DE3303435C2 - Vorrichtung zur Abscheidung einer Schicht aus amorphem Silizium - Google Patents
Vorrichtung zur Abscheidung einer Schicht aus amorphem SiliziumInfo
- Publication number
- DE3303435C2 DE3303435C2 DE3303435A DE3303435A DE3303435C2 DE 3303435 C2 DE3303435 C2 DE 3303435C2 DE 3303435 A DE3303435 A DE 3303435A DE 3303435 A DE3303435 A DE 3303435A DE 3303435 C2 DE3303435 C2 DE 3303435C2
- Authority
- DE
- Germany
- Prior art keywords
- housing
- layer
- conveyor
- gas
- coating chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5093—Coaxial electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Photoreceptors In Electrophotography (AREA)
Abstract
Description
Anschließend wird von der Stromquelle 74 her eine vorgegebene Spannung zwischen erste und zweite Gaseinlaßteile 48 bzw. 50 sowie die Träger 42 angelegt, um eine Glimmentladung herbeizuführen und dabei das gasförmige SiH< zu aktivieren und zu ionisieren. Hierbei lagert sich Si (Silizium) unter Bildung einer amorphen Siliziumschicht auf der äußeren Mantelfläche jedes Trägers 42 ab. Dies bedeutet, daß auf der Mantelfläche jedes Trägers eine a-Si-Schicht als lichtempfindliche Schicht abgeschieden wird. Die Entladung wird fortgesetzt, bis die a-Si-Schicht eine vorbestimmte Dicke erreicht hat. Da sich die Träger 42 hierbei sowohl in Drehung als auch in Umalufbewegung befinden, kann die abgeschiedene a-Si-Schicht sowohl auf jedem einzelnen Träger 42 als auch zwischen allen sechzehn Trägern 42 untereinander mit gleichmäßiger Dicke ausgebildet werden.
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57015877A JPS58132756A (ja) | 1982-02-03 | 1982-02-03 | アモルフアス・シリコン感光体製造方法とその製造装置 |
JP57015871A JPS58132755A (ja) | 1982-02-03 | 1982-02-03 | アモルフアス・シリコン感光体製造方法及びその製造装置 |
JP57015870A JPS58132754A (ja) | 1982-02-03 | 1982-02-03 | アモルフアス・シリコン感光体製造方法及びその製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3303435A1 DE3303435A1 (de) | 1983-08-11 |
DE3303435C2 true DE3303435C2 (de) | 1988-08-18 |
Family
ID=27281171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3303435A Expired DE3303435C2 (de) | 1982-02-03 | 1983-02-02 | Vorrichtung zur Abscheidung einer Schicht aus amorphem Silizium |
Country Status (3)
Country | Link |
---|---|
US (1) | US4501766A (de) |
DE (1) | DE3303435C2 (de) |
GB (1) | GB2114160B (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58197262A (ja) * | 1982-05-13 | 1983-11-16 | Canon Inc | 量産型真空成膜装置及び真空成膜法 |
AU548915B2 (en) * | 1983-02-25 | 1986-01-09 | Toyota Jidosha Kabushiki Kaisha | Plasma treatment |
JPS59193265A (ja) * | 1983-03-14 | 1984-11-01 | Stanley Electric Co Ltd | プラズマcvd装置 |
JPS6010618A (ja) * | 1983-06-30 | 1985-01-19 | Canon Inc | プラズマcvd装置 |
JPS6063375A (ja) * | 1983-09-14 | 1985-04-11 | Canon Inc | 気相法堆積膜製造装置 |
JPS6063376A (ja) * | 1983-09-14 | 1985-04-11 | Canon Inc | 気相法堆積膜製造装置 |
JPS6063374A (ja) * | 1983-09-14 | 1985-04-11 | Canon Inc | 気相法堆積膜製造装置 |
JPS60114570A (ja) * | 1983-11-25 | 1985-06-21 | Canon Inc | プラズマcvd装置の排気系 |
US4607593A (en) * | 1983-12-23 | 1986-08-26 | U.S. Philips Corporation | Apparatus for processing articles in a controlled environment |
US6784033B1 (en) | 1984-02-15 | 2004-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for the manufacture of an insulated gate field effect semiconductor device |
JPS61110768A (ja) * | 1984-11-05 | 1986-05-29 | Sharp Corp | アモルフアスシリコン感光体製造用装置 |
US6786997B1 (en) | 1984-11-26 | 2004-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Plasma processing apparatus |
JPH0752718B2 (ja) | 1984-11-26 | 1995-06-05 | 株式会社半導体エネルギー研究所 | 薄膜形成方法 |
DE3666111D1 (en) * | 1985-03-15 | 1989-11-09 | Denton Vacuum Inc | External plasma gun |
US4798166A (en) * | 1985-12-20 | 1989-01-17 | Canon Kabushiki Kaisha | Apparatus for continuously preparing a light receiving element for use in photoelectromotive force member or image-reading photosensor |
US5366554A (en) * | 1986-01-14 | 1994-11-22 | Canon Kabushiki Kaisha | Device for forming a deposited film |
JP2582553B2 (ja) * | 1986-07-04 | 1997-02-19 | キヤノン株式会社 | プラズマcvd法による機能性堆積膜形成装置 |
US4733631B1 (en) * | 1986-09-30 | 1993-03-09 | Apparatus for coating substrate devices | |
US4834023A (en) * | 1986-12-19 | 1989-05-30 | Canon Kabushiki Kaisha | Apparatus for forming deposited film |
US4947085A (en) * | 1987-03-27 | 1990-08-07 | Mitsubishi Denki Kabushiki Kaisha | Plasma processor |
JPS63262472A (ja) * | 1987-04-20 | 1988-10-28 | Sanyo Electric Co Ltd | 膜形成方法 |
DE3827343A1 (de) * | 1988-08-12 | 1990-02-15 | Leybold Ag | Vorrichtung nach dem karussel-prinzip zum beschichten von substraten |
US5169478A (en) * | 1987-10-08 | 1992-12-08 | Friendtech Laboratory, Ltd. | Apparatus for manufacturing semiconductor devices |
GB2213835B (en) * | 1987-12-18 | 1992-07-08 | Gen Electric Co Plc | Deposition apparatus |
JPH0642474B2 (ja) * | 1988-03-31 | 1994-06-01 | 株式会社東芝 | 半導体製造装置 |
USRE36328E (en) * | 1988-03-31 | 1999-10-05 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus including temperature control mechanism |
DE4005956C1 (de) * | 1990-02-26 | 1991-06-06 | Siegfried Dipl.-Ing. Dr. 5135 Selfkant De Straemke | |
US5127365A (en) * | 1990-02-27 | 1992-07-07 | Kabushiki Kaisha Toshiba | Vertical heat-treatment apparatus for semiconductor parts |
IL107827A0 (en) * | 1992-12-08 | 1994-04-12 | Hughes Aircraft Co | Plasma pressure control assembly |
DE4301188C2 (de) * | 1993-01-19 | 2001-05-31 | Leybold Ag | Vorrichtung zum Beschichten oder Ätzen von Substraten |
KR0131987B1 (ko) * | 1994-08-17 | 1998-04-18 | 김은영 | 고주파 플라즈마 화학 증착법을 이용한 원형 기판용 코팅층의 대량합성장치 및 합성방법 |
US5660639A (en) * | 1995-10-17 | 1997-08-26 | Ford Motor Company | Method and apparatus for plasma treating an article |
IT1297339B1 (it) * | 1997-12-23 | 1999-09-01 | Cselt Centro Studi Lab Telecom | Reattore per deposizione chimica in fase vapore |
JP3745095B2 (ja) * | 1997-09-24 | 2006-02-15 | キヤノン株式会社 | 堆積膜形成装置および堆積膜形成方法 |
ES2188006T3 (es) | 1997-09-29 | 2003-06-16 | Unaxis Trading Ag | Instalacion de recubrimiento a vacio y disposicion de acoplamiento y procedimiento para la fabricacion de piezas de trabajo. |
CN1233018C (zh) * | 2000-02-11 | 2005-12-21 | 陶氏康宁爱尔兰有限公司 | 常压等离子体系统 |
KR100455426B1 (ko) * | 2002-03-29 | 2004-11-06 | 주식회사 엘지이아이 | 열교환기 연속 표면처리장비의 2열처리구조 |
KR100486692B1 (ko) * | 2002-03-29 | 2005-05-03 | 주식회사 엘지이아이 | 연속처리가 가능한 열교환기 표면처리장치 |
CN100439563C (zh) * | 2005-06-06 | 2008-12-03 | 贵研铂业股份有限公司 | 化学气相沉积设备 |
KR100790729B1 (ko) * | 2006-12-11 | 2008-01-02 | 삼성전기주식회사 | 화학 기상 증착 장치 |
US8501273B2 (en) * | 2008-10-02 | 2013-08-06 | Rolls-Royce Corporation | Mixture and technique for coating an internal surface of an article |
US9624583B2 (en) * | 2009-04-01 | 2017-04-18 | Rolls-Royce Corporation | Slurry-based coating techniques for smoothing surface imperfections |
FI124414B (fi) * | 2010-04-30 | 2014-08-29 | Beneq Oy | Lähde ja järjestely substraatin käsittelemiseksi |
KR102385718B1 (ko) * | 2010-12-29 | 2022-04-12 | 에바텍 아크티엔게젤샤프트 | 진공 처리 장치 및 이의 제조 방법 |
DE102012104475A1 (de) * | 2012-05-24 | 2013-11-28 | Aixtron Se | Carousel-Reactor |
EP2970031B1 (de) | 2013-03-15 | 2020-09-23 | Rolls-Royce Corporation | Wiederherstellung einer auf suspension basierenden beschichtung |
CN105063550B (zh) * | 2015-08-20 | 2017-11-28 | 包头天和磁材技术有限责任公司 | 渗透装置及方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2995463A (en) * | 1957-10-28 | 1961-08-08 | Westinghouse Electric Corp | Envelope coating method and apparatus |
US3608519A (en) * | 1968-12-31 | 1971-09-28 | Texas Instruments Inc | Deposition reactor |
US3603284A (en) * | 1970-01-02 | 1971-09-07 | Ibm | Vapor deposition apparatus |
US3865072A (en) * | 1973-10-18 | 1975-02-11 | Hls Ind | Apparatus for chemically depositing epitaxial layers on semiconductor substrates |
FR2371524A1 (fr) * | 1976-11-18 | 1978-06-16 | Alsthom Atlantique | Procede de depot d'une couche mince par decomposition d'un gaz dans un plasma |
DE2746967C2 (de) * | 1977-10-19 | 1981-09-24 | Siemens AG, 1000 Berlin und 8000 München | Elektrofotographische Aufzeichnungstrommel |
JPS6035059B2 (ja) * | 1977-12-22 | 1985-08-12 | キヤノン株式会社 | 電子写真感光体およびその製造方法 |
JPS5499441A (en) * | 1978-01-23 | 1979-08-06 | Canon Inc | Production of electrophotographic photoreceptor |
GB2010676B (en) * | 1977-12-27 | 1982-05-19 | Alza Corp | Diffusional drug delivery device with block copolymer as drug carrier |
JPS5591968A (en) * | 1978-12-28 | 1980-07-11 | Canon Inc | Film forming method by glow discharge |
CA1159012A (en) | 1980-05-02 | 1983-12-20 | Seitaro Matsuo | Plasma deposition apparatus |
EP0060651B1 (de) * | 1981-03-16 | 1986-07-30 | Energy Conversion Devices, Inc. | Vorrichtung mit einer Kathode zum kontinuierlichen Niederschlagen eines amorphen Materials |
-
1983
- 1983-01-11 US US06/457,231 patent/US4501766A/en not_active Expired - Lifetime
- 1983-01-14 GB GB08300948A patent/GB2114160B/en not_active Expired
- 1983-02-02 DE DE3303435A patent/DE3303435C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8300948D0 (en) | 1983-02-16 |
DE3303435A1 (de) | 1983-08-11 |
US4501766A (en) | 1985-02-26 |
GB2114160A (en) | 1983-08-17 |
GB2114160B (en) | 1986-03-26 |
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