DE3751551D1 - Lithographisches Verfahren unter Anwendung von Laser zur Herstellung von elektronischen Elementen und ähnlichen. - Google Patents

Lithographisches Verfahren unter Anwendung von Laser zur Herstellung von elektronischen Elementen und ähnlichen.

Info

Publication number
DE3751551D1
DE3751551D1 DE3751551T DE3751551T DE3751551D1 DE 3751551 D1 DE3751551 D1 DE 3751551D1 DE 3751551 T DE3751551 T DE 3751551T DE 3751551 T DE3751551 T DE 3751551T DE 3751551 D1 DE3751551 D1 DE 3751551D1
Authority
DE
Germany
Prior art keywords
lasers
electronic elements
lithographic process
manufacture electronic
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3751551T
Other languages
English (en)
Other versions
DE3751551T2 (de
Inventor
Shyam Das
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Corp
Original Assignee
Quantum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Corp filed Critical Quantum Corp
Application granted granted Critical
Publication of DE3751551D1 publication Critical patent/DE3751551D1/de
Publication of DE3751551T2 publication Critical patent/DE3751551T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0041—Photosensitive materials providing an etching agent upon exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Atmospheric Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Magnetic Heads (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE3751551T 1986-08-08 1987-08-07 Lithographisches Verfahren unter Anwendung von Laser zur Herstellung von elektronischen Elementen und ähnlichen. Expired - Fee Related DE3751551T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US89478486A 1986-08-08 1986-08-08

Publications (2)

Publication Number Publication Date
DE3751551D1 true DE3751551D1 (de) 1995-11-09
DE3751551T2 DE3751551T2 (de) 1996-05-30

Family

ID=25403520

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3751551T Expired - Fee Related DE3751551T2 (de) 1986-08-08 1987-08-07 Lithographisches Verfahren unter Anwendung von Laser zur Herstellung von elektronischen Elementen und ähnlichen.

Country Status (5)

Country Link
EP (1) EP0256938B1 (de)
JP (1) JPH0791661B2 (de)
KR (1) KR960015787B1 (de)
CA (1) CA1279104C (de)
DE (1) DE3751551T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727611B2 (ja) * 1988-03-09 1995-03-29 日本碍子株式会社 磁気ヘッド用コアの製造方法
US5221422A (en) * 1988-06-06 1993-06-22 Digital Equipment Corporation Lithographic technique using laser scanning for fabrication of electronic components and the like
JP2659818B2 (ja) * 1989-09-08 1997-09-30 日本碍子株式会社 磁気ヘッド用コアの製造方法
JPH0731780B2 (ja) * 1989-09-08 1995-04-10 日本碍子株式会社 磁気ヘッド用コアの製造方法
US5741429A (en) * 1991-09-05 1998-04-21 Cardia Catheter Company Flexible tubular device for use in medical applications
US6107004A (en) * 1991-09-05 2000-08-22 Intra Therapeutics, Inc. Method for making a tubular stent for use in medical applications
US6027863A (en) * 1991-09-05 2000-02-22 Intratherapeutics, Inc. Method for manufacturing a tubular medical device
EP0542656A1 (de) * 1991-10-31 1993-05-19 International Business Machines Corporation Musterübertragung durch überdeckende Beleuchtung von gemusterten Wärmeleitern und gemusterten Wärmeisolatoren auf einen thermischen Leiter
AUPN736195A0 (en) * 1995-12-29 1996-01-25 Pacific Solar Pty Limited Improved laser grooving method
US6059769A (en) 1998-10-02 2000-05-09 Medtronic, Inc. Medical catheter with grooved soft distal segment
JP3363842B2 (ja) * 1999-07-06 2003-01-08 アルプス電気株式会社 薄膜磁気ヘッド及びその製造方法
JP4141809B2 (ja) 2002-11-15 2008-08-27 セイコーエプソン株式会社 レーザー加工方法
US8168961B2 (en) * 2008-11-26 2012-05-01 Fei Company Charged particle beam masking for laser ablation micromachining
CN117817137A (zh) * 2024-03-05 2024-04-05 四川富乐华半导体科技有限公司 一种可定制粗糙度的陶瓷覆铜载板的制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2297143A1 (fr) * 1975-01-09 1976-08-06 Anvar Procede de realisation de microgravures par faisceau laser
US4328410A (en) * 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
JPS5582780A (en) * 1978-12-16 1980-06-21 Toshiba Corp Surface processing method for metal or the like article
JPS57100620A (en) * 1980-12-15 1982-06-22 Hitachi Ltd Manufacture of magnetic head
JPS59104287A (ja) * 1982-12-07 1984-06-16 Sumitomo Electric Ind Ltd レ−ザ加工法
JPS6092093A (ja) * 1983-10-25 1985-05-23 Sony Corp レ−ザ加工方法
JPS6098511A (ja) * 1983-11-04 1985-06-01 Sony Corp 磁気ヘツドの製造方法
US4603089A (en) * 1983-11-21 1986-07-29 Rockwell International Corporation Laser welding of sandwich structures
JPS60229283A (ja) * 1984-04-27 1985-11-14 Nec Corp 磁気ヘツドスライダ溝の加工方法
JPS60254406A (ja) * 1984-05-31 1985-12-16 Sony Corp 薄膜磁気ヘツド
JPS6130672A (ja) * 1984-07-23 1986-02-12 Hitachi Ltd 選択的加工方法
JPS6176689A (ja) * 1984-09-21 1986-04-19 Nec Corp 浮動ヘツドスライダの製造方法
JPS6195792A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd 印刷配線板の製造方法
JPS61276108A (ja) * 1985-05-30 1986-12-06 Sony Corp 薄膜磁気ヘツドの製法

Also Published As

Publication number Publication date
JPH0791661B2 (ja) 1995-10-04
KR960015787B1 (en) 1996-11-21
JPS63134679A (ja) 1988-06-07
DE3751551T2 (de) 1996-05-30
KR880003410A (ko) 1988-05-17
EP0256938A2 (de) 1988-02-24
EP0256938A3 (de) 1991-02-27
EP0256938B1 (de) 1995-10-04
CA1279104C (en) 1991-01-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee