JPH0573235B2 - - Google Patents

Info

Publication number
JPH0573235B2
JPH0573235B2 JP60287627A JP28762785A JPH0573235B2 JP H0573235 B2 JPH0573235 B2 JP H0573235B2 JP 60287627 A JP60287627 A JP 60287627A JP 28762785 A JP28762785 A JP 28762785A JP H0573235 B2 JPH0573235 B2 JP H0573235B2
Authority
JP
Japan
Prior art keywords
flexible cable
flexible
conductor
chip carrier
display assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60287627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61148706A (ja
Inventor
Jei Cherifu Furanku
Jei Kaaku Josefu
Emu Paruaa Aanorudo
Enu Kotsukusu Uorutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JPS61148706A publication Critical patent/JPS61148706A/ja
Publication of JPH0573235B2 publication Critical patent/JPH0573235B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP60287627A 1984-12-20 1985-12-20 フレキシブル・ケーブルを有するディスプレイ組立体 Granted JPS61148706A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68441584A 1984-12-20 1984-12-20
US684415 1996-07-19

Publications (2)

Publication Number Publication Date
JPS61148706A JPS61148706A (ja) 1986-07-07
JPH0573235B2 true JPH0573235B2 (enrdf_load_stackoverflow) 1993-10-13

Family

ID=24747959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60287627A Granted JPS61148706A (ja) 1984-12-20 1985-12-20 フレキシブル・ケーブルを有するディスプレイ組立体

Country Status (4)

Country Link
JP (1) JPS61148706A (enrdf_load_stackoverflow)
CA (1) CA1237817A (enrdf_load_stackoverflow)
DE (1) DE3545527A1 (enrdf_load_stackoverflow)
GB (1) GB2169750B (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629953B1 (fr) * 1988-04-06 1991-07-05 Sagem Composant electrique, notamment moteur electrique, equipe de double paires de contacts, notamment pour autoriser deux implantations differentes sur une plaque a circuits imprimes
JPH0450820A (ja) * 1990-06-14 1992-02-19 Seiko Epson Corp 配線接続装置
JP2913891B2 (ja) * 1990-12-04 1999-06-28 三菱電機株式会社 多層配線基板
DE69230660T2 (de) * 1991-10-29 2000-12-07 Sumitomo Wiring Systems, Ltd. Kabelbaum
DE19640342C2 (de) * 1996-09-20 2001-05-23 Siemens Ag Flachbandleitung mit Stecker als Teil eines elektrischen Netzes
DE29617455U1 (de) * 1996-09-27 1997-08-28 Siemens AG, 80333 München Anschlußleitung für eine Endeinrichtung eines mit einer Multiplexsteuerung versehenen Bordnetzes eines Kraftfahrzeuges
DE29617034U1 (de) 1996-09-30 1996-12-05 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal PC-Card Adapter
DE19702536A1 (de) * 1997-01-24 1998-07-30 Siemens Ag Langgestrecktes Element mit mindestens einem elektrischen und/oder optischen Leiter
DE10260786A1 (de) * 2002-12-23 2004-07-15 Daimlerchrysler Ag Flachkabelstrang
DE10330448A1 (de) * 2003-07-05 2005-01-27 Daimlerchrysler Ag Verfahren zum platzsparenden Anbringen elektrischer Leitungen
US9974187B2 (en) 2013-04-22 2018-05-15 Infineon Technologies Austria Ag Power in lead

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338139B2 (enrdf_load_stackoverflow) * 1973-06-06 1978-10-13
DE2441665B2 (de) * 1974-08-30 1979-03-29 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Elektrisches Verdrahtungssystem für Kraftfahrzeuge in Form einer flexiblen gedruckten Bandleitung
JPS51121772A (en) * 1975-04-18 1976-10-25 Hitachi Ltd Method of soldering wiring
US4015422A (en) * 1975-06-02 1977-04-05 Bulova Watch Company, Inc. Solid-state electronic watch assembly
DE2743647C3 (de) * 1977-09-28 1980-04-10 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Kühlung von Bauelementen der elektrischen Nachrichten- und Meßtechnik
DE7824483U1 (de) * 1978-08-17 1978-11-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrische Baugruppe mit einer gedruckten Leiterfolie
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2470518A1 (fr) * 1979-11-23 1981-05-29 Thomson Csf Procede de connexion, pour le multiplexage de microcircuits electroniques, et tete de lecture-ecriture et panneau d'affichage utilisant ce procede
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards

Also Published As

Publication number Publication date
JPS61148706A (ja) 1986-07-07
CA1260623C (enrdf_load_stackoverflow) 1989-09-26
GB8530396D0 (en) 1986-01-22
CA1237817A (en) 1988-06-07
GB2169750A (en) 1986-07-16
GB2169750B (en) 1989-02-22
DE3545527A1 (de) 1986-07-03

Similar Documents

Publication Publication Date Title
US5998291A (en) Attachment method for assembly of high density multiple interconnect structures
EP0632685B1 (en) Flexible circuit board assembly with common heat spreader and method of manufacture
US5081562A (en) Circuit board with high heat dissipations characteristic
US4766670A (en) Full panel electronic packaging structure and method of making same
US4855867A (en) Full panel electronic packaging structure
KR100576657B1 (ko) 집적회로패키지및이를기판에접속하는방법
US5819401A (en) Metal constrained circuit board side to side interconnection technique
US6603079B2 (en) Printed circuit board electrical interconnects
US5953816A (en) Process of making interposers for land grip arrays
EP0649171A2 (en) Multichip module with a mandrel-produced interconnecting decal
EP2222149A1 (en) Electronic component mounting structure and electronic component mounting method
JPH02152245A (ja) 多数の回路要素を取り付けうる両面回路板
US5008656A (en) Flexible cable assembly
JPH0573235B2 (enrdf_load_stackoverflow)
US20110007482A1 (en) Printed circuit board unit and electronic device
JPH04297043A (ja) 垂直半導体相互接続方法及び構成体
JPH0513504A (ja) 垂直半導体相互接続方法及び構成体
US6691408B2 (en) Printed circuit board electrical interconnects
JPH08191128A (ja) 電子装置
CA1260623A (en) Flexible cable assembly
JP3424685B2 (ja) 電子回路装置とその製造方法
JPS63283136A (ja) 回路基板の実装方法
JP4147436B2 (ja) ヒートシンクを挟んだ基板の接続方法と装置
JP2686829B2 (ja) 混成集積回路
JPH07273463A (ja) Ｉｃ搭載用多層プリント配線板の製造方法