04-06 Ibm Examination of articles by x-rays
US3663114A (en) * 1970-03-24 1972-05-16 Jasper Electronics Mfg Corp Tape controlled automatic machine, especially for printed circuit boards
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DE3031103C2 (de) * 1980-08-16 1982-08-19 Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen Verfahren zur Prüfung des Lageversatzes bei Mehrlagenleiterplatten
US4481533A (en) * 1981-11-27 1984-11-06 Lenkeit Industries, Inc. Method and apparatus for successively positioning sheets of material with precision for punching aligning holes in the sheets enabling the sheets to be used in the manufacture of composite circuit boards
US4536239A (en) * 1983-07-18 1985-08-20 Nicolet Instrument Corporation Multi-layer circuit board inspection system
JPS6151510A (ja) * 1984-08-22 1986-03-14 Shimadzu Corp 多層プリント基板の層間ずれ検査方法
JPS61125712A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 多層印刷配線板の孔穿設法

Also Published As

Publication number Publication date
EP0264243B1 (de) 1990-10-03
US4790694A (en) 1988-12-13
EP0264243A2 (de) 1988-04-20
EP0264243A3 (en) 1989-01-25
DE8717655U1 (de) 1990-01-18
JPS63200906A (ja) 1988-08-19
KR880005842A (ko) 1988-06-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee