DE3618590A1 - Leiterplatte mit einem ic-baustein und einem kondensator sowie verfahren zur impulsdaempfung des kondensators - Google Patents
Leiterplatte mit einem ic-baustein und einem kondensator sowie verfahren zur impulsdaempfung des kondensatorsInfo
- Publication number
- DE3618590A1 DE3618590A1 DE19863618590 DE3618590A DE3618590A1 DE 3618590 A1 DE3618590 A1 DE 3618590A1 DE 19863618590 DE19863618590 DE 19863618590 DE 3618590 A DE3618590 A DE 3618590A DE 3618590 A1 DE3618590 A1 DE 3618590A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- capacitor
- module
- plate
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003990 capacitor Substances 0.000 title claims description 38
- 238000013016 damping Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 9
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 41
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002175 menstrual effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74297485A | 1985-06-11 | 1985-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3618590A1 true DE3618590A1 (de) | 1986-12-11 |
Family
ID=24986997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863618590 Withdrawn DE3618590A1 (de) | 1985-06-11 | 1986-06-03 | Leiterplatte mit einem ic-baustein und einem kondensator sowie verfahren zur impulsdaempfung des kondensators |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS61287292A (fr) |
| KR (1) | KR900003311B1 (fr) |
| CN (1) | CN86103388A (fr) |
| DE (1) | DE3618590A1 (fr) |
| FR (1) | FR2583251A1 (fr) |
| GB (1) | GB2176654B (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6408090B1 (en) * | 1998-09-28 | 2002-06-18 | Siemens Production And Logistics System Aktiengesellschaft | Method for position recognition of components equipped on a substrate in an automatic equipping unit |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232693A (ja) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | プリント基板への回路部品実装方法 |
| US4882656A (en) * | 1986-12-12 | 1989-11-21 | Menzies Jr L William | Surface mounted decoupling capacitor |
| FR2622346B1 (fr) * | 1987-10-23 | 1993-05-28 | Eurofarad | Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur |
| KR100277314B1 (ko) | 1996-11-08 | 2001-01-15 | 모기 쥰이찌 | 박막콘덴서 및 이를탑재한반도체장치 |
| US6404649B1 (en) | 2000-03-03 | 2002-06-11 | Advanced Micro Devices, Inc. | Printed circuit board assembly with improved bypass decoupling for BGA packages |
| JP4186589B2 (ja) * | 2002-10-30 | 2008-11-26 | 松下電器産業株式会社 | シート形電子部品モジュール |
| CN1589093A (zh) * | 2004-08-13 | 2005-03-02 | 广州金升阳科技有限公司 | 改善点焊中细微漆包线焊点强度的方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4502101A (en) * | 1982-07-30 | 1985-02-26 | Rogers Corporation | Decoupled integrated circuit package |
| FR2576448B1 (fr) * | 1985-01-22 | 1989-04-14 | Rogers Corp | Condensateur de decouplage pour assemblage avec disposition a grille de broches |
-
1986
- 1986-04-14 GB GB08609059A patent/GB2176654B/en not_active Expired
- 1986-05-13 KR KR1019860003693A patent/KR900003311B1/ko active IP Right Grant
- 1986-05-17 CN CN198686103388A patent/CN86103388A/zh active Pending
- 1986-06-03 DE DE19863618590 patent/DE3618590A1/de not_active Withdrawn
- 1986-06-04 JP JP61130025A patent/JPS61287292A/ja active Pending
- 1986-06-11 FR FR8608455A patent/FR2583251A1/fr not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6408090B1 (en) * | 1998-09-28 | 2002-06-18 | Siemens Production And Logistics System Aktiengesellschaft | Method for position recognition of components equipped on a substrate in an automatic equipping unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR900003311B1 (ko) | 1990-05-14 |
| GB2176654A (en) | 1986-12-31 |
| GB2176654B (en) | 1988-08-10 |
| KR870000849A (ko) | 1987-02-20 |
| JPS61287292A (ja) | 1986-12-17 |
| FR2583251A1 (fr) | 1986-12-12 |
| CN86103388A (zh) | 1986-12-10 |
| GB8609059D0 (en) | 1986-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2201585B1 (fr) | Composant électrique multicouche | |
| AT398254B (de) | Chipträger sowie anordnung von solchen chipträgern | |
| EP0035093B1 (fr) | Empaquetage pour plusieurs pastilles semiconductrices à commutation rapide | |
| DE2459532C2 (de) | Anordnung mit mehreren, parallel angeordneten mikroelektronischen Bauelementen scheibenförmiger Gestalt und Verfahren zur Herstellung der Kontaktbereiche einer solchen Anordnung | |
| DE19921109B4 (de) | Elektronikbauteil und Elektronikkomponente mit einem Keramikbauteilelement | |
| DE60029962T2 (de) | Anordnung für die montage von chips auf leiterplatten | |
| DE19650148B4 (de) | Halbleitervorrichtung und zugehöriges Herstellungsverfahren | |
| DE69214334T2 (de) | Elektrischer Aufbau für Anwendungen bei hoher Dichte | |
| DE69211821T2 (de) | Innere Leiterstruktur einer Halbleiteranordnung | |
| DE102007014789B3 (de) | Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul | |
| DE10004196A1 (de) | Elektronische Halbbrücken-Moduleinheit | |
| EP0022176B1 (fr) | Module pour plaquettes à circuit intégré | |
| DE3809237A1 (de) | Entkopplungskondensator fuer schaltungspackungen mit oberflaechenmontierten kontaktstiftlosen chiptraegern, oberflaechenmontierten chiptraegern mit kontaktstiften und fuer schaltungspackungen mit kontaktstiftraster | |
| DE4027072C2 (de) | Halbleiteranordnung | |
| DE102011077206B4 (de) | Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte | |
| DE3724703A1 (de) | Entkopplungskondensator fuer schaltkreisbausteine mit rasterfoermigen kontaktstiftanordnungen und daraus bestehende entkopplungsanordnungen | |
| DE102005060081B4 (de) | Elektronisches Bauteil mit zumindest einer Leiterplatte und mit einer Mehrzahl gleichartiger Halbleiterbausteine und Verfahren | |
| DE3911711A1 (de) | Modul-aufbau mit integriertem halbleiterchip und chiptraeger | |
| EP0597254A1 (fr) | Dispositif avec composants semi-conducteurs de puissance | |
| DE4325668A1 (de) | Mehrebenen-Verdrahtungssubstrat und dieses verwendende Halbleiteranordnung | |
| DE102005014746A1 (de) | Aktive primärseitige Schaltungsanordnung für ein Schaltnetzteil | |
| EP1490908A2 (fr) | Module de puissance comportant au moins deux substrats et procede permettant de le produire | |
| EP3437112A1 (fr) | Agencement de condensateur | |
| EP0738008B1 (fr) | Module à semi-conducteur de puissance | |
| DE3618590A1 (de) | Leiterplatte mit einem ic-baustein und einem kondensator sowie verfahren zur impulsdaempfung des kondensators |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |