GB1476404A - Electronic apparatus comprising a flexible substrate and method of making such apparatus - Google Patents
Electronic apparatus comprising a flexible substrate and method of making such apparatusInfo
- Publication number
- GB1476404A GB1476404A GB2489674A GB2489674A GB1476404A GB 1476404 A GB1476404 A GB 1476404A GB 2489674 A GB2489674 A GB 2489674A GB 2489674 A GB2489674 A GB 2489674A GB 1476404 A GB1476404 A GB 1476404A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- chips
- display unit
- bearing
- june
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
- H01H13/785—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
- G06F15/0216—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
- G06F15/0225—User interface arrangements, e.g. keyboard, display; Interfaces to other computer systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/026—Material non precious
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/032—Conductive polymer; Rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/004—Printed circuit tail
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/008—Adhesive means; Conductive adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/02—Solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/002—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/034—Positioning of layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/036—Manufacturing ultrasonic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/002—Calculator, computer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2239/00—Miscellaneous
- H01H2239/01—Miscellaneous combined with other elements on the same substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01072—Hafnium [Hf]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Computing Systems (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Calculators And Similar Devices (AREA)
- Structure Of Printed Boards (AREA)
- Input From Keyboards Or The Like (AREA)
Abstract
1476404 Component assemblies SHARP KK 5 June 1974 [6 June 1973] 24896/74 Heading H1R [Also in Division G4] Substrate 14 bearing the printed circuitry, key contacts, i.e. chips 144, 146 and display unit 148 of, e.g. a desk-top calculator is at least in part flexible so as to minimize its space requirements. Setting of the angle of the display unit 148 is also permitted. The i.e. chips may be mounted directly on the substrate by flip-chip or beam-lead bonding, or on a secondary substrate, which may be also be flexible, mounted on the substrate with e.g. solder connections between the circuitry. The chips are preferably encapsulated after mounting. The part of the substrate bearing the key contact areas may be fixed in relation to the casing of the assembly while the part bearing the display unit may be fixed in relation to a hinged lid for the casing (Fig. 3, not shown). The secondary substrate may be detachably secured to the substrate, e.g. by stitching (Fig. 7, not shown) to permit replacement of a defective i.e.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6348273A JPS5338139B2 (en) | 1973-06-06 | 1973-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1476404A true GB1476404A (en) | 1977-06-16 |
Family
ID=13230488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2489674A Expired GB1476404A (en) | 1973-06-06 | 1974-06-05 | Electronic apparatus comprising a flexible substrate and method of making such apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5338139B2 (en) |
CA (1) | CA1021444A (en) |
DE (1) | DE2462358C2 (en) |
GB (1) | GB1476404A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2485321A1 (en) * | 1980-05-19 | 1981-12-24 | Burr Brown Res Corp | ELECTRONIC APPARATUS HOUSING AND METHOD FOR ASSEMBLING SUCH APPARATUS |
GB2128783A (en) * | 1982-10-18 | 1984-05-02 | Grid Systems Corp | Portable computer |
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
DE3545527A1 (en) * | 1984-12-20 | 1986-07-03 | Raytheon Co., Lexington, Mass. | FLEXIBLE ELECTRICAL CONNECTING DEVICE AND METHOD FOR THEIR PRODUCTION |
US5008656A (en) * | 1984-12-20 | 1991-04-16 | Raytheon Company | Flexible cable assembly |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51103264A (en) * | 1975-03-06 | 1976-09-11 | Omron Tateisi Electronics Co | Denshisochino seizohoho |
JPS5725292Y2 (en) * | 1977-10-13 | 1982-06-01 | ||
JPS54101941U (en) * | 1978-04-05 | 1979-07-18 | ||
JPS5741854Y2 (en) * | 1978-04-05 | 1982-09-14 | ||
JPS5658886U (en) * | 1980-09-03 | 1981-05-20 | ||
JPS5760231U (en) * | 1980-09-27 | 1982-04-09 | ||
JPS605373A (en) * | 1984-04-25 | 1985-01-11 | Casio Comput Co Ltd | Small-sized electronic equipment |
JPS6199247U (en) * | 1984-11-30 | 1986-06-25 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1048021A (en) * | 1963-02-04 | 1966-11-09 | Nigel Archibald Walter | Electrical circuit arrangements |
-
1973
- 1973-06-06 JP JP6348273A patent/JPS5338139B2/ja not_active Expired
-
1974
- 1974-06-04 CA CA201,557A patent/CA1021444A/en not_active Expired
- 1974-06-05 GB GB2489674A patent/GB1476404A/en not_active Expired
- 1974-06-06 DE DE2462358A patent/DE2462358C2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2485321A1 (en) * | 1980-05-19 | 1981-12-24 | Burr Brown Res Corp | ELECTRONIC APPARATUS HOUSING AND METHOD FOR ASSEMBLING SUCH APPARATUS |
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
GB2128783A (en) * | 1982-10-18 | 1984-05-02 | Grid Systems Corp | Portable computer |
DE3545527A1 (en) * | 1984-12-20 | 1986-07-03 | Raytheon Co., Lexington, Mass. | FLEXIBLE ELECTRICAL CONNECTING DEVICE AND METHOD FOR THEIR PRODUCTION |
GB2169750A (en) * | 1984-12-20 | 1986-07-16 | Raytheon Co | Flexible cable assembly |
US5008656A (en) * | 1984-12-20 | 1991-04-16 | Raytheon Company | Flexible cable assembly |
Also Published As
Publication number | Publication date |
---|---|
DE2462358A1 (en) | 1976-11-25 |
DE2427335A1 (en) | 1975-01-02 |
JPS5338139B2 (en) | 1978-10-13 |
CA1021444A (en) | 1977-11-22 |
JPS5014248A (en) | 1975-02-14 |
DE2462358C2 (en) | 1984-04-19 |
DE2427335B2 (en) | 1977-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19940604 |