DE3510243A1 - Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten - Google Patents

Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten

Info

Publication number
DE3510243A1
DE3510243A1 DE19853510243 DE3510243A DE3510243A1 DE 3510243 A1 DE3510243 A1 DE 3510243A1 DE 19853510243 DE19853510243 DE 19853510243 DE 3510243 A DE3510243 A DE 3510243A DE 3510243 A1 DE3510243 A1 DE 3510243A1
Authority
DE
Germany
Prior art keywords
soldering
solder wire
tip
printed
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853510243
Other languages
German (de)
English (en)
Other versions
DE3510243C2 (enrdf_load_stackoverflow
Inventor
Dietgard 8930 Schwabmünchen Rödiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19853510243 priority Critical patent/DE3510243A1/de
Publication of DE3510243A1 publication Critical patent/DE3510243A1/de
Application granted granted Critical
Publication of DE3510243C2 publication Critical patent/DE3510243C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19853510243 1985-03-21 1985-03-21 Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten Granted DE3510243A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853510243 DE3510243A1 (de) 1985-03-21 1985-03-21 Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853510243 DE3510243A1 (de) 1985-03-21 1985-03-21 Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten

Publications (2)

Publication Number Publication Date
DE3510243A1 true DE3510243A1 (de) 1986-10-02
DE3510243C2 DE3510243C2 (enrdf_load_stackoverflow) 1987-06-25

Family

ID=6265917

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853510243 Granted DE3510243A1 (de) 1985-03-21 1985-03-21 Verfahren und anordnung zur getakteten loetung von einzelanschluessen bei leiterplatten

Country Status (1)

Country Link
DE (1) DE3510243A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4122327A1 (de) * 1991-07-05 1993-01-07 Mhm Hess & Tischler Gmbh Monta Verfahren und anlage zum automatischen bestuecken und loeten von leiterplatten

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH430388A (de) * 1965-10-30 1967-02-15 Kuster Ernst Hilfsgerät zum Weichlöten

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH430388A (de) * 1965-10-30 1967-02-15 Kuster Ernst Hilfsgerät zum Weichlöten

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z: Elektronik Produktion & Prüftechnik, Mai 1982, S. 360, "Lötgeräte und -Maschinen" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4122327A1 (de) * 1991-07-05 1993-01-07 Mhm Hess & Tischler Gmbh Monta Verfahren und anlage zum automatischen bestuecken und loeten von leiterplatten

Also Published As

Publication number Publication date
DE3510243C2 (enrdf_load_stackoverflow) 1987-06-25

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8381 Inventor (new situation)

Free format text: ROEDIGER, DIETHARD, 8930 SCHWABMUENCHEN, DE

8339 Ceased/non-payment of the annual fee