DE3401984A1 - Verkapselte integrierte schaltung - Google Patents

Verkapselte integrierte schaltung

Info

Publication number
DE3401984A1
DE3401984A1 DE19843401984 DE3401984A DE3401984A1 DE 3401984 A1 DE3401984 A1 DE 3401984A1 DE 19843401984 DE19843401984 DE 19843401984 DE 3401984 A DE3401984 A DE 3401984A DE 3401984 A1 DE3401984 A1 DE 3401984A1
Authority
DE
Germany
Prior art keywords
integrated circuit
cap
encapsulated integrated
thermal expansion
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19843401984
Other languages
German (de)
English (en)
Inventor
Hiroaki Ibaraki Doi
Fumiyuki Sagamihara Kobayashi
Hironori Kodama
Satoru Ogihara
Kastuhiro Hitachi Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3401984A1 publication Critical patent/DE3401984A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19843401984 1983-01-21 1984-01-20 Verkapselte integrierte schaltung Ceased DE3401984A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58007306A JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ

Publications (1)

Publication Number Publication Date
DE3401984A1 true DE3401984A1 (de) 1984-07-26

Family

ID=11662323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843401984 Ceased DE3401984A1 (de) 1983-01-21 1984-01-20 Verkapselte integrierte schaltung

Country Status (3)

Country Link
JP (1) JPS59134852A (https=)
DE (1) DE3401984A1 (https=)
GB (1) GB2135513B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
EP0211618A3 (en) * 1985-08-05 1987-12-16 Hitachi, Ltd. Integrated circuit package
DE4213251A1 (de) * 1991-04-23 1992-10-29 Mitsubishi Electric Corp Halbleiterbaustein und verfahren zu dessen herstellung sowie behaelter zur ummantelung eines halbleiterelements

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247153A (ja) * 1985-08-27 1987-02-28 Ibiden Co Ltd 半導体装置
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JP2572823B2 (ja) * 1988-09-22 1997-01-16 日本碍子株式会社 セラミック接合体
JPH03194952A (ja) * 1989-12-22 1991-08-26 Nec Corp セラミックパッケージ
JP6829153B2 (ja) * 2017-06-07 2021-02-10 京セラ株式会社 セラミック板、半導体装置および半導体モジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
US4157611A (en) * 1976-03-26 1979-06-12 Hitachi, Ltd. Packaging structure for semiconductor IC chip and method of packaging the same
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat
EP0028802A1 (en) * 1979-11-05 1981-05-20 Hitachi, Ltd. Electrically insulating substrate and a method of making such a substrate
US4352120A (en) * 1979-04-25 1982-09-28 Hitachi, Ltd. Semiconductor device using SiC as supporter of a semiconductor element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954418A (https=) * 1972-09-27 1974-05-27
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
US4157611A (en) * 1976-03-26 1979-06-12 Hitachi, Ltd. Packaging structure for semiconductor IC chip and method of packaging the same
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat
US4352120A (en) * 1979-04-25 1982-09-28 Hitachi, Ltd. Semiconductor device using SiC as supporter of a semiconductor element
EP0028802A1 (en) * 1979-11-05 1981-05-20 Hitachi, Ltd. Electrically insulating substrate and a method of making such a substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Solid State Techn. Bd. 14, H1(1971), S. 240-48 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
EP0211618A3 (en) * 1985-08-05 1987-12-16 Hitachi, Ltd. Integrated circuit package
DE4213251A1 (de) * 1991-04-23 1992-10-29 Mitsubishi Electric Corp Halbleiterbaustein und verfahren zu dessen herstellung sowie behaelter zur ummantelung eines halbleiterelements

Also Published As

Publication number Publication date
GB8401603D0 (en) 1984-02-22
GB2135513B (en) 1987-08-19
JPH0117258B2 (https=) 1989-03-29
GB2135513A (en) 1984-08-30
JPS59134852A (ja) 1984-08-02

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection