DE3545527A1 - Flexible elektrische verbindungsvorrichtung und verfahren zu ihrer herstellung - Google Patents

Flexible elektrische verbindungsvorrichtung und verfahren zu ihrer herstellung

Info

Publication number
DE3545527A1
DE3545527A1 DE19853545527 DE3545527A DE3545527A1 DE 3545527 A1 DE3545527 A1 DE 3545527A1 DE 19853545527 DE19853545527 DE 19853545527 DE 3545527 A DE3545527 A DE 3545527A DE 3545527 A1 DE3545527 A1 DE 3545527A1
Authority
DE
Germany
Prior art keywords
flexible
connecting device
conductors
ribbon cable
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853545527
Other languages
German (de)
English (en)
Inventor
Frank J. Holliston Mass. Cheriff
Walter N. Westboro Mass. Cox
Joseph J. Kirk
Arnold M. Sudbury Mass. Pulver
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE3545527A1 publication Critical patent/DE3545527A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
DE19853545527 1984-12-20 1985-12-20 Flexible elektrische verbindungsvorrichtung und verfahren zu ihrer herstellung Withdrawn DE3545527A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68441584A 1984-12-20 1984-12-20

Publications (1)

Publication Number Publication Date
DE3545527A1 true DE3545527A1 (de) 1986-07-03

Family

ID=24747959

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853545527 Withdrawn DE3545527A1 (de) 1984-12-20 1985-12-20 Flexible elektrische verbindungsvorrichtung und verfahren zu ihrer herstellung

Country Status (4)

Country Link
JP (1) JPS61148706A (enrdf_load_stackoverflow)
CA (1) CA1237817A (enrdf_load_stackoverflow)
DE (1) DE3545527A1 (enrdf_load_stackoverflow)
GB (1) GB2169750B (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0461875A3 (en) * 1990-06-14 1992-03-04 Seiko Epson Corporation Wiring connecting device
DE4140010A1 (de) * 1990-12-04 1992-06-11 Mitsubishi Electric Corp Leiterplatte und verfahren zu ihrer herstellung
DE29617034U1 (de) * 1996-09-30 1996-12-05 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal PC-Card Adapter
DE19640342A1 (de) * 1996-09-20 1998-04-09 Siemens Ag Flachbandleitung mit Stecker als Teil eines elektrischen Netzes
DE19702536A1 (de) * 1997-01-24 1998-07-30 Siemens Ag Langgestrecktes Element mit mindestens einem elektrischen und/oder optischen Leiter
DE10260786A1 (de) * 2002-12-23 2004-07-15 Daimlerchrysler Ag Flachkabelstrang
DE102014105544B4 (de) 2013-04-22 2023-05-04 Infineon Technologies Austria Ag Vorrichtung mit einem kabel und einer aktiven schaltung im kabel, system und verfahren

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629953B1 (fr) * 1988-04-06 1991-07-05 Sagem Composant electrique, notamment moteur electrique, equipe de double paires de contacts, notamment pour autoriser deux implantations differentes sur une plaque a circuits imprimes
DE69230660T2 (de) * 1991-10-29 2000-12-07 Sumitomo Wiring Systems, Ltd. Kabelbaum
DE29617455U1 (de) * 1996-09-27 1997-08-28 Siemens AG, 80333 München Anschlußleitung für eine Endeinrichtung eines mit einer Multiplexsteuerung versehenen Bordnetzes eines Kraftfahrzeuges
DE10330448A1 (de) * 2003-07-05 2005-01-27 Daimlerchrysler Ag Verfahren zum platzsparenden Anbringen elektrischer Leitungen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4015422A (en) * 1975-06-02 1977-04-05 Bulova Watch Company, Inc. Solid-state electronic watch assembly
GB1476404A (en) * 1973-06-06 1977-06-16 Sharp Kk Electronic apparatus comprising a flexible substrate and method of making such apparatus
DE7824483U1 (de) * 1978-08-17 1978-11-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrische Baugruppe mit einer gedruckten Leiterfolie
DE2441665B2 (de) * 1974-08-30 1979-03-29 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Elektrisches Verdrahtungssystem für Kraftfahrzeuge in Form einer flexiblen gedruckten Bandleitung
DE2743647B2 (de) * 1977-09-28 1979-07-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Kühlung von Bauelementen der elektrischen Nachrichten- und Meßtechnik
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51121772A (en) * 1975-04-18 1976-10-25 Hitachi Ltd Method of soldering wiring
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2470518A1 (fr) * 1979-11-23 1981-05-29 Thomson Csf Procede de connexion, pour le multiplexage de microcircuits electroniques, et tete de lecture-ecriture et panneau d'affichage utilisant ce procede

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1476404A (en) * 1973-06-06 1977-06-16 Sharp Kk Electronic apparatus comprising a flexible substrate and method of making such apparatus
DE2441665B2 (de) * 1974-08-30 1979-03-29 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Elektrisches Verdrahtungssystem für Kraftfahrzeuge in Form einer flexiblen gedruckten Bandleitung
US4015422A (en) * 1975-06-02 1977-04-05 Bulova Watch Company, Inc. Solid-state electronic watch assembly
DE2743647B2 (de) * 1977-09-28 1979-07-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Kühlung von Bauelementen der elektrischen Nachrichten- und Meßtechnik
DE7824483U1 (de) * 1978-08-17 1978-11-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrische Baugruppe mit einer gedruckten Leiterfolie
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
BRAUN, Robert: Starr-flexible Leiterplatten. DE-Z.: Funkschau 1/1982, Franzis-Verlag, MÜnchen, S. 58 *
BRUNNER, E.: Konstruktive und technologische Probleme beim Einsatz flexibler kupferkaschierter Basismaterialien in der Geräteverdrahtung. DE-Z.: Feingerätetechnik, Heft 12, 1975, S. 554-559 *
Flexible gedruckte Schaltungen, Elektronik, Produktion & Prüftechnik, S. 1983, S. 385 *
Flexible gedruckte Schaltungen, Prospekt Fa. Carl Freudenberg in Elektronik, H. 7, April 1983, S. 117/118 *
N.N.: Kleber für Polyimidfolien für flexible gedruckte Schaltungen. DE-Z.: Industrie-Elektrik und Elektronik, 1978, Heft 23, S. e165 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0461875A3 (en) * 1990-06-14 1992-03-04 Seiko Epson Corporation Wiring connecting device
DE4140010A1 (de) * 1990-12-04 1992-06-11 Mitsubishi Electric Corp Leiterplatte und verfahren zu ihrer herstellung
DE19640342A1 (de) * 1996-09-20 1998-04-09 Siemens Ag Flachbandleitung mit Stecker als Teil eines elektrischen Netzes
DE19640342C2 (de) * 1996-09-20 2001-05-23 Siemens Ag Flachbandleitung mit Stecker als Teil eines elektrischen Netzes
DE29617034U1 (de) * 1996-09-30 1996-12-05 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal PC-Card Adapter
US6176724B1 (en) 1996-09-30 2001-01-23 Stocko Metallwarenfabriken Henkels Und Sohn PC card adapter
DE19702536A1 (de) * 1997-01-24 1998-07-30 Siemens Ag Langgestrecktes Element mit mindestens einem elektrischen und/oder optischen Leiter
US5986207A (en) * 1997-01-24 1999-11-16 Siemens Aktiengesellschaft Signal carrying arrangement
DE10260786A1 (de) * 2002-12-23 2004-07-15 Daimlerchrysler Ag Flachkabelstrang
DE102014105544B4 (de) 2013-04-22 2023-05-04 Infineon Technologies Austria Ag Vorrichtung mit einem kabel und einer aktiven schaltung im kabel, system und verfahren

Also Published As

Publication number Publication date
JPS61148706A (ja) 1986-07-07
CA1260623C (enrdf_load_stackoverflow) 1989-09-26
GB8530396D0 (en) 1986-01-22
CA1237817A (en) 1988-06-07
GB2169750A (en) 1986-07-16
GB2169750B (en) 1989-02-22
JPH0573235B2 (enrdf_load_stackoverflow) 1993-10-13

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