ATE68913T1 - Halbleiteranordnung. - Google Patents

Halbleiteranordnung.

Info

Publication number
ATE68913T1
ATE68913T1 AT86302305T AT86302305T ATE68913T1 AT E68913 T1 ATE68913 T1 AT E68913T1 AT 86302305 T AT86302305 T AT 86302305T AT 86302305 T AT86302305 T AT 86302305T AT E68913 T1 ATE68913 T1 AT E68913T1
Authority
AT
Austria
Prior art keywords
signal lines
package
speed signal
semiconductor arrangement
ground surfaces
Prior art date
Application number
AT86302305T
Other languages
English (en)
Inventor
Akira Miyauchi
Hiroshi Nishimoto
Tadashi Okiyama
Hiroo Kitasagami
Shirahatadai
Masahiro Sugimoto
Haruo Tamada
Shinji Emori
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60064992A external-priority patent/JPS61225842A/ja
Priority claimed from JP60074438A external-priority patent/JPH067551B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of ATE68913T1 publication Critical patent/ATE68913T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Noodles (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT86302305T 1985-03-30 1986-03-27 Halbleiteranordnung. ATE68913T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60064992A JPS61225842A (ja) 1985-03-30 1985-03-30 半導体装置
JP60074438A JPH067551B2 (ja) 1985-04-10 1985-04-10 半導体装置
EP86302305A EP0198621B1 (de) 1985-03-30 1986-03-27 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
ATE68913T1 true ATE68913T1 (de) 1991-11-15

Family

ID=26406139

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86302305T ATE68913T1 (de) 1985-03-30 1986-03-27 Halbleiteranordnung.

Country Status (8)

Country Link
US (1) US4725878A (de)
EP (2) EP0198621B1 (de)
KR (1) KR910000241B1 (de)
AT (1) ATE68913T1 (de)
CA (1) CA1246755A (de)
DE (1) DE3682099D1 (de)
HK (1) HK56292A (de)
SG (1) SG46492G (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812887B2 (ja) * 1985-04-13 1996-02-07 富士通株式会社 高速集積回路パツケ−ジ
JPH088321B2 (ja) * 1987-01-19 1996-01-29 住友電気工業株式会社 集積回路パツケ−ジ
EP0282617A1 (de) * 1987-03-18 1988-09-21 Texas Instruments Deutschland Gmbh Integrierte Schaltung mit einer elektrisch leitenden Trägerplatte
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
US4922325A (en) * 1987-10-02 1990-05-01 American Telephone And Telegraph Company Multilayer ceramic package with high frequency connections
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US5122475A (en) * 1988-09-30 1992-06-16 Harris Corporation Method of making a high speed, high density semiconductor memory package with chip level repairability
US5014114A (en) * 1988-09-30 1991-05-07 Harris Corporation High speed, high density semiconductor memory package with chip level repairability
US5028983A (en) * 1988-10-28 1991-07-02 International Business Machines Corporation Multilevel integrated circuit packaging structures
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
EP0399661B1 (de) * 1989-05-22 1998-09-16 Advanced Micro Devices, Inc. Leiterstruktur für eine integrierte Schaltung
JP2880734B2 (ja) * 1989-08-31 1999-04-12 株式会社東芝 集積回路及びその接続回路
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
US5184210A (en) * 1990-03-20 1993-02-02 Digital Equipment Corporation Structure for controlling impedance and cross-talk in a printed circuit substrate
JPH0425036A (ja) * 1990-05-16 1992-01-28 Mitsubishi Electric Corp マイクロ波半導体装置
JP2535651B2 (ja) * 1990-07-24 1996-09-18 株式会社東芝 半導体装置
US5132613A (en) * 1990-11-30 1992-07-21 International Business Machines Corporation Low inductance side mount decoupling test structure
JPH04256203A (ja) * 1991-02-07 1992-09-10 Mitsubishi Electric Corp マイクロ波帯ｉｃ用パッケージ
US5376909A (en) * 1992-05-29 1994-12-27 Texas Instruments Incorporated Device packaging
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
EP0668615A1 (de) * 1994-02-18 1995-08-23 Siemens Aktiengesellschaft Kunststoff-SMD-Gehäuse für einen Halbleiterchip
JPH09134981A (ja) * 1995-11-08 1997-05-20 Fujitsu Ltd マイクロ波・ミリ波帯の機能モジュールパッケージ
JP3489926B2 (ja) * 1995-11-28 2004-01-26 三菱電機株式会社 高周波回路装置
US6049126A (en) * 1995-12-14 2000-04-11 Nec Corporation Semiconductor package and amplifier employing the same
FR2747235B1 (fr) * 1996-04-03 1998-07-10 Bull Sa Boitier de circuit integre
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US5923234A (en) * 1997-10-27 1999-07-13 Lockheed Martin Corp. Hermetic feedthrough using three-via transmission lines
US5945897A (en) * 1998-04-30 1999-08-31 Lockheed Martin Corporation Compliant RF coaxial interconnect
US6031188A (en) * 1998-04-30 2000-02-29 Lockheed Martin Corp. Multi-circuit RF connections using molded and compliant RF coaxial interconnects
US6081988A (en) * 1998-04-30 2000-07-04 Lockheed Martin Corp. Fabrication of a circuit module with a coaxial transmission line
US6215377B1 (en) * 1998-05-26 2001-04-10 Microsubstrates Corporation Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
JP4035238B2 (ja) * 1998-10-20 2008-01-16 富士通株式会社 光モジュール
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
TWI292628B (en) * 2001-03-29 2008-01-11 Furukawa Electric Co Ltd Optical fiber module lead frame and optical fiber module
US6917265B2 (en) * 2003-05-22 2005-07-12 Synergy Microwave Corporation Microwave frequency surface mount components and methods of forming same
JP2005340741A (ja) 2004-05-31 2005-12-08 Renesas Technology Corp 半導体装置
US7705445B2 (en) * 2005-02-11 2010-04-27 Rambus Inc. Semiconductor package with low and high-speed signal paths
GB2439861A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Internally overlapped conditioners
CN100452445C (zh) * 2006-07-11 2009-01-14 武汉电信器件有限公司 和共面波导集成的侧面进光的10Gb/s APD管芯及其制作工艺
JP5003464B2 (ja) * 2007-12-21 2012-08-15 三菱電機株式会社 光伝送モジュール
US9078347B2 (en) * 2010-07-30 2015-07-07 Kyocera Corporation Electronic component housing unit, electronic module, and electronic device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826069B1 (de) * 1968-03-04 1973-08-04
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4514749A (en) * 1983-01-18 1985-04-30 At&T Bell Laboratories VLSI Chip with ground shielding
US4543544A (en) * 1984-01-04 1985-09-24 Motorola, Inc. LCC co-planar lead frame semiconductor IC package
US4667220A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip module interconnection system
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
JPS61239649A (ja) * 1985-04-13 1986-10-24 Fujitsu Ltd 高速集積回路パツケ−ジ

Also Published As

Publication number Publication date
EP0396152A1 (de) 1990-11-07
EP0198621A2 (de) 1986-10-22
SG46492G (en) 1992-06-12
EP0198621A3 (en) 1988-01-07
CA1246755A (en) 1988-12-13
US4725878A (en) 1988-02-16
KR860007730A (ko) 1986-10-17
EP0198621B1 (de) 1991-10-23
HK56292A (en) 1992-08-07
KR910000241B1 (ko) 1991-01-23
DE3682099D1 (de) 1991-11-28

Similar Documents

Publication Publication Date Title
DE3682099D1 (de) Halbleiteranordnung.
ATE61696T1 (de) Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen.
ATE68915T1 (de) Integrierte schaltung mit eingebauter streifenleiterstruktur.
TW358230B (en) Semiconductor package
JPS57207356A (en) Semiconductor device
EP0353426A3 (de) Integrierte Halbleiterschaltungsanordnung mit Leiterschichten
KR850005158A (ko) 반도체 집적회로 장치
EP0299775A3 (en) Tab bonded semiconductor chip package
KR900019542A (ko) 신축성 있는 인쇄회로
KR920020686A (ko) 반도체 패키지
EP0370745A3 (de) Halbleiterchip-Packung hoher Leistung und mit niedrigem Kostenaufwand
KR860005438A (ko) 반도체칩과 기판과의 접합구조가 개선된 반도체장치
DE3879813D1 (de) Integrierte halbleiterschaltung mit signallinien.
WO2003046983A8 (en) Connection package for high-speed integrated circuit
KR910001956A (ko) 반도체장치
CA2061522A1 (en) Structure of semiconductor ic chip
EP0221496A3 (de) Integrierte Schaltungspackung
EP0331206A3 (de) Integrierte Schaltungshalbleiteranordnung mit Mehrschicht-Verbindungsstruktur
KR860004463A (ko) 반도체집적회로의 신호전송회로
EP0293838A3 (de) Packung für integrierte Halbeiterschaltungsanordnung hoher Geschwindigkeit
KR970006535B1 (en) Universal semiconductor chip package
GB2208569B (en) Method for connecting leadless chip packages and articles
DE3581632D1 (de) Integrierte halbleiter-schaltungsvorrichtung mit mehrschichtverdrahtung.
JPS57104235A (en) Semiconductor device
KR910001967A (ko) 웨이퍼 스케일 집적장치

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee