DE3561547D1 - Low temperature fired ceramics - Google Patents

Low temperature fired ceramics

Info

Publication number
DE3561547D1
DE3561547D1 DE8585105284T DE3561547T DE3561547D1 DE 3561547 D1 DE3561547 D1 DE 3561547D1 DE 8585105284 T DE8585105284 T DE 8585105284T DE 3561547 T DE3561547 T DE 3561547T DE 3561547 D1 DE3561547 D1 DE 3561547D1
Authority
DE
Germany
Prior art keywords
low temperature
temperature fired
fired ceramics
ceramics
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585105284T
Other languages
English (en)
Inventor
Susumu Nishigaki
Shinsuke Yano
Shirohito Matsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Application granted granted Critical
Publication of DE3561547D1 publication Critical patent/DE3561547D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
DE8585105284T 1984-06-01 1985-04-30 Low temperature fired ceramics Expired DE3561547D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59110973A JPS60260465A (ja) 1984-06-01 1984-06-01 低温焼成セラミツクス

Publications (1)

Publication Number Publication Date
DE3561547D1 true DE3561547D1 (en) 1988-03-10

Family

ID=14549184

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8585105284T Expired DE3561547D1 (en) 1984-06-01 1985-04-30 Low temperature fired ceramics
DE198585105284T Pending DE163155T1 (de) 1984-06-01 1985-04-30 Bei niederer temperatur gebrannte keramiken.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198585105284T Pending DE163155T1 (de) 1984-06-01 1985-04-30 Bei niederer temperatur gebrannte keramiken.

Country Status (4)

Country Link
US (1) US4621066A (de)
EP (1) EP0163155B1 (de)
JP (1) JPS60260465A (de)
DE (2) DE3561547D1 (de)

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JPH0634452B2 (ja) * 1985-08-05 1994-05-02 株式会社日立製作所 セラミツクス回路基板
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US5164342A (en) * 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5258335A (en) * 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
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JP2614778B2 (ja) * 1990-07-12 1997-05-28 株式会社住友金属エレクトロデバイス セラミック多層回路基板の製造方法
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JP3297569B2 (ja) * 1995-10-30 2002-07-02 京セラ株式会社 低温焼成磁器組成物
JPH09246723A (ja) * 1996-03-11 1997-09-19 Sumitomo Kinzoku Electro Device:Kk 低温焼成セラミック回路基板
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JPH11335162A (ja) * 1998-05-25 1999-12-07 Murata Mfg Co Ltd セラミック基板用組成物およびセラミック回路部品
JP4852778B2 (ja) * 1999-06-22 2012-01-11 株式会社村田製作所 セラミック基板用組成物およびセラミック回路部品
JP3591437B2 (ja) * 2000-09-07 2004-11-17 株式会社村田製作所 多層セラミック基板およびその製造方法ならびに電子装置
JP4590866B2 (ja) * 2001-11-05 2010-12-01 旭硝子株式会社 ガラスセラミックス組成物
KR100484892B1 (ko) * 2002-08-28 2005-04-28 재단법인서울대학교산학협력재단 자가발포형 다공성 세라믹 조성물 및 이를 이용한 다공성 세라믹의 제조방법
US7510995B2 (en) * 2003-04-01 2009-03-31 United Technologies Corporation Application of a mixed metal oxide catalyst to a metallic substrate
JP4748701B2 (ja) * 2003-04-28 2011-08-17 日本特殊陶業株式会社 低温焼成磁器組成物、およびそれを用いた配線基板
KR100636543B1 (ko) 2003-05-26 2006-10-18 가부시키가이샤 무라타 세이사쿠쇼 자기 조성물
JP2006206378A (ja) * 2005-01-28 2006-08-10 Murata Mfg Co Ltd セラミック原料組成物およびセラミック回路部品
JP2009117450A (ja) * 2007-11-02 2009-05-28 Rohm Co Ltd モジュールおよびその製造方法
KR100896610B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 다층 세라믹 기판 및 그 제조방법
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JP5429091B2 (ja) * 2010-07-21 2014-02-26 日本電気硝子株式会社 ガラスセラミックス誘電体材料およびその製造方法
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CN102503137A (zh) * 2011-10-13 2012-06-20 天津大学 一种钙铝硼硅系玻璃+熔融石英体系低温共烧陶瓷材料及其制备方法
KR20160016392A (ko) * 2014-08-05 2016-02-15 삼성전기주식회사 적층 세라믹 커패시터
WO2018195257A1 (en) * 2017-04-21 2018-10-25 Lantec Products, Inc. Low bake ceramic material
US10597186B2 (en) 2018-06-21 2020-03-24 John Bean Technologies Corporation Produce label printer and applicator
IT201800020944A1 (it) * 2018-12-21 2020-06-21 Luca Toncelli Metodo per la produzione di manufatti colorati in lastra vetroceramica a partire da un impasto base, fritta vetrosa per la realizzazione dell’impasto base e manufatto colorato in lastra vetroceramica così ottenuto
JP6927251B2 (ja) * 2019-07-08 2021-08-25 Tdk株式会社 ガラスセラミックス焼結体および配線基板
RU2753522C1 (ru) * 2020-12-18 2021-08-17 федеральное государственное автономное образовательное учреждение высшего образования «Национальный исследовательский Томский политехнический университет» Низкотемпературный стеклокерамический материал для электронной техники
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Also Published As

Publication number Publication date
US4621066A (en) 1986-11-04
DE163155T1 (de) 1986-04-10
EP0163155A1 (de) 1985-12-04
EP0163155B1 (de) 1988-02-03
JPH0353269B2 (de) 1991-08-14
JPS60260465A (ja) 1985-12-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO METAL CERAMICS INC., MINE, YAMAGUCHI, JP

8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC., MIN

8327 Change in the person/name/address of the patent owner

Owner name: MURATA MFG. CO., LTD., NAGAOKAKYO, KYOTO, JP