DE3682099D1 - Halbleiteranordnung. - Google Patents

Halbleiteranordnung.

Info

Publication number
DE3682099D1
DE3682099D1 DE8686302305T DE3682099T DE3682099D1 DE 3682099 D1 DE3682099 D1 DE 3682099D1 DE 8686302305 T DE8686302305 T DE 8686302305T DE 3682099 T DE3682099 T DE 3682099T DE 3682099 D1 DE3682099 D1 DE 3682099D1
Authority
DE
Germany
Prior art keywords
signal lines
package
speed signal
semiconductor arrangement
ground surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686302305T
Other languages
English (en)
Inventor
Akira Miyauchi
Hiroshi Nishimoto
Tadashi Okiyama
Hiroo Kitasagami
Masahiro Sugimoto
Haruo Tamada
Shinji Emori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60064992A external-priority patent/JPS61225842A/ja
Priority claimed from JP60074438A external-priority patent/JPH067551B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3682099D1 publication Critical patent/DE3682099D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Noodles (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE8686302305T 1985-03-30 1986-03-27 Halbleiteranordnung. Expired - Fee Related DE3682099D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60064992A JPS61225842A (ja) 1985-03-30 1985-03-30 半導体装置
JP60074438A JPH067551B2 (ja) 1985-04-10 1985-04-10 半導体装置

Publications (1)

Publication Number Publication Date
DE3682099D1 true DE3682099D1 (de) 1991-11-28

Family

ID=26406139

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686302305T Expired - Fee Related DE3682099D1 (de) 1985-03-30 1986-03-27 Halbleiteranordnung.

Country Status (8)

Country Link
US (1) US4725878A (de)
EP (2) EP0198621B1 (de)
KR (1) KR910000241B1 (de)
AT (1) ATE68913T1 (de)
CA (1) CA1246755A (de)
DE (1) DE3682099D1 (de)
HK (1) HK56292A (de)
SG (1) SG46492G (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812887B2 (ja) * 1985-04-13 1996-02-07 富士通株式会社 高速集積回路パツケ−ジ
JPH088321B2 (ja) * 1987-01-19 1996-01-29 住友電気工業株式会社 集積回路パツケ−ジ
EP0282617A1 (de) * 1987-03-18 1988-09-21 Texas Instruments Deutschland Gmbh Integrierte Schaltung mit einer elektrisch leitenden Trägerplatte
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
US4922325A (en) * 1987-10-02 1990-05-01 American Telephone And Telegraph Company Multilayer ceramic package with high frequency connections
US5014114A (en) * 1988-09-30 1991-05-07 Harris Corporation High speed, high density semiconductor memory package with chip level repairability
US5122475A (en) * 1988-09-30 1992-06-16 Harris Corporation Method of making a high speed, high density semiconductor memory package with chip level repairability
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US5028983A (en) * 1988-10-28 1991-07-02 International Business Machines Corporation Multilevel integrated circuit packaging structures
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
ATE171307T1 (de) * 1989-05-22 1998-10-15 Advanced Micro Devices Inc Leiterstruktur für eine integrierte schaltung
JP2880734B2 (ja) * 1989-08-31 1999-04-12 株式会社東芝 集積回路及びその接続回路
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
US5184210A (en) * 1990-03-20 1993-02-02 Digital Equipment Corporation Structure for controlling impedance and cross-talk in a printed circuit substrate
JPH0425036A (ja) * 1990-05-16 1992-01-28 Mitsubishi Electric Corp マイクロ波半導体装置
JP2535651B2 (ja) * 1990-07-24 1996-09-18 株式会社東芝 半導体装置
US5132613A (en) * 1990-11-30 1992-07-21 International Business Machines Corporation Low inductance side mount decoupling test structure
JPH04256203A (ja) * 1991-02-07 1992-09-10 Mitsubishi Electric Corp マイクロ波帯ｉｃ用パッケージ
US5376909A (en) * 1992-05-29 1994-12-27 Texas Instruments Incorporated Device packaging
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
EP0668615A1 (de) * 1994-02-18 1995-08-23 Siemens Aktiengesellschaft Kunststoff-SMD-Gehäuse für einen Halbleiterchip
JPH09134981A (ja) * 1995-11-08 1997-05-20 Fujitsu Ltd マイクロ波・ミリ波帯の機能モジュールパッケージ
JP3489926B2 (ja) * 1995-11-28 2004-01-26 三菱電機株式会社 高周波回路装置
US6049126A (en) * 1995-12-14 2000-04-11 Nec Corporation Semiconductor package and amplifier employing the same
FR2747235B1 (fr) * 1996-04-03 1998-07-10 Bull Sa Boitier de circuit integre
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US5923234A (en) * 1997-10-27 1999-07-13 Lockheed Martin Corp. Hermetic feedthrough using three-via transmission lines
US5945897A (en) * 1998-04-30 1999-08-31 Lockheed Martin Corporation Compliant RF coaxial interconnect
US6031188A (en) * 1998-04-30 2000-02-29 Lockheed Martin Corp. Multi-circuit RF connections using molded and compliant RF coaxial interconnects
US6081988A (en) * 1998-04-30 2000-07-04 Lockheed Martin Corp. Fabrication of a circuit module with a coaxial transmission line
US6215377B1 (en) * 1998-05-26 2001-04-10 Microsubstrates Corporation Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
JP4035238B2 (ja) * 1998-10-20 2008-01-16 富士通株式会社 光モジュール
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
TWI292628B (en) * 2001-03-29 2008-01-11 Furukawa Electric Co Ltd Optical fiber module lead frame and optical fiber module
US6917265B2 (en) * 2003-05-22 2005-07-12 Synergy Microwave Corporation Microwave frequency surface mount components and methods of forming same
JP2005340741A (ja) 2004-05-31 2005-12-08 Renesas Technology Corp 半導体装置
US7705445B2 (en) * 2005-02-11 2010-04-27 Rambus Inc. Semiconductor package with low and high-speed signal paths
KR20070107746A (ko) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부 중첩된 조절기
CN100452445C (zh) * 2006-07-11 2009-01-14 武汉电信器件有限公司 和共面波导集成的侧面进光的10Gb/s APD管芯及其制作工艺
JP5003464B2 (ja) * 2007-12-21 2012-08-15 三菱電機株式会社 光伝送モジュール
US9078347B2 (en) * 2010-07-30 2015-07-07 Kyocera Corporation Electronic component housing unit, electronic module, and electronic device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826069B1 (de) * 1968-03-04 1973-08-04
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4514749A (en) * 1983-01-18 1985-04-30 At&T Bell Laboratories VLSI Chip with ground shielding
US4543544A (en) * 1984-01-04 1985-09-24 Motorola, Inc. LCC co-planar lead frame semiconductor IC package
US4667220A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip module interconnection system
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
JPS61239649A (ja) * 1985-04-13 1986-10-24 Fujitsu Ltd 高速集積回路パツケ−ジ

Also Published As

Publication number Publication date
EP0198621B1 (de) 1991-10-23
EP0198621A3 (en) 1988-01-07
SG46492G (en) 1992-06-12
HK56292A (en) 1992-08-07
CA1246755A (en) 1988-12-13
KR910000241B1 (ko) 1991-01-23
EP0198621A2 (de) 1986-10-22
US4725878A (en) 1988-02-16
ATE68913T1 (de) 1991-11-15
EP0396152A1 (de) 1990-11-07
KR860007730A (ko) 1986-10-17

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