DE3751756D1 - Verfahren zum Abscheiden aus der Gasphase - Google Patents
Verfahren zum Abscheiden aus der GasphaseInfo
- Publication number
- DE3751756D1 DE3751756D1 DE3751756T DE3751756T DE3751756D1 DE 3751756 D1 DE3751756 D1 DE 3751756D1 DE 3751756 T DE3751756 T DE 3751756T DE 3751756 T DE3751756 T DE 3751756T DE 3751756 D1 DE3751756 D1 DE 3751756D1
- Authority
- DE
- Germany
- Prior art keywords
- gas phase
- deposition process
- phase deposition
- gas
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005137 deposition process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/08—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
- C23C16/14—Deposition of only one other metal element
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61152922A JPS6311669A (ja) | 1986-06-30 | 1986-06-30 | Cvd法 |
JP61170336A JP2526040B2 (ja) | 1986-07-18 | 1986-07-18 | Cvd法 |
JP17028186A JPS6326369A (ja) | 1986-07-19 | 1986-07-19 | Cvd法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3751756D1 true DE3751756D1 (de) | 1996-05-02 |
DE3751756T2 DE3751756T2 (de) | 1996-08-01 |
Family
ID=27320373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3751756T Expired - Fee Related DE3751756T2 (de) | 1986-06-30 | 1987-06-30 | Verfahren zum Abscheiden aus der Gasphase |
Country Status (3)
Country | Link |
---|---|
US (1) | US4849260A (de) |
EP (1) | EP0252667B1 (de) |
DE (1) | DE3751756T2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0254651B1 (de) * | 1986-06-28 | 1991-09-04 | Nihon Shinku Gijutsu Kabushiki Kaisha | Verfahren und Vorrichtung zum Beschichten unter Anwendung einer CVD-Beschichtungstechnik |
US4994301A (en) * | 1986-06-30 | 1991-02-19 | Nihon Sinku Gijutsu Kabusiki Kaisha | ACVD (chemical vapor deposition) method for selectively depositing metal on a substrate |
US4800105A (en) * | 1986-07-22 | 1989-01-24 | Nihon Shinku Gijutsu Kabushiki Kaisha | Method of forming a thin film by chemical vapor deposition |
JPH01161824A (ja) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | 気相エピタキシャル成長装置 |
DE3804805A1 (de) * | 1988-02-16 | 1989-08-24 | Max Planck Gesellschaft | Cvd-verfahren zum niederschlagen einer schicht auf einer duennschicht-metallstruktur |
US5202287A (en) * | 1989-01-06 | 1993-04-13 | International Business Machines Corporation | Method for a two step selective deposition of refractory metals utilizing SiH4 reduction and H2 reduction |
US5364660A (en) * | 1989-07-21 | 1994-11-15 | Minnesota Mining And Manufacturing Company | Continuous atmospheric pressure CVD coating of fibers |
US5405654A (en) * | 1989-07-21 | 1995-04-11 | Minnesota Mining And Manufacturing Company | Self-cleaning chemical vapor deposition apparatus and method |
KR930000309B1 (ko) * | 1989-11-22 | 1993-01-15 | 삼성전자 주식회사 | 반도체 장치의 제조방법 |
KR940011708B1 (ko) * | 1990-04-09 | 1994-12-23 | 니찌덴 아네루바 가부시끼가이샤 | 기판온도제어기구 |
FR2661554A1 (fr) * | 1990-04-30 | 1991-10-31 | Philips Electronique Lab | Dispositif d'introduction des gaz dans la chambre d'un reacteur d'epitaxie, chambre de reacteur comportant un tel dispositif d'introduction de gaz, et utilisation d'une telle chambre pour la realisation de couches semiconductrices. |
KR930002673B1 (ko) * | 1990-07-05 | 1993-04-07 | 삼성전자 주식회사 | 고융점금속 성장방법 |
ATE143703T1 (de) * | 1990-06-26 | 1996-10-15 | Air Liquide | Verfahren zum herstellen selbsttragender formkörper aus feuerfestem metall |
JP2542729B2 (ja) * | 1990-06-29 | 1996-10-09 | 株式会社小電力高速通信研究所 | タングステンcvd法 |
JPH0812846B2 (ja) * | 1991-02-15 | 1996-02-07 | 株式会社半導体プロセス研究所 | 半導体製造装置 |
US5173327A (en) * | 1991-06-18 | 1992-12-22 | Micron Technology, Inc. | LPCVD process for depositing titanium films for semiconductor devices |
US5227336A (en) * | 1991-12-27 | 1993-07-13 | Small Power Communication Systems Research Laboratories Co., Ltd. | Tungsten chemical vapor deposition method |
US5306666A (en) * | 1992-07-24 | 1994-04-26 | Nippon Steel Corporation | Process for forming a thin metal film by chemical vapor deposition |
JP3491237B2 (ja) * | 1993-09-24 | 2004-01-26 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置の積層導電膜構造 |
US5489552A (en) * | 1994-12-30 | 1996-02-06 | At&T Corp. | Multiple layer tungsten deposition process |
US5641545A (en) * | 1995-06-07 | 1997-06-24 | Micron Technology, Inc. | Method to deposit highly conformal CVD films |
US6077571A (en) * | 1995-12-19 | 2000-06-20 | The Research Foundation Of State University Of New York | Conformal pure and doped aluminum coatings and a methodology and apparatus for their preparation |
US5753303A (en) * | 1996-04-30 | 1998-05-19 | International Business Machines Corporation | Process for the elimination of tungsten oxidation with inert gas stabilization in chemical vapor deposition processes |
WO1997047783A1 (en) * | 1996-06-14 | 1997-12-18 | The Research Foundation Of State University Of New York | Methodology and apparatus for in-situ doping of aluminum coatings |
US6534133B1 (en) * | 1996-06-14 | 2003-03-18 | Research Foundation Of State University Of New York | Methodology for in-situ doping of aluminum coatings |
JP2973971B2 (ja) | 1997-06-05 | 1999-11-08 | 日本電気株式会社 | 熱処理装置及び薄膜の形成方法 |
JP2002110564A (ja) * | 2000-10-02 | 2002-04-12 | Japan Pionics Co Ltd | 気相成長装置及び気相成長方法 |
US6827978B2 (en) * | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
JP4117156B2 (ja) * | 2002-07-02 | 2008-07-16 | 日本電気株式会社 | Iii族窒化物半導体基板の製造方法 |
US8628616B2 (en) * | 2007-12-11 | 2014-01-14 | Sumitomo Electric Industries, Ltd. | Vapor-phase process apparatus, vapor-phase process method, and substrate |
US8298338B2 (en) | 2007-12-26 | 2012-10-30 | Samsung Electronics Co., Ltd. | Chemical vapor deposition apparatus |
DE102008012333B4 (de) | 2008-03-03 | 2014-10-30 | Mattson Thermal Products Gmbh | Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten |
DE102009043848A1 (de) | 2009-08-25 | 2011-03-03 | Aixtron Ag | CVD-Verfahren und CVD-Reaktor |
US9512520B2 (en) * | 2011-04-25 | 2016-12-06 | Applied Materials, Inc. | Semiconductor substrate processing system |
US9499905B2 (en) * | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
TWI490362B (zh) * | 2013-02-04 | 2015-07-01 | Adpv Technology Ltd Intetrust | Window having self-cleaning of the vapor deposition apparatus |
JP6437324B2 (ja) * | 2014-03-25 | 2018-12-12 | 東京エレクトロン株式会社 | タングステン膜の成膜方法および半導体装置の製造方法 |
US10388820B2 (en) * | 2015-02-03 | 2019-08-20 | Lg Electronics Inc. | Metal organic chemical vapor deposition apparatus for solar cell |
US10428421B2 (en) * | 2015-08-03 | 2019-10-01 | Asm Ip Holding B.V. | Selective deposition on metal or metallic surfaces relative to dielectric surfaces |
JP7440480B2 (ja) * | 2021-12-13 | 2024-02-28 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、およびプログラム |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1289188B (de) * | 1964-12-15 | 1969-02-13 | Telefunken Patent | Metallbasistransistor |
US3404998A (en) * | 1965-05-18 | 1968-10-08 | Union Carbide Corp | Method of metal plating aluminum alloys |
US3794516A (en) * | 1970-12-15 | 1974-02-26 | W Engeler | Method for making high temperature low ohmic contact to silicon |
US3697342A (en) * | 1970-12-16 | 1972-10-10 | Ibm | Method of selective chemical vapor deposition |
US3697343A (en) * | 1970-12-16 | 1972-10-10 | Ibm | Method of selective chemical vapor deposition |
JPS5120267B2 (de) * | 1972-05-13 | 1976-06-23 | ||
US3900646A (en) * | 1973-02-21 | 1975-08-19 | Robert A Clyde | Method of plating metal uniformly on and throughout porous structures |
GB1507996A (en) * | 1975-06-11 | 1978-04-19 | Pilkington Brothers Ltd | Coating glass |
US4215156A (en) * | 1977-08-26 | 1980-07-29 | International Business Machines Corporation | Method for fabricating tantalum semiconductor contacts |
US4191794A (en) * | 1978-05-11 | 1980-03-04 | Westinghouse Electric Corp. | Integrated solar cell array |
US4401689A (en) * | 1980-01-31 | 1983-08-30 | Rca Corporation | Radiation heated reactor process for chemical vapor deposition on substrates |
US4404235A (en) * | 1981-02-23 | 1983-09-13 | Rca Corporation | Method for improving adhesion of metal film on a dielectric surface |
JPS5948952B2 (ja) * | 1981-03-23 | 1984-11-29 | 富士通株式会社 | 金属薄膜の形成方法 |
US4349408A (en) * | 1981-03-26 | 1982-09-14 | Rca Corporation | Method of depositing a refractory metal on a semiconductor substrate |
US4435445A (en) * | 1982-05-13 | 1984-03-06 | Energy Conversion Devices, Inc. | Photo-assisted CVD |
US4565157A (en) * | 1983-03-29 | 1986-01-21 | Genus, Inc. | Method and apparatus for deposition of tungsten silicides |
FR2548218B1 (fr) * | 1983-06-29 | 1987-03-06 | Pauleau Yves | Procede de depot de couches minces par reaction chimique en phase gazeuse utilisant deux rayonnements differents |
JPS6042823A (ja) * | 1983-08-19 | 1985-03-07 | Toshiba Corp | 薄膜形成方法 |
US4504526A (en) * | 1983-09-26 | 1985-03-12 | Libbey-Owens-Ford Company | Apparatus and method for producing a laminar flow of constant velocity fluid along a substrate |
JPS60166032A (ja) * | 1984-02-09 | 1985-08-29 | Mitsubishi Electric Corp | 光化学反応による膜形成装置 |
US4629635A (en) * | 1984-03-16 | 1986-12-16 | Genus, Inc. | Process for depositing a low resistivity tungsten silicon composite film on a substrate |
US4543270A (en) * | 1984-06-20 | 1985-09-24 | Gould Inc. | Method for depositing a micron-size metallic film on a transparent substrate utilizing a visible laser |
JPH0642456B2 (ja) * | 1984-11-21 | 1994-06-01 | 株式会社日立製作所 | 表面光処理方法 |
ATE73869T1 (de) * | 1985-05-10 | 1992-04-15 | Gen Electric | Verfahren und vorrichtung zum selektiven chemischen aufdampfen. |
EP0254651B1 (de) * | 1986-06-28 | 1991-09-04 | Nihon Shinku Gijutsu Kabushiki Kaisha | Verfahren und Vorrichtung zum Beschichten unter Anwendung einer CVD-Beschichtungstechnik |
-
1987
- 1987-06-30 EP EP87305782A patent/EP0252667B1/de not_active Expired - Lifetime
- 1987-06-30 US US07/068,910 patent/US4849260A/en not_active Expired - Fee Related
- 1987-06-30 DE DE3751756T patent/DE3751756T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3751756T2 (de) | 1996-08-01 |
EP0252667A2 (de) | 1988-01-13 |
EP0252667A3 (en) | 1988-08-17 |
US4849260A (en) | 1989-07-18 |
EP0252667B1 (de) | 1996-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |