DE3751638D1 - Target zur Erzeugung von Röntgenstrahlen - Google Patents

Target zur Erzeugung von Röntgenstrahlen

Info

Publication number
DE3751638D1
DE3751638D1 DE3751638T DE3751638T DE3751638D1 DE 3751638 D1 DE3751638 D1 DE 3751638D1 DE 3751638 T DE3751638 T DE 3751638T DE 3751638 T DE3751638 T DE 3751638T DE 3751638 D1 DE3751638 D1 DE 3751638D1
Authority
DE
Germany
Prior art keywords
rays
target
generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3751638T
Other languages
English (en)
Other versions
DE3751638T2 (de
Inventor
Thomas J Koller
Steven Tavoletti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of DE3751638D1 publication Critical patent/DE3751638D1/de
Application granted granted Critical
Publication of DE3751638T2 publication Critical patent/DE3751638T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0046—Welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C23C10/30—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes using a layer of powder or paste on the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/08—Anodes; Anti cathodes
    • H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
    • H01J35/108—Substrates for and bonding of emissive target, e.g. composite structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2235/00—X-ray tubes
    • H01J2235/10—Drive means for anode (target) substrate
    • H01J2235/1006—Supports or shafts for target or substrate
    • H01J2235/1013—Fixing to the target or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • X-Ray Techniques (AREA)
DE3751638T 1986-01-09 1987-01-09 Target zur Erzeugung von Röntgenstrahlen Expired - Fee Related DE3751638T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/817,692 US4736400A (en) 1986-01-09 1986-01-09 Diffusion bonded x-ray target

Publications (2)

Publication Number Publication Date
DE3751638D1 true DE3751638D1 (de) 1996-02-01
DE3751638T2 DE3751638T2 (de) 1996-07-18

Family

ID=25223660

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3751638T Expired - Fee Related DE3751638T2 (de) 1986-01-09 1987-01-09 Target zur Erzeugung von Röntgenstrahlen
DE3752113T Expired - Fee Related DE3752113T2 (de) 1986-01-09 1987-01-09 Target zur Erzeugung von Röntgenstrahlen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3752113T Expired - Fee Related DE3752113T2 (de) 1986-01-09 1987-01-09 Target zur Erzeugung von Röntgenstrahlen

Country Status (4)

Country Link
US (1) US4736400A (de)
EP (2) EP0653773B1 (de)
JP (1) JPH0785407B2 (de)
DE (2) DE3751638T2 (de)

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US4866748A (en) * 1988-08-15 1989-09-12 Varian Associates, Inc. Rotor structure brazed joint
US4993054A (en) * 1989-09-27 1991-02-12 General Electric Company Brazed X-ray tube anode assembly
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US5247563A (en) * 1992-02-25 1993-09-21 General Electric Company High vapor pressure metal for X-ray anode braze joint
US5547410A (en) * 1994-07-08 1996-08-20 General Electric Company Method of making an improved target/stem connection for x-ray tube anode assemblies
US5577093A (en) * 1994-07-08 1996-11-19 General Electric Company Target/stem connection for x-ray tube anode assemblies
US5530733A (en) * 1994-07-08 1996-06-25 General Electric Company Target/stem connection utilizing a diffusion enhancer for x-ray tube anode assemblies
US5498187A (en) * 1994-10-06 1996-03-12 General Electric Company Method of making an improved target/stem assembly - rotor body assembly connection for x-ray tubes
US5548628A (en) * 1994-10-06 1996-08-20 General Electric Company Target/rotor connection for use in x-ray tube rotating anode assemblies
US5498186A (en) * 1994-10-06 1996-03-12 General Electric Company Method of making an improved target/stem connection for x-ray tube anode assemblies
US5655000A (en) * 1995-10-06 1997-08-05 General Electric Company Target/rotor connection for use in x-ray tubes
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US7062017B1 (en) 2000-08-15 2006-06-13 Varian Medical Syatems, Inc. Integral cathode
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US6984358B2 (en) * 2002-09-13 2006-01-10 Lockheed Martin Corporation Diffusion bonding process of two-phase metal alloys
US7184520B1 (en) * 2003-01-29 2007-02-27 Varian Medical Systems Technologies, Inc. Component mounting system with stress compensation
CN100550269C (zh) * 2003-03-03 2009-10-14 皇家飞利浦电子股份有限公司 X射线管阴极组件和界面反应连接工艺方法
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US9208988B2 (en) 2005-10-25 2015-12-08 Rapiscan Systems, Inc. Graphite backscattered electron shield for use in an X-ray tube
US10483077B2 (en) 2003-04-25 2019-11-19 Rapiscan Systems, Inc. X-ray sources having reduced electron scattering
GB0525593D0 (en) 2005-12-16 2006-01-25 Cxr Ltd X-ray tomography inspection systems
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US6925152B2 (en) * 2003-05-13 2005-08-02 Ge Medical Systems Global Technology Co., Llc Target attachment assembly
US9046465B2 (en) 2011-02-24 2015-06-02 Rapiscan Systems, Inc. Optimization of the source firing pattern for X-ray scanning systems
US7460648B2 (en) * 2007-05-03 2008-12-02 Varian Medical Systems, Inc. Mechanical interface assembly
US7924983B2 (en) * 2008-06-30 2011-04-12 Varian Medical Systems, Inc. Thermionic emitter designed to control electron beam current profile in two dimensions
GB0901338D0 (en) 2009-01-28 2009-03-11 Cxr Ltd X-Ray tube electron sources
JP5646876B2 (ja) * 2010-05-13 2014-12-24 株式会社日立メディコ 回転陽極ｘ線管およびそれを備えたｘ線管装置
US8744047B2 (en) 2010-10-29 2014-06-03 General Electric Company X-ray tube thermal transfer method and system
US20120106711A1 (en) * 2010-10-29 2012-05-03 General Electric Company X-ray tube with bonded target and bearing sleeve
US8848875B2 (en) 2010-10-29 2014-09-30 General Electric Company Enhanced barrier for liquid metal bearings
US8503615B2 (en) 2010-10-29 2013-08-06 General Electric Company Active thermal control of X-ray tubes
JP6318245B2 (ja) * 2013-07-11 2018-04-25 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 熱膨張に適合する回転陽極の装着
US9831058B2 (en) * 2015-01-21 2017-11-28 Varex Imaging Corporation Vacuum assemblies and methods of formation
CN108907630B (zh) * 2018-08-14 2020-08-07 合肥工业大学 一种CT机X射线管用W/Mo/石墨复合阳极靶材的制造方法
CN109449070A (zh) * 2018-11-30 2019-03-08 杭州凯龙医疗器械有限公司 一种x射线管及其阳极组件、阳极组件的生产方法
CN111463093A (zh) * 2020-04-09 2020-07-28 上海联影医疗科技有限公司 X射线管、医疗成像设备和x射线管的装配方法
CN113001002A (zh) * 2021-03-30 2021-06-22 杭州凯龙医疗器械有限公司 一种ct管靶盘与转子铜套的固定方法

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Also Published As

Publication number Publication date
EP0229697B1 (de) 1995-12-20
EP0653773B1 (de) 1997-09-03
JPS62168317A (ja) 1987-07-24
DE3752113D1 (de) 1997-10-09
DE3752113T2 (de) 1998-01-08
JPH0785407B2 (ja) 1995-09-13
EP0229697A2 (de) 1987-07-22
EP0653773A1 (de) 1995-05-17
DE3751638T2 (de) 1996-07-18
EP0229697A3 (en) 1988-07-06
US4736400A (en) 1988-04-05

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